多孔硅（PS）制备新方法

介绍了两种制备多孔硅的方法：电火花刻蚀法和激光辐射腐蚀法。讨论了这两种新方法制备的多孔硅样品的结构和发光特性，同时，与电化学法制备的多孔硅的结构和发光特性进行了比较。最后指出这两种新方法对于多孔硅形成机理和发光机制研究是有所帮助的。     

多孔硅发光的物理机制——纳米量子限制效应及表面态在发光中的作用

采用阳极氧化腐蚀的方法制备了多孔硅（ＰＳ），这种ＰＳ的微结构为纳米量级的，并具有光致发光特性，这无疑将对全硅光电子学的发展具有很大意义。根据大量实验与理论分析，提出了这种ＰＳ发光的物理机制：纳米量子限制效应和表面态及其物质在发光中的作用，从量子力学的薛定锷方程出发，用沟道势阱的近似模型，推导得到进入量子线的电子和空穴的能量势垒，ＰＳ的有效带宽Ｅ＝Ｅ＿０＋ΔＥ，对于Ｓｉ（Ｅ＿０＝１．１２ｅｖ）。完美地解释了目前在ＰＳ研究中的ＰＬ谱的篮移现象。     

LSI/VLSI中缺陷、杂质与器件性能的关系

结合器件工艺的失效分析,评述了硅中缺陷和氧、碳、金属杂质与器件性能、器件工艺之间的相互关系。指出:杂质和缺陷对器件的性能、成品率和可靠性有严重的影响,尤其经金属杂质缀饰的缺陷对器件的危害更大。对硅中某些杂质和缺陷的最新研究进展作了介绍。     

Si3N4陶瓷材料高温氧化层的分析

利用ＸＲＤ，ＥＰＭＡ，ＸＰＳ和ＳＥＭ的分析方法，研究了在１３００℃下氧化后Ｓｉ３Ｎ４陶瓷材料表面氧化层的组成的形貌，结果表明，Ｓｉ３Ｎ４陶瓷材料的表面氧化层是由方石英相和含有Ａｌ２Ｏ３，ＣａＯ等杂质的ＳｉＯ２质玻璃相所组成，其中ＳｉＯ２玻璃相听Ａｌ２Ｏ３，ＣａＯ等杂质的含量随氧化时间的增加而逐渐增加，同时在氧化层的内部都还存在部分Ｓｉ２Ｎ２Ｏ相。     

Adhesion studies of diamond-like carbon films deposited on Ti6Al4V substrate with a silicon interlayer

Diamond-like carbon (DLC) films have proven quite advantageous in many tribological applications due to their low friction coefficient, their extreme hardness, and more recently their high adherence on different substrate materials. However, for many applications, DLC films as thick as 2 μm are required, which cause high residual stress. In order to overcome this problem, this study observed the behavior of different thicknesses of silicon interlayer between DLC films and Ti6Al4V substrates. The study also analyzed the relation of growth parameters to the mechanical properties of DLC films. Silicon and DLC films were grown by using a rf-PECVD at 13.56 MHz with silane and methane atmospheres, respectively. The contribution of an interlayer thickness to the adhesion between the DLC films and Ti6Al4V substrate was evaluated by using a micro-scratch technique. The hardness and friction coefficient were evaluated by using microindentation and lateral force microscopy (LFM), respectively. Raman scattering spectroscopy was used to characterize the film quality. A correlation was found between the intrinsic stress and adhesion of DLC film and the parameters of the silicon interlayer growth. The addition of a silicon interlayer successfully reduced intrinsic stress of the films, even as measured by using a perfilometry technique.     

SCLC法测量非晶硅有效隙态密度

提出了用空间电荷限制电流（SCLC）法测量非晶硅材料的有效隙态密度的新方法，并且报告了用4061A型半导体综合测试仪测量有效隙态密度的结果。测量结果发现与用低频电容法所得结果相符。     

High concentration erbium doping of silicon-rich SiO2 thin films on silicon

In this work, high concentration erbium doping in silicon-rich SiO₂ thin films is demonstrated. Si plus Er dual-implanted thermal SiO₂ thin films on Si substrates have been fabricated by using a new method, the metal vapor vacuum arc ion source implantation with relatively low ion energy, strong flux and very high dose. X-Ray photoelectron spectroscopy measurement shows that very high Er concentrations on the surfaces of the samples, corresponding to 10 at.% or the doping level of 10²¹ atoms cm⁻³, are achieved. This value is much higher than that obtained by using other fabrication methods such as the high-energy ion implantation and molecular beam epitaxy. Reflective high-energy electron diffraction, atomic force microscopy and cross-section high-resolution transmission electron microscopy observations show that the excess Si atoms in SiO₂ matrix accumulate to form Si clusters and then crystallize gradually into Si nanoparticles embedded in SiO₂ films during dual-ion implantation followed by rapid thermal annealing. Er segregation and precipitates are not formed. Photoluminescence at the wavelength of 1.54 μm exhibits very weak temperature dependence due to the introduction of Si nanocrystals into the SiO₂ matrix. The 1.54-μm light emission signals from annealed samples decrease by less than a factor of 2 when the measuring temperature increases from 77 K to room temperature.     

SiGe: An attractive material for post-CMOS processing of MEMS

This work gives an overview of the different developments for silicon germanium (Si_1−xGe_x) from a MEMS post-processing perspective. First, the maximum processing temperature that does not introduce any damage or degradation into the standard characteristics of the CMOS driving electronics is specified. Then, the optimal type of silicon and germanium gas sources and deposition technique that results in an economical process are identified. Next, the selection criteria for a low thermal budget doping method and doping species are discussed. Finally, the advantage and disadvantage for the different approaches implemented for enhancing the physical properties of poly Si_1−xGe_x at a CMOS backend compatible temperature are highlighted. It is shown that the optimal method depends on the application requirements and the CMOS technology used for realizing the driving electronics.     

多孔硅的电致发光和发光二极管

本文较详细地描述了多孔硅的电致发光(EL),以及发光的量子限制效应的机制,并且讨论了目前已经制备出的几种多孔硅发光二级管:Ps/电解液型,Schot-tky-Like,PN结等二极管。最后,讨论了多孔硅作为半导体光电材料所存在的一些问题。     

液相化学还原法制备不同形貌的多晶纳米镍

采用液相化学还原法,在1,2-丙二醇体系中,分别使用吐温-80（Tween-80）、聚乙二醇-6000（PEG-6000）和十二烷基硫酸钠（SDS）与聚乙二醇-6000（PEG-6000）的混合物作为修饰剂,利用1,2-丙二醇还原相同母体醋酸镍,制备形貌分别为海绵体、纤维状、雪花状的多晶纳米镍;在水体系中,使用SDS为修饰剂,利用水合肼还原相同母体醋酸镍,制备球形多晶纳米镍。通过X射线衍射（XRD）、透射电子显微镜（TEM）、选区电子衍射（SAED）对纳米镍进行表征。利用傅立叶红外（FTIR）分析初步解释不同形貌纳米镍的形成机理。