单分散六边形扁平溴碘化银微晶的结构与性能的研究

应用可控双注仪制备了一系列碘含量相同而碘在微晶中分布不同的单分散六边形扁平溴碘化银乳剂。用扫描电镜（ＳＴＥＭ）与Ｘ－射线能谱仪（ＥＤＳ）对单个微晶进行了微区分析，并用介电损耗，微波光导等方法研究了此类乳剂微晶的结构与性能的关系。结果表明：严格控制微晶成核、成熟、生长三个阶段的条件，可制得含六边形颗粒９２％以上的扁平溴碘化银乳剂，颗粒大小变化系数小于１２％。此外碘在微晶中的分布明显影响微晶的电性质和     

矩形介质波导阵列的一种新型分析方法

本文将等效介电常数近似分析方法在应用范围和处理方法上进行了一些改进．发展为双等效介电常数近似分析法，然后用它来分析矩形介质波导阵列．推得两个一维周期的耦合特征方程。如果将Macatili方法应用范围扩展用来研究该波导阵列也会得到同样的结果，它们都能在二维平面上较准确地反应出通带和阻带等主要周期特性。     

用于高压电容器的SrTiO3基陶瓷

报道ＳｒＴｉＯ３基陶瓷的制备方法和介电性质，给出了用此种陶瓷制成的高压电容器的试验结果，并对它位进行了讨论。     

平面分层介质结构全波分析综述

本文综述了广义谱域导抗法，直线法及直线法的快速算法，全波离散镜象法等主要方法，并对各种方法的特点进行了比较，这些方法可有效地处理平面分层介质结构问题，文中包括作者近期的研究成果。     

压电复合材料PT－P（VDF／TeFE）的静水压压电性

用热轧辊机制备了压电复合材料ＰＴ－Ｐ（ＶＤＦ／ＴｅＦＥ），并利用ＬＣＲ电桥和Ｂｅｒｌｉｎｃｏｕｒｔ电路分别测量了其介电常数和压电常数，实验结果表明它具有良好的静水压压电特性。最后讨论了该复合材料在水听器中的应用     

SOI全介质隔离与高频互补双极兼容工艺

ＳＯＩ材料的全介质隔离技术与高频互补双极工艺的结合是研制抗辐照能力强、频带宽、速度高的集成运算放大器的理想途径，从实验的角度提出了一种ＳＯＩ材料全介质隔离与高频互补双极工艺兼容的工艺途径。     

谐振式力传感器敏感结构的研究

利用材料力学及弹性力学法，对石英晶体谐振式力传感器的悬臂梁结构进行了研究，得出了双梁单岛及三梁单岛悬臂梁结构的力转移系数，在与实验结果进行了比较后证明，支承结构的理论推导与实验结果一致。     

Barrier layer effect of tantalum on the electromigration in sputtered copper films on hydrogen silsesguioxane and SiO2

As IC devices scale down to the submicron level, the resistance-capacitance (RC) time delays are the limitation to circuit speed. A solution is to use low dielectric constant materials and low resistivity materials. In this work, the influence of underlying barrier Ta on the electromigration (EM) of Cu on hydrogen silsesquioxane (HSQ) and SiO₂ substrates was investigated. The presence of a Ta barrier not only improves the adhesion between Cu and dielectrics, but also enhances the crystallinity of Cu film and improves the Cu electromigration resistance. The activation energy obtained suggests a grain boundary migration mechanism and the current exponent calculated indicates the Joule heating effect.     

复合聚全氟乙丙烯材料的介电及高频击穿性能研究

在聚全氟乙丙烯(FEP)中添加 TiO_2和 Al_2O_3,通过热压成型的方法制备了 FEP/TiO_2复合材料和 FEP/Al_2O_3复合材料,研究了氧化物添加量对复合材料介电常数、介电损耗和高频击穿性能的影响。结果表明,随氧化物含量的增加,复合材料的介电常数和介电损耗均增加;在同一添加量下,TiO_2对复合体系的介电性能影响较大。FEP/TiO_2复合材料的高频击穿性能随 TiO_2含量的增加而下降,在 TiO_2含量为4.0%(质量分数,下同)时,复合材料的损伤阈值已降为 FEP 材料损伤阈值的48.9 %。而 FEP/Al_2O_3复合材料的高频击穿性能随 Al_2O_3含量的增加而升高,当 Al_2O_3含量为1.2%时,复合材料的损伤阈值已增大到 FEP 材料损伤阈值的2倍,达到313 J/m~2。     

Extracting Electron Densities in N-Type GaAs From Raman Spectra: Theory

In this paper, we present the theory for calculating Raman line shapes as functions of the Fermi energy and finite temperatures in zinc blende, n-type GaAs for donor densities between 10¹⁶ cm⁻³ and 10¹⁹ cm⁻³. Compared to other theories, this theory is unique in two respects: 1) the many-body effects are treated self-consistently and 2) the theory is valid at room temperature for arbitrary values of the ratio R = (Q²/α), where Q is the magnitude of the normalized wave vector and α is the normalized frequency used in the Raman measurements. These calculations solve the charge neutrality equation self-consistently for a two-band model of GaAs at 300 K that includes the effects of high carrier concentrations and dopant densities on the perturbed densities of states used to calculate the Fermi energy as a function of temperature. The results are then applied to obtain the carrier concentrations from Fermi energies in the context of line shapes in Raman spectra due to the coupling between longitudinal optical phonons and plasmons. Raman measurements have been proposed as a non-destructive method for wafer acceptance tests of carrier density in semiconductor epilayers. The interpretation of Raman spectra to determine the majority electron density in n-type semiconductors requires an interdisciplinary effort involving experiments, theory, and computer-based simulations and visualizations of the theoretical calculations.