Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters

Copper (Cu) wire bonding has become a mainstream IC assembly solution due to its significant cost savings over gold wire. However, concerns on corrosion susceptibility and package reliability have driven the industry to develop alternative materials. In recent years, palladium-coated copper (PdCu) wire has become widely used as it is believed to improve reliability. In this paper, we experimented with 0.6 ml PdCu and bare Cu wires. Palladium distribution and grain structure of the PdCu Free Air Ball (FAB) were investigated. It was observed that Electronic Flame Off (EFO) current and the cover gas type have a significant effect on palladium distribution in the FAB. The FAB hardness was measured and correlated to palladium distribution and grain structure. First bond process responses were characterized. The impact of palladium on wire bondability and wire bond intermetallic using a high temperature storage test was studied.     

拉拔成型无氧铜管在爆轰加载下的膨胀及断裂特性研究

为了探索拉拔成型无氧铜管是否满足标准圆筒试验的延展性要求,采用未经二次锻造的粗晶软态无氧铜,通过拉拔成型工艺加工成25 mm圆筒试验用的标准铜管。采用超高速分幅相机及扫描相机分别观测装填TNT炸药及JO-159炸药条件下的铜管膨胀及断裂过程,对比典型高应变率范围内铜管的断裂应变、裂纹扩展方向等差异,并分析铜管应变能对炸药驱动性能表征参数的影响。结果表明：TNT炸药爆轰加载下,铜管裂纹主要沿母线形成及扩展,其破片主要呈条状;而JO-159炸药爆轰加载下,铜管环向应变率及轴向应变率分别约为TNT炸药加载工况的1.34倍和2倍, 其断裂带易出现较为复杂的交错状态,形成密集小破片;这两种炸药爆轰下,该铜管的断裂直径均达到了初始直径的3倍,且表征炸药驱动性能的格尼速度未发生明显变化,因此可以满足一般高能炸药圆筒试验的要求。     

Cu/Al复合材料的制备及其对RDX热分解性能的影响

为了改善铝粉的表面氧化,提高其对含能材料热分解的催化作用,以电爆炸铝粉和二水合氯化铜(CuCl_2·2H_2O)为原料,利用置换反应法,实现了纳米铜粒子在铝粉表面的快速沉积,制备了包覆均匀的Cu/Al复合材料。利用扫描电镜(SEM)、透射电镜(TEM)、X?射线粉末衍射(XRD)、电子能谱(EDS)等对其结构和形貌进行了表征。在不同的升温速率下测试了Cu/Al复合材料与黑索今(RDX)(质量比1∶5)混合物的DSC曲线。计算了该混合物热分解反应的动力学参数。结果表明,电爆炸铝粉表面的氧化层通过氟化铵的刻蚀作用被剥离,复合材料含有单质铝和单质铜晶相,无氧化铜及氧化铝晶相,纳米级铜颗粒均匀包覆在铝粉表面,复合材料粒径为200～500 nm。加入Cu/Al复合材料后,RDX的初始分解温度和分解峰温分别降低8.51℃和26.43℃,分解热提高296 J·g~(-1),热分解活化能降低19.19 kJ·mol~(-1),表明Cu/Al复合材料可促进RDX的热分解行为。     

ULSI多层互连中的化学机械抛光工艺

介绍了化学机械抛光(CMP)技术在大规模集成电路多层互连工艺[1]中的重要作用,对CMP过程和CMP的影响因素进行简单分析。总结出CMP技术在多层互联平坦化中的优势,介绍目前常用互连材料中SiO2介质及其金属材料钨和铜的化学机械抛光常用分析机理,并简单介绍了各种互联材料常用的抛光液及抛光液的组分,对抛光液作了简单的对比。针对传统CMP过程存在的问题,分析了皮带式和固定磨料的CMP技术。     

TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology

The present status of work on diffussion barriers for copper in multilevel interconnects is surveyed briefly, with particular emphasis on TiN and TaN, and silicon dioxide as the interlayer dielectric. New results are presented for these materials, combining thermal annealing and bias temperature stress testing. With both stress methods, various testing conditions are compared using capacitance-vs-voltage (C-V) and leakage current-vs-voltage (I-V) measurements to characterize the stressed samples. From an evaluation of these data and a comparison with other testing approaches, conditions for a consistent testing methodology of barrier reliability are outlined.     

碱性铜粗抛液中氧化剂对化学机械平坦化的影响

针对不合腐蚀抑制剂苯并三氮唑(BTA)的碱性铜粗抛液,通过对3英寸(1英寸=2.54 cm)铜片上的动态抛光速率和静态腐蚀速率的研究来模拟评估氧化剂对晶圆表面平坦化的影响.在12英寸铜镀膜片和TM1图形片上分别研究氧化剂体积分数对表面平坦化的影响.实验结果表明:动态抛光速率和静态腐蚀速率均随着氧化剂体积分数的增加先逐渐增大,达到最大值,然后下降,趋于平缓.片内非均匀性和剩余高低差均随H2O2体积分数的增加,先呈下降趋势,后缓慢上升.当氧化剂体积分数为3％时,动态去除速率(vRR)为398.988 nm/min,静态腐蚀速率vER为6.834 nm/min,vRR/vER比值最大,片内非均匀性最小为3.82％,台阶高低差最小为104.6 nm/min,此时晶圆片有较好的平坦化效果.     

电路板嵌入元器件有机模块技术的开发

为了提高电子组装密度,基板嵌入元器件的三维安装模式受到人们更多的关注.介绍了一种以铜芯为基板核心材料的元器件嵌入技术(EOMIN),详细叙述了其外形结构和制造工艺,并通过实验与FR-4基板嵌入元器件和低温共烧陶瓷基板(LTCC)安装元器件进行比较,通过实验数据对比得出EOMIN元器件嵌入技术具有导热性能好,抗疲劳性强,承受热冲击时铜的塑性变形量小,连接可靠性高等优良特性的结论.     

改善PCB镀铜均镀性

该文阐述了改善PCB镀铜均镀性的基本方法。     

Copper‐Based Nanostructured Coatings on Natural Cellulose: Nanocomposites Exhibiting Rapid and Efficient Inhibition of a Multi‐Drug Resistant Wound Pathogen,A. baumannii,and Mammalian Cell Biocompatibility In Vitro

This paper describes a layer‐by‐layer (LBL) electrostatic self‐assembly process for fabricating highly efficient antimicrobial nanocoatings on a natural cellulose substrate. The composite materials comprise a chemically modified cotton substrate and a layer of sub‐5 nm copper‐based nanoparticles. The LBL process involves a chemical preconditioning step to impart high negative surface charge on the cotton substrate for chelation controlled binding of cupric ions (Cu²⁺), followed by chemical reduction to yield nanostructured coatings on cotton fibers. These model wound dressings exhibit rapid and efficient killing of a multidrug resistant bacterial wound pathogen, A. baumannii, where an 8‐log reduction in bacterial growth can be achieved in as little as 10 min of contact. Comparative silver‐based nanocoated wound dressings–a more conventional antimicrobial composite material–exhibit much lower antimicrobial efficiencies; a 5‐log reduction in A. baumannii growth is possible after 24 h exposure times to silver nanoparticle‐coated cotton substrates. The copper nanoparticle–cotton composites described herein also resist leaching of copper species in the presence of buffer, and exhibit an order of magnitude higher killing efficiency using 20 times less total metal when compared to tests using soluble Cu²⁺. Together these data suggest that copper‐based nanoparticle‐coated cotton materials have facile antimicrobial properties in the presence of A. baumannii through a process that may be associated with contact killing, and not simply due to enhanced release of metal ion. The biocompatibility of these copper‐cotton composites toward embryonic fibroblast stem cells in vitro suggests their potential as a new paradigm in metal‐based wound care and combating pathogenic bacterial infections.