Mold preparation, material layup, and cure times for thermoset-based composites often limit their use in high-volume applications. As such, new rapid cure epoxy resins are being developed to achieve a complete cycle time within 3 min. In this research, calorimetry and rheometry are used to examine and model two novel rapid cure epoxy resin systems with internal mold release. The rapid cure epoxy resins followed an autocatalytic cure kinetic and William–Landel–Ferry diffusion model. The rapid cure epoxy resin was shown to achieve 94% cure in 2 min at 150°C. However, adding an additional 2.5 wt% internal mold release hindered the first step of the reaction, which delayed the second reaction step since the final degrees of cure were similar. Furthermore, the resin viscosity followed a modified William–Landel–Ferry equation and at 120°C could maintain a viscosity below 5 Pa s for 4.1 min. These models provided valuable insight into the range of processing conditions these novel resins could experience during impregnation and molding processes. 相似文献
Summary: As a special epoxy resin material used in the electronics packaging, wafer level underfill (WLU) is studied using a chemorheology approach to provide a fundamental understanding of its reaction dependent rheology behaviors. In this work, the relationship between the molecular weight ( ) and the viscosity of the epoxy resins at fixed temperatures has been established. Subsequently an Arrhenius‐Erying equation was used to fit the relationship between viscosity and temperature for given molecular weight epoxies. By combining the two relationships, the viscosity could be modeled as a function of temperature and molecular weight. To obtain the viscosity change of the WLU during the reflow process, the molecular weight change of the underfill was calculated from the degree of curing through the kinetics modeling. A semi‐empirical model was developed to predict the viscosity of the underfill as a function of time and temperature during the curing process. Modeled predictions were compared with experimental data under isothermal and ramping temperatures during curing experiments. The model showed good agreement with the experiments in the early stage of curing reaction. The critical viscosity of the underfill for solder wetting was obtained by wetting experiments, which can be used as the criteria to determine the flowability of the wafer level underfill.
Data fitting of the viscosity model at isothermal condition. 相似文献
The relative stability of chip‐underfill composite materials was modeled as a function of glass filler concentration between 10 and 70 wt.‐%, filler particle size (between 5 and 25 microns), and the curing temperature of the resin (150 vs. 180 °C), yielding different dynamic viscosity profiles. The stability was gauged using a modified sigmoidal chemorheology model for the dynamic viscosity, and incorporating the time‐dependent viscosity into a model for Stokes' law of sedimentation. We also incorporated a hindered sedimentation term, due to filler concentration due to the higher loadings. Several important findings were observed. First, it appears to be the high concentration of filler that is maintaining the stability of these dispersions during cure. Smaller concentrations of the same particles were predicted to have a larger sedimentation velocity leading to stratification in the resin with time. Second, higher cure temperatures led to a shorter period of sedimentation in a pre‐cured state and resulted in less sedimentation, even though there was probably a slightly smaller viscosity in the pre‐cured condition. While these process models adequately describe the physics of the competitive processes of cure and sedimentation, a full picture may be incomplete without a larger determination of how this also affects polymerization shrinkage and residual shear stress upon cure.
