榫边扣合管状密闭输送带的制作及其质量优化

对用于制药、精细化工、建材业等输送松散及粉、粒物料不污染环境的榫边扣合管状密闭输送带的结构特点、技术要求、制造工艺和优化制品质量的技术措施及效果进行了实验探讨。     

苯酚改性脲醛树脂合成工艺及性能的研究

用苯酚作为改性剂,采用高温(90℃)缩聚反应合成改性脲醛树脂胶粘剂,改进了合成工艺,缩短了反应时间。通过引入苯环改善了耐水、耐老化性能。分析了各因素对改性脲醛树脂的影响,得到甲醛、尿素、苯酚摩尔比为10:8:1时树脂性能最佳,胶合强度和木破率均达到GB／T 17656-1999标准规定值。     

飞机大直径低压导管粘接修理

为适应外场快速修补的需要，在分析现有飞机损伤导管不同修理方法优缺点的基础上，通过筛选胶粘剂和修理试验，提出了大直径低压导管粘接修理工艺，为飞机导管损伤修理提供了一种新的方法。     

新型可见光固化口腔正畸粘合剂研制

介绍了一种新型可见光固化正畸粘合剂的组成、性能及正畸粘接的工艺。此粘合剂由一种单组分液体底胶和单组分糊剂组成。与化学固化粘合剂相比,其操作使用方便,固化时间短。这种新型粘合剂的粘接强度完全满足了正畸粘合剂的要求。     

力化学法制备金属－NR硫化粘合用CSM－NR接枝聚合物

用开炼机，通过力化学方法，将ＮＲ／ＣＳＭ（质量比为１０／９０）制成４５￣＃钢－ＮＲ硫化粘合剂用接枝聚合物。当橡胶本体１００％破坏时，１８０°剥离强度为２３．６～２４．６ｋＮ／ｍ。     

An Experimental Study of Fatigue Strength for Adhesively Bonded Tubular Single Lap Joints

In this paper, manufacturing technology of the tubular single lap adhesive joint was studied to obtain reliable and optimal joint quality. In addition, a surface preparation method and a bonding process for the joint were devised. The effect of the adhesive thickness and the adherend roughness on the fatigue strength of the joint was experimentally investigated. From experiments, it has been found that the fatigue strength of the joint increased as the adhesive thickness decreased and the optimal arithmetic surface roughness of the adherends was about 2 μm.     

Physical crosslinking effects in α,ω-dihydroxy terminated polybutadienes

Structure and molecular dynamics of α,ω-dihydroxy terminated polybutadienes of varying number averaged molecular weight (1320-10?500 g/mol) have been investigated by Fourier-transformed infrared (FTIR) spectroscopy, nuclear magnetic resonance (NMR) spectroscopy, dielectric relaxation spectroscopy (DRS), differential scanning calorimetry (DSC) and wide-angle X-ray scattering (WAXS). DSC and DRS revealed an increase in the glass transition temperature upon decrease of the molecular weight, accompanied by an increasing dynamic fragility m (or steepness index) of the dielectric α-process. This correlation between T_g and m for different molecular weights indicates the presence of a physical network, where H-bonded end-group clusters act as temporary crosslinks. From the dielectric relaxation strength Δ?_α(M_n), the fraction of associated hydroxy groups (f_bond) was estimated showing a peak value for the two but shortest polymers, a behaviour that strongly resembles the molecular weight dependence of the fragility. By considering the quantity f_bond(M_n) in a modified Fox-Flory approach, the measured T_g(M_n) behaviour could be reproduced in a satisfying way. FTIR results support this general picture and show a considerable dependence of the extent of hydrogen bonding and formation of hydroxy groups associates on the molecular weight. Further, WAXS and DSC results disprove the idea of formation of pseudo-crystalline hydrophobic microdomains in these compounds as suggested by other authors.     

Processing study of a high temperature adhesive

An adhesive-bonding process cycle study was performed for a polyimidesulphone. The high molecular weight, linear aromatic system possesses properties which make it attractive as a processable, low-cost material for elevated temperature applications. The results of a study to better understand the parameters that affect the adhesive properties of the polymer for titanium alloy adherends are presented. These include the tape preparation, the use of a primer and press and simulated autoclave processing conditions. The polymer was characterized using Fourier transform infrared spectroscopy, glass transition temperature determination, flow measurements, and weight loss measurements. The lap shear strength of the adhesive was used to evaluate the effects of the bonding process variations.     

Effect of MgO Addition on the Bondability and Interfacial Reaction between Dielectric and Glass-Ceramics for the Fabrication of Multi-Component Ceramic Substrates

Bondability and interfacial reaction between dielectric and insulator layers have been examined to obtain a basic understanding of bonding mechanisms. Lead-containing complex perovskite was used as a dielectric material. Two kinds of glass-ceramics were used as insulator material; lead borosilicate glass containing Al_2O3 (insulator A) and the same containing Al₂O₃ and M_gO (insulator B). Dielectric and insulator layers did not bond when insulator A was used. When insulator B was used, however, strong bonding was achieved between the two layers by firing the powder compacts at temperatures between 800° and 1000°C. Addition of M_gO to lead borosilicate glass increased the thermal expansion coefficient to that of the dielectric and enhanced the formation of reaction layers, resulting in good bonding. Two reaction layers were identified. The main reaction products were enstatite and bredigite for one layer contacting the dielectric, and enstatite and a compound with the same diffraction pattern as that of faujasite for the other layers contacting insulator B.