Thermal and insulating properties of epoxy/aluminum nitride composites used for thermal interface material

We synthesized an epoxy matrix composite adhesive containing aluminum nitride (AlN) powder, which was used for thermal interface materials (TIM) in high power devices. The experimental results revealed that adding AlN fillers into epoxy resin was an effective way to boost thermal conductivity and maintain electrical insulation. We also discovered a proper coupling agent that reduced the viscosity of the epoxy‐AlN composite by AlN surface treatment and increased the solid loading to 60 vol %. For the TIM sample made with the composite adhesive, we obtained a thermal conductivity of 2.70 W/(m K), which was approximately 13 times larger than that of pure epoxy. The dielectric strength of the TIM was 10 to 11 kV/mm, which was large enough for applications in high power devices. Additionally, the thermal and insulating properties of the TIM did not degrade after thermal shock testing, indicating its reliability for use in power devices. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

未经化学改性的木材液化研究进展

木材是固态的天然高分子材料,通过液化可将其转化为具有反应活性的液态分子,该技术对充分利用自然界中可再生资源具有重要的意义。综述了未经化学改性的木材液化的研究进展,并对木材液化技术存在的问题以及木材液化的发展趋势进行简要分析。     

Comparison of Canola and Soy Flour with Added Isocyanate as Wood Adhesives

Canola is widely grown in the northern latitudes for its vegetable oil, generating large quantities of residual, low value canola flour used as animal feed. The common wood adhesive poly(diphenylmethylene diisocyanate) (pMDI) should react with the wide variety of functional groups in proteins. Therefore, it would seem that canola flour with added pMDI could be an effective adhesive. Two main questions are addressed in this study: How do the wood adhesive properties of canola flour compare to the better-studied soy flour? How well do proteins, which contain an abundance of functional groups, cure with the very reactive pMDI? These questions were addressed using the small-scale adhesive strength test ASTM D-7998, with various adhesive formulations and bonding conditions for canola flour plus pMDI compared to soy adhesives. The more challenging wet cohesive bond strength was emphasized because the dry strengths were usually very good. Generally, soy adhesives were better than canola ones, as was the polyamidoamine-epichlorohydrin cross-linker compared to pMDI, but these generalizations can be altered by the conditions selected. Three-ply plywood tests supported the small-scale test results.     

Recycling of multilayer packaging using a reversible cross-linking adhesive

Plastic-based multilayer packaging has an important function on the packaging market, but is currently not recyclable as the polymer layers used are usually thermodynamically immiscible. This work therefore follows the approach to prepare separable multilayer packaging using a packaging adhesive modified with thermally unstable adducts, and proposes a corresponding recycling process. For this purpose, typical multilayer structures (polyethylene (PE)// polyethylene terephtalate (PET), PET//aluminum, and PE//aluminum) were prepared by curing furan-/maleimide-functionalized polyurethane (PU)-prepolymers with a three-functional cross-linking agent. Adhesions of up to over 3N per 15 mm test specimen were measured or substrate failures of PET films were observed. However, heating in dimethylsulfoxide, the retro-Diels–Alder reaction takes place and the cross-linked adhesive turns thermoplastic and dissolves in the solvent. Thus, the laminate separates and the pure PE, PET, and aluminum foils can be recovered without any PU residue.     

Polybutylene terephthalate modified with dimer acid methyl ester derived from fatty acid methyl esters and its use as a hot-melt adhesive

A series of polyester copolymers was synthesized via melt polycondensation of dimethyl terephthalate (DMT), dimethyl isophthalate (DMI), and 1,4-butanediol (BDO) with dimer acid methyl ester (DAME) monomers, previously prepared by the Diels–Alder reaction of fatty acid methyl esters (FAMEs). We obtained copolymers with the desired composition and a high molar mass characterized by ¹H NMR, FT-IR, and SEC. The relationship among the composition, thermal behavior, mechanical properties, and adhesion properties of these copolymers was examined, demonstrating that the DAME-modified copolymers could be substituted for HMA applications and are comparable to petroleum-based commercial products. As a result, these polyesters could offer improved sustainability and performance and may be good candidates for hot-melt adhesive materials. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020 , 137, 48474.     

Soy-oil-based waterborne polyurethane improved wet strength of soy protein adhesives on wood

Soy-oil-based waterborne polyurethane (WPU) is used to improve wet strength in shear test of wood bonded with an adhesive of soy protein isolate (SPI) by dispersing WPU into SPI slurry. WPU׳s effects on the physiochemical properties of WPU-SPI adhesives are characterized through Fourier transform infrared spectrum, transmission electron microscopy, thermal analysis, contact angle, and mechanical strength. Wet strength of the WPU-SPI adhesives increases by 65% compared to SPI control. Moreover, the microstructure of WPU has effects on the interactions between WPU and SPI. In this study, smaller and more uniform distributed WPU0002 is easier to interact and form stronger crosslinking network with protein than WPU0500. The stronger interaction between WPU0002 and protein results in increased viscosity and bond strength. The WPU-SPI blended adhesives show significantly improved wet strength, demonstrating their potential as wood adhesives.     

Design of functionally graded joints using a polyurethane-based adhesive with varying amounts of acrylate

Adhesives with graded properties along the bondline are being developed to increase the strength of adhesively bonded joints. Efforts to do this in the past have resulted in mixed results. Two adhesive parameters need to be considered: the geometry of the gradation and the material properties of the adhesive at different gradation levels. In order to consider both of these aspects, a computational model was created to aid in not only the design of adhesive gradations but also judge whether a specific adhesive gradation method will be able to result in strength increases. In this study, the model was introduced and compared with published results. A new adhesive gradation system was created by using a polyurethane-based adhesive with varying amounts of acrylate, and a numerical analysis was performed to determine the potential advantages of the adhesive gradation.     

In vitro Streptococcus mutans biofilm formation on surfaces of chlorhexidine-containing dentin bonding systems

This in vitro study evaluated the influence of chlorhexidine diacetate (CDA) when blended within dentin bonding systems (DBSs) on Streptococcus mutans (S. mutans) biofilm formation.One commercially available 0.2% wt CDA-containing DBS (Peak Universal Bond) and five experimental 0.2% wt CDA-containing DBS formulations (experimental Adper Scotchbond 1XT plus experimental resins, R₂, R₃, R₄, R₅) were assessed vs their no-CDA containing counterparts. Twenty-eight DBSs disks were prepared for each group (6.4 mm×1.0 mm) and cured for 80 s at 800 mW/cm² in a nitrogen atmosphere. A modified Drip-Flow Reactor was used to grow S. mutans biofilms on specimen surfaces for 24 h and adherent, viable biomass was evaluated using a tetrazolium salt assay (MTT). Two specimens from each of the tested materials were processed with LIVE/DEAD stain and observed using laser confocal microscopy (CLSM) while two disks from each group were examined by using scanning electron microscopy (SEM).MTT assay, CLSM and SEM observations showed that CDA addition decreased, increased or did not change S. mutans biofilm formation. The lowest biofilm formation was obtained with Peak Universal Bond and R₅ (with and without CDA).It may be concluded that the chemical composition of DBSs determines their ability to promote or hamper biofilm formation. Therefore, CDA addition may be helpful in modulating biofilm formation provided that DBS formulation is tuned and optimized.     

Phenolic adhesives based on eucalyptus pyrolytic oil: Effect of urea addition on synthesis and properties

The present work aimed to evaluate the effect of urea addition on the synthesis parameters and properties of phenolic adhesives produced with oil from the pyrolysis of eucalyptus wood. The adhesive formulations were synthesized according to an entirely randomized design involving two formaldehyde/demethylated oil (F/DO) molar ratios (1.4 and 1.7), three NaOH/DO molar ratios (0.9, 1.0 and 1.1) and five levels of urea (0, 5, 10, 15 and 20%), totalizing 30 formulations. The following parameters and properties were obtained: reaction time (min) and temperature (°C); solids content (%), gel time (s), viscosity (cP) and pH. Regression analysis was performed and quadratic models were adjusted for reaction conditions (time and temperature) and some adhesive properties. Synthesis reactions were more controllable in terms of reaction time in the following conditions: urea addition in levels from 5 to 15% with F/DO molar ratio of 1.7 and NaOH/DO molar ratio of 1.0.     

Effects of phosphorus-containing additives on soy and cottonseed protein as wood adhesives

Soy and cottonseed proteins appear promising as sustainable and environment-friendly wood adhesives. Because of their higher cost relative to formaldehyde-based adhesives, improvement in the adhesive performance of proteins is needed. In this work, we evaluated the adhesive properties of soy and cottonseed protein formulations that included phosphorus-containing acids and esters. For cottonseed protein isolate, most of these additives improved dry adhesive strength, with methylphosphonic acid, phosphorous acid, and phosphoric acid increasing the dry strength by 47, 44, and 42%, respectively, at their optimal concentrations. For soy protein isolate, these additives did not show significant benefits. The phosphorus-containing additives also improved the hot water resistance of the cottonseed protein formulations but showed either no effect or a negative effect for the of soy protein formulations. Thus, the combination of cottonseed protein with phosphorus additives appears to be attractive as wood adhesives.