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51.
为了加热炉和锅炉的安全经济运行 ,分析了烟气余热回收中低温腐蚀的机理 ,提出了行之有效地解决和防止低温腐蚀的几种技术方法 相似文献
52.
铜线材酸性高速电镀致密光亮锡、锡铜合金 总被引:5,自引:2,他引:3
为了寻找低成本、低腐蚀、低污染高速电镀锡、锡铜合金工艺 ,在含光亮剂、柔软剂DL0 1、0 2、0 3的硫酸槽中在不同的电流密度、不同的搅拌速度下 ,在Φ0 .5mm的铜线上电镀Sn和Sn Cu合金镀层。DL0 1、0 2的主要成分是无芳香族的希夫碱 ,DL0 3的主要成分是醇醛缩合物。结果表明 ,在含有DL0 1、0 2、0 3和 35g/LSnSO4 ,137g/LH2 SO4 的镀液中 ,在Jc=10~ 90A/dm2 ,v=16 0~ 314m/min时 ,所得镀层致密、柔软、光亮。在含CuSO4 ·5H2 O 0 .5 ,3.5g/L的硫酸镀槽中 ,在Jc=9,18A/dm2 ,v=16 0m/min时获得了致密、柔软、光亮的Sn (0 .3%~ 0 .6 % )Cu合金镀层。 相似文献
53.
54.
环境友好阻燃环氧树脂覆铜板研究进展 总被引:15,自引:0,他引:15
论述了环境友好阻燃环氧树脂覆铜板研究开发的意义。提出通过开发并使用含氮、磷或硅的非卤阻燃型环氧树脂,含磷、氮或磷-氮的功能性阻燃固化剂和在体系中添加有机磷阻燃剂、氢氧化铝等无机阻燃剂等途径来开发环境友好阻燃环氧树脂覆铜板。并对我国在今后该领域的研究作了展望。 相似文献
55.
BaFe12O19/SiO2-B2O3微晶玻璃陶瓷的制备和微波性能 总被引:1,自引:0,他引:1
采用柠檬酸sol-gel工艺合成了BaFe12O19/SiO2-B2O3微晶玻璃陶瓷,研究了SiO2-B2O3玻璃的含量,Ba/Fe原子比和热处理温度对体系析出晶相的影响,以及介电常数和磁异率在1MHz-6GHz频率范围的变化规律,结果表明,休系中SiO2-B2O3玻璃的含量和Ba/Fe比越高,BaF312O19相的析出越困难,前驱体合适的热处理温度为1000℃,介电常数和磁导率基本上随测试频率的增而加下降;介电损耗的最大值为0.43,磁损耗较小。 相似文献
56.
M.E. Enyiegbulam 《International Journal of Adhesion and Adhesives》1985,5(4):207-210
Increased wetting of the coupling agent/epoxy resin interface was observed when γ-glycidoxypropyltrimethoxysilane, polyfunctional aminosilane and γ-aminopropyltriethoxysilane were applied respectively from methyllethylketone, dimethylformamide and water on woven glass cloths which had been cleaned at 300°C. However, when factory-applied coupling agents were burnt off the woven cloths and fresh coupling agents re-applied, it was found that the nature of the factory-applied coupling agent influenced subsequent wetting. Thinner glass fibres showed a greater improvement in wetting rate than thicker fibres in those solvents identified to be good for improved wettability, irrespective of the heat-cleaning temperature. 相似文献
57.
ABSTRACT: Physical aging of amorphous anhydrous fructose at temperature 5 °C and at 22 °C was studied using differential scanning calorimetry (DSC). The dynamic glass transition temperature, Tg0 for unaged samples was 16 °C and 13.3 °C for heating rate of 10 °C/min and 1 °C/min, respectively. The fictive temperature, Tf0 for unaged samples calculated by Richardson and Savill method was 12 °C, which is close to the dynamic value obtained from the lower DSC heating rate. The fictive temperature Tf of the aged fructose glasses at temperatures both below and above the transition region was fitted well by a non-exponential decay function (Williams-Watts form). Aging above the transition region (22 °C) for 18 d increased both the dynamic glass transition temperature Tg and the fictive temperature Tf . However, aging below the transition region (5 °C) for 1 d increased the dynamic glass transition temperature Tg but decreased the fictive temperature Tf . 相似文献
58.
The bonding of β'-Al2O3 and pyrex glass to Al matrix composites by anodic bonding process is achieved. The microstructure of the bonded interface and the joining mechanisms are analyzed with scanning electron microscope (SEM), energy dispersive X-ray fluorescence spectrometer (EDX). It is observed that the bonding region across the interface consists of the metal layer, oxide transitional layer and the ceramic layer, with the transitional layer composed of surface region and sub-surface region. The bonding process can mainly be categorized into anodic bonding process and solid state diffusing process. The pile-up of the ions and its drift in the interface area are the main reasons for anode oxidation and joining of the interface. The temperature, voltage and the drift ions in the ceramic or glass during the bonding process are the essential conditions to solid state diffusing and oxide bonding at the interface. The voltages, temperature, pressure as well as the surface state are the main factors that influence the anodic bonding. 相似文献
59.
60.
The deformation behavior of dispersion strengthened copper alloy Cu-Al2O3 was studied by TEM. The results show that nano-scaled dispersed second phase not only increases dislocation density in matrix, but also has an important influence on the dislocation substructure. The presence of fine dispersed Al2 O3 particles results in a uniform and random dislocation distribution in matrix copper and causes the difficulty in formation of dislocation cell structure and the decrease in the amount of cell structure during deformation. Deformation gives rise to much more dislocations and dislocation cells form more difficultly and the decrease in the cell size with the increase of dispersion degree. 相似文献