应用BCB材料进行硅-玻璃气密性封装的实验与理论研究

应用苯并环丁烯(BCB)材料对硅片和玻璃片进行了250℃下的圆片级低温键合实验，同时进行了300℃下的硅片与玻璃片阳极键合实验，并对其气密性和剪切力特性进行了对比研究. 测试结果表明：在250℃的低温键合条件下，经过500kPa He气保压2h, BCB封装后样品的气密性达到(5.5±0.5)E-4Pacc/s He；剪切力在9.0~13.4MPa之间，达到了封装工艺要求；封装成品率达到100%. 这表明应用BCB材料键合是一种有效的圆片级低温气密性封装方法. 还根据渗流模型理论，讨论了简易模型下气密性（即渗流率）和器件腔体边缘到划片边缘的间距的关系.     

Indoline-based donor molecule for efficient co-evaporated organic photovoltaics

We demonstrated the use of an asymmetrical donor–acceptor-type indoline dye—D131, developed for dye-sensitized solar cells, as an electron donor and fullerene C₇₀ as an electron acceptor for thermal co-evaporated bulk-heterojunction organic solar cells (OSCs). In spite of the presence of intermolecular hydrogen bonds among D131 molecules, they can be thermally evaporated in high vacuum at a relatively low temperature of 220 °C. The blend ratio and thickness of the active layer of D131/C₇₀ blend films in OSCs were optimized to achieve a maximum power-conversion efficiency of 4.5% with a short-circuit current of 9.1 mA cm^?2, an open-circuit voltage of 0.89 V, and a fill factor of 0.56 under AM 1.5G solar illumination (100 mW cm^?2), which is the best value reported so far for OSCs based on indoline-based donor materials.     

Hierarchically Macro–Microporous Covalent Organic Frameworks for Efficient Proton Conduction

Assembling molecular proton carriers into crosslinked networks is widely used to fabricate proton conductors, but they often suffer losses in conduction efficiency and stability accompanied by unclear causes. Covalent organic frameworks (COFs), with well-defined crystal frameworks and excellent stability, offer a platform for exploring the proton transfer process. Herein, a strategy to construct proton conductors that induce conductivity and stability by introducing bottom-up hierarchical structure, mass transport interfaces, and host–guest interactions into the COFs is proposed. The proton-transport platforms are designed to possess hierarchically macro–microporous structure for proton storage and mass transport. The protic ionic liquids, with low proton dissociation energies investigated by DFT calculation, are installed at open channel walls for faster proton motion. As expected, the resultant proton conductors based on a covalent organic framework (PIL_0.5@m-TpPa-SO₃H) with hierarchical pores increase conductivity by approximately three orders of magnitude, achieving the value of 1.02 × 10⁻¹ S cm⁻¹ (90 °C, 100% RH), and maintain excellent stability. In addition, molecular dynamics simulations reveal the mechanism of “hydrogen-bond network” for proton conduction. This work offers a fresh perspective on COF-based material manufacturing for high-performance proton conductors via a protocol of macro-micropores.     

CL-20与树形分子键合剂的粘附性能研究

通过使用扫描电镜(SEM),X射线光电子能谱(XPS)技术来研究树形分子键合剂(DBA)对CL-20晶体的粘附性能及其界面相互作用机理。实验表明了树形分子键合剂可以在CL-20表面形成-层吸附层,具有良好的粘附性能,X射线光电子能谱的化学位移也表明了键合剂与CL-20的N元素发生诱导效应。     

树形分子键合剂在PET试片中的应用

在PET体系中加入0．4％的树形分子键合剂(DBA),分别考察了DBA对HMX、RDX、AP的键合效果,证实树形分子键合剂提高了PET试片、PET-DBP—HMX试片、PET—DBP—RDX试片和PET-DBP-AP试片的力学性能。     

MEMS封装技术及设备

概述了进入后摩尔时代的MEMS技术,通过TSV技术整合MEMS与CMOS制程,使得半导体与MEMS产业的发展由于技术的整合而出现新的商机。主要介绍了MEMS器件封装所面临的挑战及相应的封装设备。     

解决COG邦定工艺中的IC翘曲问题

今天,各种电子设备在生活中日益普及,人们对于电子设备的要求已经不仅仅停留在功能上。轻薄化是电子设备发展的一个重要方向,随之而来的就是对液晶面板轻薄化的要求,而轻薄化会带来IC翘曲的问题。文章通过对IC翘曲的研究,得出了降低COG邦定中的主压温度并增高基座温度可以解决IC翘曲的结论。文中的结论对生产中COG邦定工艺的改善有很大作用,并且已经在企业生产中得以应用。     

装甲车辆防护装甲胶粘挂装技术研究

针对防护装甲采用螺栓紧固、挂架支撑等方式安装在装甲车辆上所产生的防护面积降低、工艺复杂等问题,提出采用胶粘挂装技术安装防护装甲。根据安装结构特点,确定胶粘剂的种类和制备工艺。通过研究胶粘接头不同胶粘层厚度和不同胶粘面积对挂装强度的影响,实现防护装甲胶粘挂装结构的优化设计。通过模拟跑车宽频振动试验、环境极限温度适应性考核试验,验证胶粘挂装技术的可行性和可靠性。试验结果表明：采用双组份聚氨酯胶粘剂,胶粘层厚度为2～3 mm, 多点、小面积施胶,每平方厘米胶粘面积可承载大于3 MPa的剪切力,-50 ℃和70 ℃的极限温度下强度不低于常温条件下的70%,满足动态宽频振动挂装强度要求。     

In-situ cleaning and passivation of oxidized Cu surfaces by alkanethiols and its application to wire bonding

The treatment of oxidized Cu surfaces using an alkanethiol as a reducing agent has been investigated. Exposure to a dilute solution of 1-decanethiol resulted in the complete removal and/or conversion of CuO and subsequent formation of a passivating thiolate film, a so-called self-assembled monolayer (SAM), on the underlying Cu/Cu₂O surface as evidenced by x-ray photoelectron spectroscopy (XPS) analysis. Morphological changes, monitored by scanning electron microscopy (SEM) and atomic force microscopy (AFM), revealed transformation of the rough, porous CuO layer into a comparatively smooth Cu/Cu₂O surface. Experiments performed on integrated circuit back-end-of-line (BEOL) die structures, comprising Cu/SiO₂ bond pads used as substrates for Cu wire bonding, demonstrate the potential application of a thiol-based in-situ cleaning-passivation procedure in microelectronics.     

Au丝键合改为Cu丝键合技术

现阶段Au丝作为内引线一直占着键合的主导地位,由于Cu丝具有优良的电性能和价格优势,随着键合技术的发展,以Cu丝代替Au丝作为键合用内引线已经成为必然,封装行业许多厂家正热衷于将原有的Au丝键合设备进行改造,但还存在这样那样的问题。以Au丝键合改为Cu丝键合的技术研究为出发点,首先介绍了键合技术的发展,然后通过工艺调整和设备改造,使得Cu丝作为内引线能够代替Au丝在该设备上使用,同时达到了节约生产成本,节约资金的目的。对改造过程中的气体流量、压力、功率、焊接时间等参数问题进行了详细地阐述,同时对芯片、键合劈刀等也做了相应调整,使得改造后的检测结果完全满足产品要求。大力推进以Cu丝替代Au丝键合技术,可节约生产成本,提高键合强度,增强导电率、导热率等,具有重要的经济技术效益,必将迎来封装业的又一次大变革。