氨硼烷同分异构体H_2B(NH_3)_2BH_4的制备

本文以NaBH_4为硼源、氨基络合物为氨源制备出了能缩短氨硼烷热分解放氢诱导期的氨硼烷同分异构体H_2B(NH_3)_2BH_4。研究了反应温度、时间和溶剂等因素对H_2B(NH_3)_2BH_4产率的影响。实验结果表明:在温度为25℃,物质的量Cu(NH_3)_6Cl_2∶NaBH_4=1∶2,反应时间为10h的条件下,制得的H_2B(NH_3)_2BH_4产率高达74%。XRD检测到反应产物中有金属Cu,经超景深显微镜观测,其粒径大小约为20μm。     

Cu/Al_2O_3复合薄膜的制备及其抗氧化性能

本文在纺织纤维基材表面采用二次溅射沉积法制备了Cu/Al_2O_3复合薄膜,利用扫描电镜(SEM)、X射线能谱仪(EDX)和矢量网络分析仪对室温环境下存放3600h的复合薄膜的表面形貌、元素含量以及屏蔽效能进行了测试,并与相同工艺条件下制备的纯Cu薄膜进行了对比分析。结果表明:与纯Cu薄膜结构的不稳定性相比,由于复合薄膜表层Al_2O_3薄膜的结构稳定性和致密性,Cu/Al_2O_3复合薄膜在保证高屏蔽性能的前提下,具有整体结构的稳定性,表现出了良好的抗氧化性能。     

超重力场凝固对Cu-1.6%Cr共晶合金组织的影响

本实验分别在普通重力场和4230g超重力场下制备了Cu_(98.4)Cr_(1.6)合金的凝固样品,研究了重力场对Cu_(98.4)Cr_(1.6)合金棒状共晶尺寸和宏观偏析情况的影响。结果表明:与普通重力场的凝固组织相比,当Cu_(98.4)Cr_(1.6)合金棒状共晶在4230g超重力场下凝固时,棒状共晶组织得到了明显的细化,其直径由250~350nm降至100~200nm。同时,Cu_(98.4)Cr_(1.6)共晶合金沿超重力场方向的硬度和成分分布基本一致,未出现明显的宏观偏析。     

Effects of Cu on Microstructures,Mechanical, and Magnetic Properties of Fe–Ni–P Alloys Fabricated by Liquid Phase Sintering

The Fe–Ni–P–Cu alloys with different copper content (0, 0.5, 1, and 2 wt%) are fabricated by liquid phase sintering (LPS) at 950 °C. The nano‐Cu powder is mechanically mixed for 90 min with Fe–Ni–P composite powder using the ethanol as the medium. The microstructure, microhardness and compressive properties of Fe–Ni–P–Cu alloys are investigated. The results indicate that the copper is beneficial to improve the mechanical properties of sintered specimens. The sample contains a small amount of γ‐(Fe, Ni) phase when the copper content is 1 wt%, which results in its the highest compressive yield strength (948.1 MPa). The highest microhardness of 371 HV is accessible in Fe–Ni–P–Cu alloy with 2 wt% Cu. The fracture surface analysis indicates that sintered specimens with Cu addition exhibit a typical intergranular mode.     

Refractive indices of layers and optical simulations of Cu(In,Ga)Se2 solar cells

Cu(In,Ga)Se₂-based solar cells have reached efficiencies close to 23%. Further knowledge-driven improvements require accurate determination of the material properties. Here, we present refractive indices for all layers in Cu(In,Ga)Se₂ solar cells with high efficiency. The optical bandgap of Cu(In,Ga)Se₂ does not depend on the Cu content in the explored composition range, while the absorption coefficient value is primarily determined by the Cu content. An expression for the absorption spectrum is proposed, with Ga and Cu compositions as parameters. This set of parameters allows accurate device simulations to understand remaining absorption and carrier collection losses and develop strategies to improve performances.     

Effect of Cu addition on microstructures and tensile properties of high-pressure die-casting Al-5.5Mg-0.7Mn alloy

In this study, Cu was added into the high-pressure die-casting Al-5.5Mg-0.7Mn (wt%) alloy to improve the tensile properties. The effects of Cu addition on the microstructures, mechanical properties of the Al-5.5Mg-0.7Mn alloys under both as-cast and T5 treatment conditions have been investigated. Additions of 0.5 wt%, 0.8 wt% and 1.5 wt% Cu can lead to the formation of irregular-shaped Al₂CuMg particles distributed along the grain boundaries in the as-cast alloys. Furthermore, the rest of Cu can dissolve into the matrixes. The lath-shaped Al₂CuMg precipitates with a size of 15–20 nm × 2–4 nm were generated in the T5-treated Al-5.5Mg-0.7Mn-xCu (x = 0.5, 0.8, 1.5 wt%) alloys. The room temperature tensile and yield strengths of alloys increase with increasing the content of Cu. Increasing Cu content results in more Al₂CuMg phase formation along the grain boundaries, which causes more cracks during tensile deformation and lower ductility. Al-5.5Mg-0.7Mn-0.8Cu alloy exhibits excellent comprehensive tensile properties under both as-cast and T5-treated conditions. The yield strength of 179 MPa, the ultimate tensile strength of 303 MPa and the elongation of 8.7% were achieved in the as-cast Al-5.5Mg-0.7Mn-0.8Cu alloy, while the yield strength significantly was improved to 198 MPa after T5 treatment.     

Optimization of mechanical property,antibacterial property and corrosion resistance of Ti-Cu alloy for dental implant

Ti-Cu alloys with different Cu contents (3, 5 and 7 wt%) were fabricated and studied as novel antibacterial biomaterials for dental application. The Ti-Cu alloys were annealing treated at different temperatures (740 °C, 830 °C and 910 °C) in order to obtain three typical microstructures, α-Ti + Ti₂Cu, α-Ti + transformed β-Ti, and transformed β-Ti. Mechanical, antibacterial and biocorrosion properties of Ti-Cu alloys with different microstructures were well analyzed by scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), tensile test, electrochemical test and antibacterial test. The results indicated that the Ti-Cu alloys with microstructure of α-Ti + Ti₂Cu showed the best ductility compared with other Ti-Cu alloys with microstructures of α-Ti + transformed β-Ti and complete transformed β-Ti, and meanwhile, increase of the Cu content significantly contributed to the decreased ductility due to the increasing amount of Ti₂Cu, which brought both solid solution strengthening and precipitation strengthening. Finally, the Ti-5Cu alloy with microstructure of α-Ti + Ti₂Cu exhibited excellent ductility, antibacterial property and corrosion resistance, providing a great potential in clinical application for dental implants.     

聚酰胺胺树状大分子与Cu2+、Co2+配位作用的比较

用发散法合成了G3．5和G4．0的聚酰胺胺（PAMAM）树状大分子，研究了聚酰胺胺树状大分子的代数、溶液的pH值、反应时间对聚酰胺胺树状大分子与Cu^2＋、Co^2＋配位作用的影响。结果表明，当G4．0的聚酰胺胺树状大分子存在时，Cu^2＋和Co^2＋的配合物水溶液的最大吸收波长都出现了蓝移。当G3．5的聚酰胺胺树状大分子存在时，G3．5的聚酰胺胺树状大分子几乎不和Co^2＋发生配位作用。延长反应时间，Co^2＋／G4．0PAMAM的吸收强度增加，但是Cu^2＋／G4．0PAMAM的吸收曲线几乎没有变化。溶液的pH值对G4．0的聚酰胺胺树状分子与Cu^2＋，Co^2＋配位作用有很大的影响，这为其循环使用提供了理论基础。     

Preparation and characterization of sputtered Cu films containing insoluble Nb

Copper films containing various amounts of insoluble Nb (up to 24.7 at.%) were prepared by r.f. magnetron sputtering. The crystallography and microstructure of the films were investigated for as-deposited and annealed Cu(Nb) thin films. Cu(Nb) thin films are found to consist of non-equilibrium supersaturated solid solution of Nb in Cu with a nanocrystalline microstructure. X-ray diffraction and scanning electron microscope analyses revealed a reduction in the grain sizes of the films with increasing Nb content in the films leading to a grain refinement. The electrical resistivity of as-deposited and annealed Cu(Nb) thin films is found to be low for an Nb content 2.7 at.%. Significant drops in the resistivity were observed for the high Nb contents after annealing at 530 °C which may be due to grain growth and formation of Nb-bearing phase in the film. Microhardness of the films was found to increase with the Nb concentration due to the combined effects of grain refinement and the solute strengthening of Nb.