The Effects of Nonuniform Thermal Boundary Condition on Thermal Stress Calculation of Water-Cooled W/Cu Divertors

The thermal boundary condition has very important effects on the accuracy of thermal stress calculation of a water-cooled W/Cu divertor. In this paper, phase-change heat transfer was simulated based on the Euler homogeneous phase model, and local differences of liquid physical properties were considered under one-sided high heating conditions. The steady-state temperature field and thermal stress field under nonuniform thermal boundary conditions were obtained through numerical calculation. By comparison with the case of traditional uniform thermal boundary conditions, the results show that the distribution of thermal stress under nonuniform thermal boundary conditions exhibits tbe same trend as that under uniform thermal boundary conditions, but is larger in value. The maximum difference of maximum von Mises stress is up to 42% under the highest heating conditions. These results provide a valuable reference for the thermal stress caleulat.ion of water-cooled W/Cu divertors.     

基于C30加速器的64Cu核素制备工艺

64Cu是目前应用十分广泛的放射性核素,主要用于PET诊断。本文基于C30加速器对⁶⁴Cu核素的制备工艺进行研究。制靶靶片为金属铜材质,在靶片表面镀金膜,以保护铜基底。镀金完成后用HCl和H₂O₂浸泡镀金层以去除金属杂质,用脉冲电镀法电镀富集⁶⁴Ni层。将靶片转移至C30加速器固体靶站进行辐照,束流能量为15.5 MeV。将辐照后的靶片转移至分离纯化热室。在溶靶槽中加入6 mol/L HCl和30%H2O2溶靶,使用AG1-X8阴离子交换树脂分离纯化,最终获得⁶⁴Cu核素。分别测定64Cu的放射性核纯度、放射化学纯度、金属杂质含量等质量指标。待收集的64Ni溶液衰变完全后,使用AG1-X8树脂回收。检验结果显示,富集64Ni厚度约8.5～16.3 mg/cm²,⁶⁴Cu产能大于37 GBq,产额可达180～250 MBq/(μA·h),放射性核纯度大于99.9%,放射化学纯度大于97.0%,金属杂质含量均小于0.5 μg/GBq。⁶⁴Cu制备工艺稳定、质量可控,达到了规模化生产水平,为⁶⁴Cu相关药物的研究与开发提供了稳定可靠的核素来源。     

H2 adsorption on Cu(I)-ZSM-5: Exploration of Cu(I)-exchange in solution

A new Cu(I)-exchange method for zeolites in liquid media (acetonitrile) was developed with Cu/Al ratios surpassing 0.5 with ZSM-5 crystals containing pure Cu(I) cations without impurities such as Cl ions. The method resulted in a higher Cu/Al ratio (0.78) for mesoporous [B]-ZSM-5 when compared to microporous [Al]-ZSM-5 and [B]-ZSM-5 (0.55 and 0.66 respectively). H₂ storage capacities of these Cu(I)-exchanged zeolites were investigated at 323 K along with their differential heat of H₂ adsorption using adsorption calorimetry. H₂ storage capacities as high as 0.03 wt. % at 323 K and 40 kPa were achieved on [Al] and [B]-ZSM-5 and mesoporous [B]-ZSM-5 showed an outstanding H₂/Cu ratio of 1.03 at 323 K and below 100 kPa. Coverage-dependent differential adsorption heats were found to be ranging from 95 kJ/mol to 5 kJ/mol with observed values of 30–10 kJ/mol for H₂/Cu ratios between 0.05 and 0.15.     

新型Zr57Nb5Cu15.4Ni12.6Al10大块非晶态合金的制备及其室温单轴压缩断裂行为

应用铜模真空吸铸法制备直径达5mm的棒状新型Zr57Nb5Cu154Ni12.6Al10大块非晶样品.X射线衍射检测证明样品完全为非晶态.通过等温示差扫描量热法(DSC)测试了Zr57Nb5Cu15.4Ni12.6Al10大块非晶的晶化动力学效应,同时研究了大块非晶合金的室温单轴压缩变形和断裂行为.结果表明:Zr57Nb5Cu15.4Ni12.6Al10块体非晶晶化过程具有动力学效应;其室温压缩变形过程主要表现为弹性变形;断裂面与压缩方向约呈45°,断口呈现典型的脉状花样.     

Preparation of ultra-fine copper powder and its lead-free conductive thick film

In this paper, non-agglomerated monodispersed ultra-fine copper metallic powders have been synthesized with chemical reduction method. Fine lead-free glass powders were also prepared by solid synthesis process. Thick film paste prepared by above-mentioned copper metallic powders and lead-free glass powders was applied as conductive paste of MLCC. Mixture of glass and zinc oxide give the thick film a high adhesion strength which is attributed to the rough interface from interfacial reaction between glass and chip, and a good densification. Diffusion of metal between copper thick film and nickel thick film is clear. Ni-Cu solid solution appears under high temperature firing.     

三明治结构FeNi/Cu/FeNi多层膜巨磁阻抗效应研究

采用MEMS技术在玻璃基片上制备了三明治结构FeNi/Cu/FeNi多层膜,在1～40 MHz范围内研究了FeNi/Cu/FeNi多层膜中的巨磁阻抗效应特性.当磁场Ha施加在薄膜的长方向时,巨磁阻抗效应随磁场的增加而增加,在某一磁场下达到最大值,然后随磁场的增加而下降到负的巨磁阻抗效应.在频率为5MHz时,巨磁阻抗效应在磁场Ha=800 A/m时达到最大值26.6%.巨磁阻抗效应的最大值及负的巨磁阻抗效应与多层膜中磁各向异性轴的取向及发散有关.另外,当磁场施加在薄膜的短方向时,薄膜表现出负的巨磁阻抗效应,在频率5 MHz、磁场Ha=9600 A/m时,巨磁阻抗效应可达-15.6%.     

pH值对Cu/Ni-P合金镀层的影响

研究了镀液pH值对Cu／Ni-P合金镀层硬度及耐蚀性能的影响。结果表明，镀液pH=9时，铜／镍磷双镀层具有很好的耐蚀性能和较高的硬度。     

W-15Cu合金制备中钨骨架孔隙控制的研究

钨铜复合材料是由高温烧结钨骨架经渗铜制成的两相假合金,钨骨架中的孔隙形态和大小将直接影响材料的性能.本文分别以添加硬脂酸和诱导铜的方法对钨粉进行处理,W-15Cu骨架孔隙在压制成形过程中得到了精确控制,钨骨架经熔渗后制成W-15Cu合金.用扫描电镜观察材料的显微结构,并测出材料的密度、气密性,研究了钨粉成形性与钨铜合金密度的关系.结果表明,添加硬脂酸和诱导铜不会带入杂质,能改善钨粉的成形性能,可以获得组织均匀、致密度高的W-15Cu复合材料.