Defect Engineering in Carbon‐Based Electrocatalysts: Insight into Intrinsic Carbon Defects

Functionalized carbon nanomaterials, as significant options for renewable energy systems, are widely utilized in diversified electrochemical reactions in virtue of property advantages. The inevitable defect sites in architectures greatly affect physicochemical properties of carbon nanomaterials, thus defect engineering has recently become a vital research orientation of carbon‐based electrocatalysts. The intentionally introduced intrinsic carbon defect sites in the frameworks can directly serve as the potential active sites owing to the altered surface charge state, modulated adsorption free energy of key intermediates, as well as diminished bandgap. Furthermore, the synergistic sites between intrinsic defects and heteroatom dopants/captured atomic metal species can further optimize the electronic structure and adsorption/desorption behavior, making carbon‐based catalysts comparable to commercial precious metal catalysts in electrocatalysis. With pressing research demands, the common configurations, construction strategies, structure–activity relationships, and characterization methods for intrinsic carbon defect‐involved catalytic centers are systematically summarized. Such theoretical and experimental evidences of intrinsic defect‐induced activity can reveal the active centers and relevant catalytic mechanism, thereby providing necessary guidance for the design and construction of highly efficient carbon‐based electrocatalysts and promoting their commercial applications.     

基于激光热成像的金属表面缺陷深度检测

为了突破传统方法对材料表面缺陷深度检测的局限性,提出了一种基于透射式激光热成像的无损检测技术.选用激光源作为激励源,对被测材料的缺陷表面进行加热,加热点选在材料表面缺陷正下方处,激光输出功率为50 W,加热时间为1 s.在加热过程中,材料背面的温度场由于热流在材料缺陷传导过程中的影响而产生温度差异,故使用红外热像仪对加...     

镍基合金蜂窝材料冰固持条件下的超低温铣削研究

由于低刚度航天用薄壁镍基合金蜂窝材料在机械加工后常伴有卷曲、开焊、塌边等缺陷,故需改进其固持和加工方法。将该材料进行冰固持方法处理,采用数控铣床进行高速超低温加工。分析蜂窝铣削性能和加工缺陷产生原因,揭示冰固持超低温铣削机理。试验结果表明：相比于传统固持加工方式,冰固持超低温铣削后,蜂窝表面质量有很大提高,相关加工缺陷得到了有效抑制,切削深度对表面质量影响较大;获得了加工参数对铣削力影响顺序：切深最大,可提高3倍,其次为主轴转速,进给速度最小。该方法提高了蜂窝强度,改善了断屑方式。冰固持超低温工艺为面内径向等效强度小、低刚度薄壁金属蜂窝材料的高效加工提供了新方法。     

钨合金穿甲弹芯变形缺陷的产生形式和形成力学分析

在分析高比重钨合金弹芯挤压变形缺陷产生形式的基础上,利用钨合金变形体塑性区内的速度场分布,推导了变形钨合金弹芯形成内部破裂和表面破裂条件的力学判据,并绘制了两种变形缺陷的力学判据曲线图.试验结果表明,该力学判据将为合理制定液力挤压变形工艺参数、设计优化工模具结构、预测挤压变形缺陷和提高挤压制品质量提供重要的理论依据.     

钛合金缺陷相控阵超声衍射波定量方法

针对传统衍射波设置法受散射杂波干扰难以进行钛合金缺陷定量的问题,分析了体积型缺陷和面积型缺陷的超声衍射波信号特点,并通过试验测试了钛合金材料的衍射波信号特征,提出了基于相控阵超声的高信噪比衍射波定量方案。制备了不同尺寸的长横孔试块和通槽试块,分别模拟体积型缺陷和面积型缺陷,测试试验定量。结果表明,采用相控阵超声衍射波定量方法对两种类型缺陷的定量精度均达到了1 mm以内。相控阵超声衍射波定量法操作简单,可为钛合金缺陷定量提供新的思路。     

螺旋埋弧焊管预精焊生产线导电刷结构改进

在螺旋埋弧焊管预精焊焊接过程中,导电刷与钢管表面接触是否良好,直接影响钢管埋弧焊缝及管体表面质量。通过增强导电刷底板强度,增加导电刷数量,优化导电刷角度调节及固定结构等,解决了焊接过程中由于导电刷与钢管表面接触不良产生的焊缝缺陷及钢管表面电弧烧伤问题,提高了焊接质量,减少了导电刷更换频次及使用数量,节约了材耗,实现了改进的目的。     

Chemical etching of a GaSb crystal incorporated with Mn grown by the Bridgman method under microgravity conditions

uring crystal growth can be reflected by the observations of etch pit distribution and other structural defects. Suggestions for improving the space experiment to improve the quality of the crystal are given.     

硼磷硅玻璃缺陷分析与研究

在晶圆制造中广泛运用掺杂有硼和磷的二氧化硅即硼磷硅玻璃作为绝缘介质,一般用于金属布线前的绝缘层。掺杂硼磷的作用是降低回流温度,减少热预算。但在实际运用中,由于硼磷硅玻璃性质不够稳定,常常受到环境的影响,其中的三氧化二硼和五氧化二磷容易和空气中的水汽反应生成硼酸和磷酸继而形成缺陷,造成电路短路,最终导致产品低良率,给公司造成损失。文章就硼磷硅玻璃受环境影响的异常现象进行分析研究,找到缺陷形成的根本原因及预防方法。     

孔洞缺陷的红外无损检测和PNN识别与定量评估

针对红外无损检测中因特征信息缺失,致使识别与评估效果不佳这一问题,研究以铝板为对象,基于红外无损检测技术,结合主成分分析和概率神经网络对铝板正常区及三类孔洞缺陷区进行了识别与面积定量评估.研究首先采集铝板降温过程的红外时序热图,提取了正常区和各类孔洞缺陷区的时序灰度值作为初始特征.其次,采用主成分分析对初始特征进行提取,并结合概率神经网络,以像素点为单位实现孔洞缺陷的识别及面积定量评估,并采用了支持向量机进行了对比研究.实验结果表明,对于正常区和三类孔洞缺陷区测试样本的面积评估正确率分别为99.6%、97.0%、94.7%和93.0%,相比支持向量机的评估结果,所提出的研究方法具有更高的正确率.研究论证了采用主成分分析和概率神经网络,基于时序特征,以像素点为单位,实现孔洞缺陷识别和面积定量分析的有效性和准确性.     

Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer Application

<正>Packaging of MEMS ( micro-electro-mechanical system ) devices poses more challenges than conventional IC packaging, since the performance of the MEMS devices is highly dependent on packaging processes. A Land Grid Array ( LGA ) package is introduced for MEMS technology based linear multi-axis accelerometers. Finite element modeling is conducted to simulate the warpage behavior of the LGA packages. A method to correlate the package warpage to matrix block warpage has been developed. Warpage for both package and sensor substrate are obtained. Warpage predicted by simulation correlates very well with experimental measurements. Based on this validated method, detailed design analysis with different package geometrical variations are carried out to optimize the package design. With the optimized package structure, the packaging effect on accelerometer signal performance is well controlled.