Microwave dielectric properties of ultra-low loss Li2MgTi0.7(Mg1/3Nb2/3)0.3O4 ceramics sintered at low temperature by LiF addition

In this work, ultra-low loss Li₂MgTi_0.7(Mg_1/3Nb_2/3)_0.3O₄ ceramics were successfully prepared via the conventional solid-state method. X-ray photoelectron spectroscopy (XPS), thermally stimulated depolarization current (TSDC) and bond energy were used to determine the distinction between intrinsic and extrinsic dielectric loss in (Mg_1/3Nb_2/3)⁴⁺ ions substituted ceramics. The addition of (Mg_1/3Nb_2/3)⁴⁺ ions enhances the bond energy in unit cell without changing the crystal structure of Li₂MgTiO₄, which results in high Q·f value as an intrinsic factor. The extrinsic factors such as porosity and grain size influence the dielectric loss at lower sintering temperature, while the oxygen vacancies play dominant role when the ceramics densified at 1400?°C. The Li₂MgTi_0.7(Mg_1/3Nb_2/3)_0.3O₄ ceramics sintered at 1400?°C can achieve an excellent combination of microwave dielectric properties: ε_r =?16.19, Q·f?=?160,000?GHz and τ_f =??3.14?ppm/°C. In addition, a certain amount of LiF can effectively lower the sintering temperature of the matrix, and the Li₂MgTi_0.7(Mg_1/3Nb_2/3)_0.3O₄-3?wt% LiF ceramics sintered at 1100?°C possess balanced properties with ε_r?=?16.32, Q·f?=?145,384?GHz and τ_f =??16.33?ppm/°C.     

Growth behavior of aluminum borate whiskers on zirconia toughened alumina (ZTA) particle surface

In this work, B₄C-covered zirconia-toughened alumina (ZTA) particles are prepared and oxidised at 1050 °C for different times (0, 2, 4, and 8 h) in air. The X-ray diffraction and electron probe micro-analysis results show that the covering layer is mainly composed of oxide B₂O₃ intermetallics, residual B₄C particles, and Al₁₈B₄O₃₃ whiskers. The scanning electron microscopy results show that the growth of Al₁₈B₄O₃₃ whiskers on the ZTA particles enhances with increasing heat preservation time; the optimum holding time is determined to be 8 h Al₂O₃ in the ZTA particles diffuse into the covering layer and combine with B₂O₃ to form Al₁₈B₄O₃₃ whiskers; the Al₁₈B₄O₃₃ whiskers grow via the liquid-solid mechanism.     

RF磁控溅射制备钛酸锶钡BST纳米薄膜

钛酸锶钡(BST)薄膜作为一种高K介质材料在微电子和微机电系统等领域具有广阔的应用前景,人们已对BST薄膜的制备工艺技术和介电性能进行了大量的研究。BST纳米薄膜的制备工艺直接影响和决定着薄膜的介电性能(介电常数、漏电流密度、介电强度等)。对RF磁控反应溅射制备BST纳米薄膜的工艺技术进行了综述。从溅射靶的制备、溅射工艺参数的优化、热处理、薄膜组分的控制,及制备工艺对介电性能的影响等方面,对现有研究成果进行了较全面的总结。     

低插损窄带型10.7MHz压电陶瓷滤波器的研制

介绍了低插损窄带型10.7 MHz压电陶瓷滤波器的一种设计制作方法。结合压电陶瓷能陷模理论,通过对滤波器分割电极设计和制造工艺控制技术的研究,强调了工艺控制的重要性。产品达到日本村田同类产品水平,对国产化窄带型10.7 MHz压电陶瓷滤波器的研发和生产具有十分重要的意义。认为选用高Qm值压电陶瓷材料、分割电极和耦合电容的设计、焊接和点蜡工艺的控制等是研制低插损窄带型10.7 MHz压电陶瓷滤波器的重点。     

基于压电陶瓷动态信息的结构裂纹识别方法

利用压电陶瓷的动态特性和压电系统的动态信息,对铝梁的裂纹损伤进行了分析研究。随着梁裂纹尺寸的增加,压电陶瓷片的导钠幅值下降,且系统固有频率减小。利用导钠幅值的变化和系统的动态信息,可以对裂纹的位置和尺寸大小进行识别。实验证明该方法的有效性。     

片式多层陶瓷微波谐振器

介绍了片式陶瓷微波谐振器的工艺过程、谐振器的结构以及结构对谐振器参数的影响,谐振器与外电路的耦合采用耦合间隙的方法与谐振单元在同一层内实现,这种新结构既可给制备工艺带来方便,又可减少工艺所带来的误差。用多层陶瓷工艺技术,用高介电常数、低温烧结微波陶瓷实现了中心频率为1GHz,有载品质因数大于80的试验双端口多层微波谐振器。微波谐振器体积小,整个谐振器的尺寸为7mm×2mm×1mm,适用于表面贴装技术。     

陶瓷表面化学镀的前处理工艺新进展

综述了非金属表面化学镀前处理工艺的现状和发展，对陶瓷化学镀的粗化和活化工艺的新进展进行了评述，侧重讨论了离子型、胶体钯型、浆料型、分子自组装吸附钯型、贱金属型活化工艺特点和进展，并展望了今后发展方向。     

Evaluation of the Properties of Si3N4/Si3N4 Joint Brazed Using a Filler Alloy Containing Pd

Si3N4 ceramic was jointed to itself using a filler alloy of Cu76.5Pd8.5Ti15, and the mechanical properties of the jointwere measured and analyzed. By using a filler alloy of Cu76.5Pd8.5Ti15, the SisN4/SisN4 joints were obtained bybrazing at 1373～1473 K f     

玻璃微珠的表面化学镀银及红外辐射性能研究

采用化学镀方法在玻璃微珠表面镀银,考察了预处理条件、反应温度和反应时间等因素对玻璃微珠表面镀银的影响,并通过扫描电镜和X-射线衍射分析仪,对镀银后玻璃微珠的表面形貌和结构进行了观察和表征。将镀银玻璃微珠用于涂料中,考察了玻璃微珠在涂料中的应用及其红外辐射率的变化,探讨了化学镀条件对涂料红外辐射率的影响,结果表明,在控制反应温度和浓度的条件下,可使镀银玻璃微珠的红外辐射率由原来的1.02降为0.70,将其应用于涂料后,涂层的红外辐射率为0.80。     

微波陶瓷基印制板制造工艺性研究

对微波陶瓷基印制板的制造工艺流程进行了简单的介绍,对所采用的工艺技术的有效性进行了较为详细的论述。