金属－橡胶硫化粘接过程中分子取向行为的间接证据

对金属－橡胶热硫化粘接复合体的剥离行为进行了研究，同一粘接试样的双向１８０°剥离试验显示出了巨大的差异。本文分析了弹性材料在硫化过程中的分子行为，并提出了相应的新假设，认为这是由于金属－橡胶在硫化粘接过程中分子取向交联行为所致。这种双向１８０°剥离破坏现象可被看作是金属－橡胶硫化粘接过程中分子取向行为的间接证据。     

化学镀SiCp／Ni－P复合镀层与基体结合强度及其影响因素

论述了ＳｉＣｐ／Ｎｉ－Ｐ复合镀层与钢基体的结合强度及其影响因素。复合镀层中离界面５μｍ厚度以内区域的组成及应力状态对镀层／基体的界面结合有决定性作用，在该区域以外ＳｉＣ粒径变化不影响镀层的结合强度。适当的热处理可提高界面结合力。     

Analysis of adhesive bonded composite lap joints with transverse stitching

The effect of transverse stitching on the stresses in the adhesive is investigated using an adhesive sandwich model with nonlinear adhesive properties and a transverse stitching model for adhesive bonded composite single-lap and double-lap joints. Numerical results indicate that, among all stitching parameters, thread pretension and stitch density have significant effect on the peel stresses in the adhesive; increase in the thread pretension and the stitch density leads to a decrease in peel stress in the adhesive, while an increase in other parameters generally results in a negligible reduction in peel stress. The effect of stitching was found to be negligible on the shear stresses in the adhesive. Thus it is concluded that stitching is effective for the joints where peel stresses are critical and ineffective for those where shear stresses are critical.     

电子词典生产中的SMT工艺

本文讨论了在电子词典生产中的ＳＭＴ工艺，着重阐述了ＳＭＴ工艺流程，列举了一些不良焊接及其产生不良焊接的原因以供参考。     

金线断口的分析

运用扫描电子显微镜技术，对金线断口观察分析，讨论金线在拉伸过程中断裂时断口形貌及断裂的原因，发现，断裂是由于金锭中的气体和杂质引起的，并提出改进生产工艺的意见。     

“仪表系统接地设计规定”介绍

概述“仪表系统接地设计规定”（2000版）的内容，重点介绍等电位联结的接地方式及其特点。     

A One‐Kilobit PQR‐CMOS Smart Pixel Array

The photonic quantum ring (PQR) laser is a three dimensional whispering gallery (WG) mode laser and has anomalous quantum wire properties, such as microampere to nanoampere range threshold currents and √T‐dependent thermal red shifts. We observed uniform bottom emissions from a 1‐kb smart pixel chip of a 32×32 InGaAs PQR laser array flip‐chip bonded to a 0.35 µm CMOS‐based PQR laser driver. The PQR‐CMOS smart pixel array, now operating at 30 MHz, will be improved to the GHz frequency range through device and circuit optimization.     

Rare-earth-enabled universal solders for microelectromechanical systems and optical packaging

In packaging of microelectromechanical systems (MEMS), optical, and electronic devices, there is a need to directly bond a wide variety of inorganic materials, such as oxides, nitrides, and semiconductors. Such applications involve hermetic-sealing components, three-dimensional MEMS assembly components as well as active semiconductor or optical components, dielectric layers, diffusion barriers, waveguides, and heat sinks. These materials are known to be very difficult to wet and bond with low melting-point solders. New Sn-Ag- or Au-Sn-based universal solders doped with a small amount of rare-earth (RE) elements have been developed, which now allow direct and powerful bonding onto the surfaces of various MEMS, optical, or electronic device materials. The microstructure, interface properties, and mechanical behavior of the bonds as well as the potential packaging applications of these new solder materials for MEMS and optical fiber devices are described. Various packaging-related structural, thermal, or electrical issues in MEMS are also discussed.     

LF6铝合金的超塑性／扩散连接组合工艺试验及理论研究EI

本文研究了ＬＦ６铝合金的超塑性／扩散连接组合工艺，用变形和再结晶的方法细化晶粒，成功地进行了ＳＰＦ／ＤＢ工艺试验，利用电子探针观察了扩散连接接头的界面微观区域，并从机理上分析了金属的超塑性／扩散连接两种工艺之间的内部联系及其金属学行为。