高效焊管新工艺——金属管液相扩散焊

采用镍基非晶态箔带作中间层,在加压情况下(约几MPa)使之熔化、保温,进行了钢管瞬间液相 (TLP)扩散焊试验。结果表明,可以获得无夹杂的致密界面;接头过渡区的最终厚度显著变薄;焊后中间层主组元由焊前的Ni变为Fe;容易获得性能合格接头。值得指出的是,焊接时间约为3min,远低于手弧焊所需时间。     

陶瓷/金属钎焊与扩散连接的研究现状

工程陶瓷由于具有优异的综合性能,在许多领域得到广泛应用,但其加工性能差,通常需要与金属组成复合结构.实现陶瓷与金属之间的可靠连接是推进陶瓷材料应用的关键,钎焊和扩散连接被认为是陶瓷/金属连接中较为适合的方法.文中对近年来国内外陶瓷/金属钎焊和扩散连接技术领域的研究现状进行了综述,认为活性金属钎焊和部分瞬间液相连接发展比较成熟,部分瞬间液相连接充分结合了活性钎焊和固相扩散连接两者的优点,将成为未来陶瓷/金属连接的发展方向.     

不锈钢复合板热疲劳性能分析

利用冷热疲劳试验机模拟分析了冷热循环对不锈钢复合板热疲劳性能的影响,并采用扫描电镜、电子探针和电子背散射衍射仪对热疲劳试样V形缺口及裂纹区域的形貌和成分进行了深入分析。结果表明,不锈钢复合板热疲劳试样经 20~550 ℃ 7 500次冷热循环后,结合界面处V形缺口区出现微裂纹,且微裂纹起裂于V形缺口尖端基层侧。随着冷热循环的继续进行,微裂纹向基层内扩展,但并非沿着结合界面处扩展,而是沿着基层侧扩展。此外,热疲劳裂纹的起裂和扩展与氧化和应力作用有关,微裂纹起裂于热疲劳试样 V 形缺口区域基层侧表层局部氧化孔洞,并在冷热循环的应力作用下向基层内扩展,同时加剧氧化。随着冷热循环的继续进行,晶界氧化逐渐加剧,导致微裂纹扩展成更为明显的裂纹。     

镁合金与钛合金的瞬间液相扩散焊

为实现镁合金AZ31B与钛合金Ti6A14V的可靠连接，研究了两者以Al为中间层的瞬间液相扩散焊接头的微观结构与连接强度。研究结果表明：当焊接时间为180min时，焊接温度是影响界面反应热力学与动力学的主要参数，其对接头的微观组织、接头界面新生相构成与连接强度有重要影响。保温温度低于450℃时，AZ3IB／AI界面无液相产生，无法实现AZ31B与Ti6A14V的可靠连接；保温温度在450℃～480℃变化时，温度对AZ31B／Al／Ti6A14V界面反应的动力学因素有明显影响，且直接决定了焊后接头新生相的构成与分布。470℃保温180min的接头剪切强度较高（72．4MPa），达到AZ31B母材（86MPa）的84．2％。     

Effect of ultrasonic power and bonding force on the bonding strength of copper ball bonds

Copper wire, serving as a cost-saving alternative to gold wire, has been used in many high-end thermosonic ball bonding applications. In this paper, the bond shear force, bond shear strength, and the ball bond diameter are adopted to evaluate the bonding quality. It is concluded that the ef/~cient ultrasonic power is needed to soften the ball to form the copper bonds with high bonding strength. However, excessive ultrasonic power would serve as a fatigue loading to weaken the bonding. Excessive or less bonding force would cause cratering in the silicon.     

Borides at interfacial zone of IC6 TLP bonded joints

1　INTRODUCTIONTransientliquidphase (TLP)bondingtechniquehasbeensuccessfullyusedinjoiningheatresistantal loys ,likeHastelloyX ,Inconel713C ,In10 0 ,Udimet5 0 0 ,70 0 ,MarM 2 0 0 ,0 0 7,2 4 7,30 2 ,Rene′80 ,TD NiCr ,MA75 4,6 0 0 0 ,PWA14 2 2 ,CSMX 2etc ,whicharesusceptibletohotcrackingor post weldheat treatmentcrackingproblemsduringfusionweld ing[14 ] .Inaddition ,therewerereportsofjoiningNiAlandTiAlintermetallicsbyTLPbondingmethod[510 ] .Forexample ,Galehadinvestigatedthemic…     

LF6铝合金的超塑性和扩散连接的组合工艺

研究了ＬＦ６铝合金的超塑性和扩散连接组合工艺，试验结果表明；预先采用变形再结晶的方法细化材料的晶，并有效地去除铝合金的致密氧化膜，即可成功地实现铝合金的ＳＰＦ－ＤＢ组合工艺。利用电子探针从微观观察了扩散连接接头的界面扩散行为，并首次从机理上分析珥金属的超塑性和扩散连接两种工艺之间的内部联系。     

Diffusion bonding between nickel-base superalloy K24 and heat-resisting steel 1Cr11Ni2W2MoV

IntroductionSLlperalloyandheat-resistingsteelarenowwidelyusedasstructurematerialsinaerospace,a\-lationalldshipbuildingindustries.Nickel-basesuperalloywasfirstlyrevealedasanengineeringmaterialduringtheearly1960swhenitwasrecognizedasbeingsuitableforllledium-temperaturegasturbinel'l.Now.nickel-basesuperalloyhasbeenpracticallyusedinhigheffectiveturbinestosatisfytheincreasingdemandsforhighertemperatureenvironmentsIZI.Insomeaerospaceengines,theimpellersshouldserveattemperatureof1000C~1100C,andala…     

Coloring effect of the organic hybrid of polyamide 6 and N,N′‐ethylene‐bis(tetrabromophthalimide)

Coloring study in organic hybrid of polyamide (PA6) and N,N′‐ethylene‐bis(tetrabromophthalimide) (EPT), where the chromophore was self‐assembled by hydrogen bonding formed between PA6 molecular chains and EPT compound, have been characterized by several techniques. CS930 double wavelength lamella scanner was employed to measure the change of color. The existence of hydrogen bonding in PA6/N‐N′‐ethylene‐bis (tetrabromophthalimide) (PA6EPT) was investigated with Fourier transform infrared (FTIR), the results of which were compared with that of PA6 with the same thermal history. FTIR spectra at room temperature revealed that there is essentially hydrogen bonding between PA6 and EPT. The crystallization behavior of PA6EPT affected by hydrogen bonding was studied by using FTIR. The temperature‐dependent behavior of both PA6 and PA6EPT was studied by temperature‐FTIR spectroscopy and differential scanning calorimetry (DSC). With temperature increasing, changes in sensitive, high‐resolution absorbance spectra are observed as dissolve‐volatilizing thin film. Temperature‐FTIR results showed that the hydrogen bonding in PA6EPT attenuated and dissociated considerably at a smaller rate than PA6, that is to say, hydrogen bonding in PA6EPT is more stable than that in PA6. DSC showed that the melting temperature of PA6EPT and PA6 are similar. However, the crystalline degree and crystalline temperature and melting enthalpy of PA6 and PA6EPT are different. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 594–600, 2007     

The Interlaminar Bond Strength of Flexible Polymer-Metal Laminates

An alternative test method to the traditional 180° “T” peel test has been developed for the measurement of interlaminar bonding in three-ply (polyester/aluminium/polypropylene) flexible-packaging, laminate materials. The new test is thought to involve mixed mode I (opening) and mode II (shearing) failure, and takes into account the yielding of the polypropylene layer during testing. The method allows more direct comparisons between materials to be made, and allows the measurement of strong bonds, where a peel test would result in yield or fracture of the substrate arms before debonding.