(K0.45Na0.55)0.98Li0.02Nb0.77Ta0.18Sb0.05O3-Co0.85Cu0.15Fe2O4复合陶瓷的磁电性能研究

以压电体(K0.45Na0.55)0.98Li0.02Nb0.77Ta0.18Sb0.05O3和压磁体Co0.85Cu0.15Fe2O4为原料,通过传统的固相反应法制备了(1-x)[(K0.45Na0.55)0.98Li0.02Nb0.77Ta0.18Sb0.05O3]-xCo0.85Cu0.15Fe2O4多铁性复合陶瓷,并使用X射线衍射仪、扫描电子显微镜、压电测试仪、铁电测试仪和磁电耦合测试仪对物相、显微结构、压电、铁电、磁电耦合性能进行了分析。结果表明,复合陶瓷的相结构保持为(K0.45Na0.55)0.98Li0.02Nb0.77Ta0.18Sb0.05O3和Co0.85Cu0.15Fe2O4两种物相,但两者之间发生了轻微的化学反应。随着Co0.85Cu0.15Fe2O4压磁相含量的增加,复合陶瓷的压电系数从56pC/N减小到21pC/N,剩余极化强度略有降低。在压磁相含量为0.2时可获得4.3mV·cm-1·Oe-1的最佳磁电耦合系数。     

Al/Cu复合材料制备中理论与工艺研究进展

Al/Cu复合材料具有质轻、导电良好和成本低等优点,成为了近年来研究的热点。介绍了Al/Cu复合材料的主要界面复合理论,并着重阐述了近年来对主流理论的研究。综述了国内外关于Al/Cu复合材料的制备工艺和数值模拟的研究进展,指出了各工艺的优缺点,并对制备工艺的改进方向、未来数值模拟的研究方向进行了展望。     

氨硼烷同分异构体H_2B(NH_3)_2BH_4的制备

本文以NaBH_4为硼源、氨基络合物为氨源制备出了能缩短氨硼烷热分解放氢诱导期的氨硼烷同分异构体H_2B(NH_3)_2BH_4。研究了反应温度、时间和溶剂等因素对H_2B(NH_3)_2BH_4产率的影响。实验结果表明:在温度为25℃,物质的量Cu(NH_3)_6Cl_2∶NaBH_4=1∶2,反应时间为10h的条件下,制得的H_2B(NH_3)_2BH_4产率高达74%。XRD检测到反应产物中有金属Cu,经超景深显微镜观测,其粒径大小约为20μm。     

Cu/Al_2O_3复合薄膜的制备及其抗氧化性能

本文在纺织纤维基材表面采用二次溅射沉积法制备了Cu/Al_2O_3复合薄膜,利用扫描电镜(SEM)、X射线能谱仪(EDX)和矢量网络分析仪对室温环境下存放3600h的复合薄膜的表面形貌、元素含量以及屏蔽效能进行了测试,并与相同工艺条件下制备的纯Cu薄膜进行了对比分析。结果表明:与纯Cu薄膜结构的不稳定性相比,由于复合薄膜表层Al_2O_3薄膜的结构稳定性和致密性,Cu/Al_2O_3复合薄膜在保证高屏蔽性能的前提下,具有整体结构的稳定性,表现出了良好的抗氧化性能。     

超重力场凝固对Cu-1.6%Cr共晶合金组织的影响

本实验分别在普通重力场和4230g超重力场下制备了Cu_(98.4)Cr_(1.6)合金的凝固样品,研究了重力场对Cu_(98.4)Cr_(1.6)合金棒状共晶尺寸和宏观偏析情况的影响。结果表明:与普通重力场的凝固组织相比,当Cu_(98.4)Cr_(1.6)合金棒状共晶在4230g超重力场下凝固时,棒状共晶组织得到了明显的细化,其直径由250~350nm降至100~200nm。同时,Cu_(98.4)Cr_(1.6)共晶合金沿超重力场方向的硬度和成分分布基本一致,未出现明显的宏观偏析。     

Effects of Cu on Microstructures,Mechanical, and Magnetic Properties of Fe–Ni–P Alloys Fabricated by Liquid Phase Sintering

The Fe–Ni–P–Cu alloys with different copper content (0, 0.5, 1, and 2 wt%) are fabricated by liquid phase sintering (LPS) at 950 °C. The nano‐Cu powder is mechanically mixed for 90 min with Fe–Ni–P composite powder using the ethanol as the medium. The microstructure, microhardness and compressive properties of Fe–Ni–P–Cu alloys are investigated. The results indicate that the copper is beneficial to improve the mechanical properties of sintered specimens. The sample contains a small amount of γ‐(Fe, Ni) phase when the copper content is 1 wt%, which results in its the highest compressive yield strength (948.1 MPa). The highest microhardness of 371 HV is accessible in Fe–Ni–P–Cu alloy with 2 wt% Cu. The fracture surface analysis indicates that sintered specimens with Cu addition exhibit a typical intergranular mode.     

Refractive indices of layers and optical simulations of Cu(In,Ga)Se2 solar cells

Cu(In,Ga)Se₂-based solar cells have reached efficiencies close to 23%. Further knowledge-driven improvements require accurate determination of the material properties. Here, we present refractive indices for all layers in Cu(In,Ga)Se₂ solar cells with high efficiency. The optical bandgap of Cu(In,Ga)Se₂ does not depend on the Cu content in the explored composition range, while the absorption coefficient value is primarily determined by the Cu content. An expression for the absorption spectrum is proposed, with Ga and Cu compositions as parameters. This set of parameters allows accurate device simulations to understand remaining absorption and carrier collection losses and develop strategies to improve performances.     

Effect of Cu addition on microstructures and tensile properties of high-pressure die-casting Al-5.5Mg-0.7Mn alloy

In this study, Cu was added into the high-pressure die-casting Al-5.5Mg-0.7Mn (wt%) alloy to improve the tensile properties. The effects of Cu addition on the microstructures, mechanical properties of the Al-5.5Mg-0.7Mn alloys under both as-cast and T5 treatment conditions have been investigated. Additions of 0.5 wt%, 0.8 wt% and 1.5 wt% Cu can lead to the formation of irregular-shaped Al₂CuMg particles distributed along the grain boundaries in the as-cast alloys. Furthermore, the rest of Cu can dissolve into the matrixes. The lath-shaped Al₂CuMg precipitates with a size of 15–20 nm × 2–4 nm were generated in the T5-treated Al-5.5Mg-0.7Mn-xCu (x = 0.5, 0.8, 1.5 wt%) alloys. The room temperature tensile and yield strengths of alloys increase with increasing the content of Cu. Increasing Cu content results in more Al₂CuMg phase formation along the grain boundaries, which causes more cracks during tensile deformation and lower ductility. Al-5.5Mg-0.7Mn-0.8Cu alloy exhibits excellent comprehensive tensile properties under both as-cast and T5-treated conditions. The yield strength of 179 MPa, the ultimate tensile strength of 303 MPa and the elongation of 8.7% were achieved in the as-cast Al-5.5Mg-0.7Mn-0.8Cu alloy, while the yield strength significantly was improved to 198 MPa after T5 treatment.     

Optimization of mechanical property,antibacterial property and corrosion resistance of Ti-Cu alloy for dental implant

Ti-Cu alloys with different Cu contents (3, 5 and 7 wt%) were fabricated and studied as novel antibacterial biomaterials for dental application. The Ti-Cu alloys were annealing treated at different temperatures (740 °C, 830 °C and 910 °C) in order to obtain three typical microstructures, α-Ti + Ti₂Cu, α-Ti + transformed β-Ti, and transformed β-Ti. Mechanical, antibacterial and biocorrosion properties of Ti-Cu alloys with different microstructures were well analyzed by scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), tensile test, electrochemical test and antibacterial test. The results indicated that the Ti-Cu alloys with microstructure of α-Ti + Ti₂Cu showed the best ductility compared with other Ti-Cu alloys with microstructures of α-Ti + transformed β-Ti and complete transformed β-Ti, and meanwhile, increase of the Cu content significantly contributed to the decreased ductility due to the increasing amount of Ti₂Cu, which brought both solid solution strengthening and precipitation strengthening. Finally, the Ti-5Cu alloy with microstructure of α-Ti + Ti₂Cu exhibited excellent ductility, antibacterial property and corrosion resistance, providing a great potential in clinical application for dental implants.