全文获取类型
收费全文 | 93篇 |
免费 | 0篇 |
国内免费 | 3篇 |
专业分类
电工技术 | 1篇 |
综合类 | 4篇 |
化学工业 | 23篇 |
金属工艺 | 10篇 |
机械仪表 | 1篇 |
建筑科学 | 3篇 |
矿业工程 | 12篇 |
能源动力 | 4篇 |
轻工业 | 6篇 |
石油天然气 | 6篇 |
无线电 | 2篇 |
一般工业技术 | 7篇 |
冶金工业 | 16篇 |
原子能技术 | 1篇 |
出版年
2023年 | 1篇 |
2022年 | 1篇 |
2020年 | 2篇 |
2019年 | 1篇 |
2018年 | 2篇 |
2017年 | 1篇 |
2014年 | 4篇 |
2013年 | 2篇 |
2012年 | 1篇 |
2011年 | 1篇 |
2010年 | 5篇 |
2009年 | 6篇 |
2008年 | 3篇 |
2007年 | 5篇 |
2006年 | 1篇 |
2005年 | 4篇 |
2004年 | 5篇 |
2003年 | 8篇 |
2002年 | 5篇 |
2001年 | 6篇 |
2000年 | 4篇 |
1999年 | 4篇 |
1998年 | 6篇 |
1997年 | 2篇 |
1995年 | 5篇 |
1994年 | 4篇 |
1993年 | 2篇 |
1991年 | 2篇 |
1989年 | 2篇 |
1987年 | 1篇 |
排序方式: 共有96条查询结果,搜索用时 0 毫秒
81.
Mg-Ca合金表面氧化行为的研究 总被引:4,自引:2,他引:4
研究了几种不同Ca含量的Mg Ca二元合金表面氧化程度及其氧化膜形貌。合金表面氧化膜的XRD ,SEM ,TEM及其电子探针分析表明 ,Ca元素的加入可有效地减少镁合金熔体表面的氧化 ,且随着Ca含量的增加 ,氧化程度减弱 ,表面品质变好。含Ca镁合金熔体氧化膜由外到内分为MgO层、CaO层和MgO·CaO层。还从热力学角度探讨了Ca元素的阻燃机理。 相似文献
82.
All-wet processes are gaining a renewed interest for the removal of post-etch photoresist (PR) in the back-end-of-line (BEOL) semiconductor manufacturing. However, degradation of DUV-PR by etch plasmas results in a modified top layer of the PR that is cross-linked (so-called crust) and therefore not soluble anymore using pure organic solvents. This study investigates the modification of 193 nm post-etch PR by UV irradiation with different wavelengths. UV irradiation showed to be an interesting process to increase CC bond concentration in post-etch PR, which was used as an intermediate step to enhance PR wet strip using ozonated DI water. Treatment of post-etch PR by 222 or 283 nm led to the largest increase in CC bonds. The combination of UV with ozonated DI water is a promising process sequence for PR and BARC strip in BEOL applications. 相似文献
83.
Sergiu Coseri 《Catalysis Reviews》2013,55(2):218-292
The last two decades represents a “start line” for the worldwide chemists, to develop new oxidizing methods, to replace the “old‐fashioned” ones, which are expensive, pollute the environment, and proceed in harsh conditions. One of the best candidates to satisfy the present global needs is N‐hydroxyphthalimide (NHPI), which can be used as a catalytic reagent successfully in a wide range of organic transformations. In this article, a review of the most frequently used methods to transform the NHPI into its nitroxyl radical correspondent, and the use of this powerful catalytic agent into various organic transformations, are presented. 相似文献
84.
We investigated and compared the effects of foliar sprays of electrolytically ozonated water (OW) and acidic electrolyzed oxidizing water (AEOW) on severity of powdery mildew infection (PMI) and occurrence of visible physiological disorder on cucumber leaves. Foliar spray of OW contained severity of PMI to almost the same level as the initial value, without any visible physiological disorder. Although severity of PMI on AEOW-sprayed leaves was significantly lower than on OW-sprayed leaves, the leaves showed a visible physiological disorder after the first spray. These results indicate that OW is a viable option for controlling PMI on cucumber leaves at low initial severity levels, or for prevention of PMI, and that AEOW can be used for controlling PMI with special efforts taken against a visible physiological disorder. 相似文献
85.
86.
87.
88.
89.
苛化泥为焙烧添加剂从石煤提取五氧化二钒 总被引:10,自引:1,他引:9
从石煤中提取五氧化二钡时,用苛化泥作焙烧添加剂,以取代氯化钠。焙烧后的物料先用水水浸,再用碳酸氢铵并通入二氧化碳中加压浸出。浸出液经离子交换法净化,再经沉钒和灼烧,得到合格的五氧化二钒产品。 相似文献
90.
N. Posseme M. Darnon O. Louveau D. Jalabert M. Fayolle 《Microelectronic Engineering》2008,85(8):1842-1849
This work focuses on the efficiency of reducing and oxidizing plasma chemistries in preventing metallic barrier diffusion into porous dielectric materials (SiOCH with a k value close to 2.2, porosity content around 40%). The ash processes have been performed on SiOCH coated blanket and patterned wafers in either reactive ion etching (RIE) or downstream (DS) reactors. The Rutherford backscattering spectroscopy technique (RBS) has shown that titanium based compounds diffuse into the blanket porous SiOCH without treatment during a typical TiN barrier deposition process by chemical vapor deposition (CVD). The metallic barrier diffusion is strongly limited on blanket wafers when the porous SiOCH has been previously modified (partially or fully) by ash plasmas (RIE-O2, RIE-NH3, DS-H2/N2 and DS-O2/N2) while the metallic barrier diffusion occurs with no modifying ash plasmas (DS-H2/He). We have shown that ellipsometric porosimetry (EP) measurements clearly point out that no complete pore sealing is achieved with all the investigated ash plasmas. Energy-filtering transmission electron microscopy experiments (EFTEM) performed on single damascene structures have revealed significant titanium diffusion into the porous dielectric lines for DS-H2/He and RIE-O2 and sidewalls modification of the porous SiOCH lines (lower C/O ratio) for all the ash plasmas. The RC product (resistance × capacitance) have been extracted from the single damascene structures and the evolution of RC product will be discussed in terms of lines modification (titanium diffusion and porous SiOCH modification). 相似文献