Structural integrity in electronics

With continuing miniaturisation, increased performance demands and the requirement to remove lead from solder alloys, the challenges to structural integrity and reliability of electronic equipment are substantial and increasing. This paper outlines typical features in electronic equipment of which the structural integrity community may be generally unaware. Potential failure modes in service are described, and the problems of scale and material characteristics are considered. Progress in the application of fracture mechanics to the life prediction of interconnections is reviewed. The limited evidence available suggests that the crack growth resistance of silver‐containing lead‐free solders is superior to that of the traditional Sn‐37Pb under cycle‐controlled conditions but there is no difference when time‐dependent conditions prevail. In several respects, it is contended that the electronics sector is faced with challenges at least equivalent to those encountered in gas turbines and nuclear power generation.     

Tensile fracture and failure behavior of technical flax fibers

The apparent tensile strength of technical flax fibers was determined in single‐fiber tests at various clamping lengths (20, 40, and 80 mm) and the outcome was compared with literature data. It was demonstrated that the strength of flax at each clamping length obeyed the two‐parameter Weibull model. The failure mode and sequence were studied in situ (i.e., during loading) by SEM and acoustic emission (AE). The failure sequence (axial splitting of the technical fiber along its elementary constituents, radial cracking of the elementary fibers, multiple fracture of the elementary fibers) concluded reflected the hierarchical build‐up of the flax bast fibers. To the above failure events AE amplitude ranges were assigned. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 3638–3645, 2003     

Stress Heterogeneity Effect on the Strength of Silicon Nitride

The experiments reported in this paper demonstrate the causes of the failure of monolithic ceramics. The specimens are made of silicon nitride and tested at room temperature. The stress field within the specimen is different for each of four series of tests that have been conducted. Fractographic observations have also been made to identify the causes of the failures. A size effect analysis is performed.     

Possibilities and extension of XRD material response analysis in failure research for the advanced evaluation of the damage level of Hertzian loaded components

Due to clearly distinguishable damage symptoms, it is differentiated between the surface and sub‐surface failure mode of rolling bearings. Material states red out by X‐ray diffraction (XRD) residual stress measurements point to a variety of loading conditions especially at raceway surfaces that are associated with several competing failure mechanisms. The corresponding lifetime reduction can range from the lower fatigue strength region to material ratcheting in extreme cases. Relevant position of the microstructural changes and nature of the failure mechanisms are characterized. The time alteration of the XRD material parameters measured at or near the surface and at the depth of the maximum equivalent stress correlates, in a different manner, with the statistical parameter of the 10 % bearing life. Both failure modes are illustrated by concrete examples. Contaminated lubricant and boundary lubrication, which represent practically important surface‐induced failures, are discussed in more detail. Gray staining, i.e. shallow pitting, often occurs without distinct indication of global material aging by means of XRD characteristics. Here, scanning electron microscopy observations and electron microprobe analyses point to corrosion fatigue as acting surface failure mechanism. The interaction between material and lubricant under complex loading regimes particularly of mixed friction and corrosion opens further failure research areas in the field of tribology.     

Evaluation of Slow Crack Growth Resistance in Ceramics for High-Temperature Applications

The slow (subcritical) crack growth (SCG) resistance of Si₃N₄ and SiC ceramics has been evaluated by a stepwise loading test on bending bars precracked by Vickers indentation. Three highly refractory materials were selected for the evaluation: i.e., (1) high-purity Si₃N₄ sintered by hot isostatic pressing (HIP) without additives and (2,3) α - and β - SiC pressureless sintered with B and C addition. Under the hypothesis of linear elastic behavior at high temperature, which was found satisfied in the present materials, the SCG resistance was expressed in terms of initial stress intensity factor critical for SCG failure within a predetermined lifetime. The present method was found useful in shortening the testing time and consistent with other traditional fatigue tests (e.g., static-fatigue test): It is recommended as a screening test for materials under research and development. Among the materials tested in the present study, the highest SCG resistance up to 1440°C was found in the high-purity Si₃N₄ without additives.     

弹簧钢棒线材质量投诉的分析研究

为分析研究某特钢厂用户投诉的原因及存在的问题，统计了其两年间的弹簧钢棒线材用户质量投诉，从缺陷类型及生产过程控制进行了分析，重点对多起断裂原因不明的投诉进行了深入的失效研究。结果表明，弹簧钢生产厂在设备工艺、过程控制和管理中存在很多不足，加上用户的使用工艺、材料的内外质量和规格等综合因素导致了材料的断裂失效。     

VCM压缩机曲轴断裂失效分析

介绍了锦化化工(集团)有限责任公司出现的VCM压缩机曲轴断裂事故，并从断口的部位、形貌特征，断轴的几何状态、受力状态及树料性能等方面分析了曲轴断裂的根本原因。     

基于小波的彩色序列图象压缩编码

此文提出了一种基于小波变换的运动估计算法，时间复杂度比常规算法降低了一个数量级，同时在估值精度上可与常规算法媲美。利用更佳频率分辨率小波分解处理运动补偿余量误差善了复现图象质量。实验结果表明，该算法在高压缩比情况下图象复现质量显著优于ＭＰＥＧ－２，具有广阔的应用前景。     

Implementation of a vector quantization codebook design technique based on a competitive learning artificial neural network

We describe an implementation of a vector quantization codebook design algorithm based on the frequencysensitive competitive learning artificial neural network. The implementation, designed for use on high-performance computers, employs both multitasking and vectorization techniques. A C version of the algorithm tested on a CRAY Y-MP8/864 is discussed. We show how the implementation can be used to perform vector quantization, and demonstrate its use in compressing digital video image data. Two images are used, with various size codebooks, to test the performance of the implementation. The results show that the supercomputer techniques employed have significantly decreased the total execution time without affecting vector quantization performance.This work was supported by a Cray University Research Award and by NASA Lewis research grant number NAG3-1164.     

计算机网络远程通信系统软硬件设计与实现

本文介绍一种新型远程通信系统，它克服了一般远程通信系统速度慢的缺点，将通信速度提高了８０多倍，同时，其硬件比一般远程通信系统简单，成本只有一般远程通信系统的一半左右，进一步提高了新型远程通信系统的性能价格比。在新型系统中精简了远程通信协议，提高了信道有效利用率；采用了各种行之有效的数据压缩算法，并加以改造，使之性能最佳；提供了程序远程透明执行功能，大大提高了系统的响应速度。