重铬酸钾滴定法测定甲基磺酸锡中Sn~(2+)和Sn~(4+)的含量

研究了以重铬酸钾间接滴定甲基磺酸锡中Sn2+和Sn4+含量的方法。在6mol/L盐酸中用锌粉把Sn4+还原为Sn2+,加入硫酸铁铵快速氧化Sn2+,硫酸铁铵中的Fe3+被还原为Fe2+。用重铬酸钾滴定Fe2+来间接测定Sn2+和Sn4+含量。方法相对标准偏差为1.65‰,回收率99.98%。该方法简便,快速,结果准确可靠。     

浮法硼硅酸盐玻璃下表面渗锡的研究

根据实验样品的成分,制定一定的浮法成型的温度制度,采用自制小型石墨锡槽,模拟硼硅酸盐玻璃的浮法成型过程,用电子探针结合能谱仪,测试浮法硼硅酸盐玻璃在1250~650℃温度范围内不同温度段下表面渗锡的分布情况,研究硼硅酸盐玻璃不同于传统钠钙硅浮法玻璃的渗锡特点。研究结果表明,在特定的浮法工艺制度下,硼硅酸盐玻璃渗锡的深度达到40μm左右,并且高温段锡离子以纵向深度扩散为主,低温下锡离子主要在玻璃的近表面富集。在浮法成型的过程中,渗锡的分布曲线上会出现卫星峰,但是最终在出锡槽的温度下渗锡曲线是单调递减的。     

X-ray Photoelectron Spectroscopy of Cadmium Tin Oxide Ceramics in As-Fired and Electrochemically Reduced Forms

X-ray photoelectron spectroscopy (XPS) has been employed to investigate the chemical nature of samples of dicadmium stannate (Cd₂SnO₄) in the as-fired, electrochemically reduced, and reoxidized states. The reduction of Cd₂SnO₄ was found to be associated with a dramatic color change from bright yellow to dark green, a phenomenon commonly known as the electrochromic effect. Both quantitative XPS results and binding energy measurements proved that, upon exposure of the reduced ceramic bodies to air, the Sn²⁺ to Sn⁴⁺ transition readily took place to produce the intermediate compound, Cd₂SnO₃ with divalent tin. Prolonged exposure to the atmosphere did not result in further progress of reoxidation extending to monovalent cadmium. However, complete reoxidation of the reduced samples was possible by annealing in air at 350°C for a short period of time, e.g., 3 h, by which the original features of the as-fired state such as color and electrical conductivity were restored. The results also showed that reoxidized samples at high temperature assume the same XPS characteristics as those of as-fired ceramics.     

Plastic deformation of ZnO thin films through edge and screw dislocation movements

Columnar wurtzite grains were formed in sputtered ZnO thin films deposited on a plastic polyethylene terephthalate substrate. Selected-area diffraction patterns reveal that the columnar grains in the sputtered films present two preferred growth planes, namely, the basal (0002) and prismatic (100) growth planes. The diffraction patterns obtained also confirm that the microstructure of sputtered indium tin oxide thin films is amorphous in nature. Tensile tests indicate that the fracture strain of the ZnO thin film occurs between 1.73% and 2.14%, while the fracture strain of the indium tin oxide thin film occurs between 0.24% and 0.67%. Thus, the fracture toughness of the sputtered ZnO thin film is greater than that of the sputtered indium tin oxide thin film. High-resolution transmission electron microscopic images demonstrate that edge and screw dislocations could be identified in the sputtered ZnO thin films. Moreover, edge and screw dislocation movements may, respectively, be observed in the basal- and prismatic-oriented ZnO columnar grains of the sputtered ZnO thin films. Our results indicate that movements of the edge and screw dislocations in the basal- and prismatic-oriented ZnO columnar grains account for the plastic deformation of the investigated ZnO thin films under tensile stress.     

添加剂对镀锡引线可焊性的影响

分析了镀暗锡和光亮镀锡引线的可焊性，讨论了添加剂对镀锡引线可焊性的影响，适量的添加剂能提高引线的平整性和可焊性，获得了具有良好可焊性所需的最佳添加剂的加入量。     

活性炭负载Ti(SO_4)_2催化合成丙二酸二丁酯的研究

首次以活性炭负载硫酸钛 (Ti(SO4) 2 /C)作催化剂 ,合成丙二酸二丁酯 ,此催化剂活性高 ,选择性好 ,易分离 ,不腐蚀设备 ,反应时间短 ,是一种环境友好催化剂。考察了影响酯化反应的条件 ,获得优化工艺条件如下 :Ti(SO4) 2 负载量 2 0 % ,丙二酸 0 2mol,正丁醇 0 6mol,催化剂 0 8g ,反应温度 15 0℃ ,反应时间 90min ,丙二酸的转化率 94 %以上     

铈对镀锡引线可焊性的影响

探讨了稀土元素铈对电子元器件引线镀锡层可焊性的影响。结果表明,在氟硼酸盐镀锡溶液中加入适量的铈能提高镀液的稳定性,镀层的抗氧化性和可焊性,并可获得更为光亮的镀层。     

Effect of tin addition on the microstructure and properties of ferritic stainless steel

This article reports the effects of Sn on the inclusions as well as the mechanical properties and hot workability of ferritic stainless steel. Precipitation phases and inclusions in Sn-bearing ferritic...     

温度对浸镀锡镀层的影响

在基于氯化胆碱-水溶液(ChCl-H2O)的浸镀锡溶液中,以铜片为基材,在不同温度下进行浸镀锡研究.分别利用X-荧光光谱仪、扫描电子显微镜、X-射线衍射仪、可焊性测试仪和电化学工作站,考察了浸镀锡速率、形貌、物相和性能受温度的影响程度.结果表明,随着温度的升高,浸镀锡的沉积速率不断加快,浸镀锡镀层的耐蚀性和可焊性均有提高;镀层表面在较低温度时光亮平整,但随温度上升,变得越来越粗糙;在70℃时,锡镀层的晶相组成由Sn和Cu6 Sn5两相共存转变Sn、Cu6Sms和Cu3 Sn三相共存.在ChCl-H2O体系中,铜基浸镀锡的反应活化能Ea为24.6 kJ·mol-1.     

低锡青铜镀层电解退除工艺

介绍低锡青铜镀层电解退除工艺及应用情况,并对影响因素和退镀机理进行探讨。工艺成分简单,溶液稳定,使用寿命长,底层不易腐蚀,退镀溶液可直接加入镀液使用。