Trilayer Nanomesh Films with Tunable Wettability as Highly Transparent,Flexible, and Recyclable Electrodes

Metallic mesh materials are promising candidates to replace traditional transparent conductive oxides such as indium tin oxide (ITO) that is restricted by the limited indium resource and its brittle nature. The challenge of metal based transparent conductive networks is to achieve high transmittance, low sheet resistance, and small perforation size simultaneously, all of which significantly relate to device performances in optoelectronics. In this work, trilayer dielectric/metal/dielectric (D/M/D) nanomesh electrodes are reported with precisely controlled perforation size, wire width, and uniform hole distribution employing the nanosphere lithography technique. TiO₂/Au/TiO₂ nanomesh films with small hole diameter (≤700 nm) and low thickness (≤50 nm) are shown to yield high transmittance (>90%), low sheet resistance (≤70 Ω sq^?1), as well as outstanding flexural endurance and feasibility for large area patterning. Further, by tuning the surface wettability, these films are applied as easily recyclable flexible electrodes for electrochromic devices. The simple and cost‐effective fabrication of diverse D/M/D nanomesh transparent conductive films with tunable optoelectronic properties paves a way for the design and realization of specialized transparent electrodes in optoelectronics.     

脉冲激光沉积技术沉积温度对PZT/LSAT薄膜生长取向的影响

采用固相法分别制备了标准摩尔配比和铅过垦10%的两种靶材.并利用脉冲激光沉积技术(PLD)在镧锶铝钽(LaSrAlTaO3,LSAT)单晶衬底上成功制备了锆钛酸铅(Pb(Zr0.3Ti0.7)O3,PZT)铁电薄膜,在550～750℃沉积温度范围内研究了PZT薄膜的生长取向和铅含最对薄膜生长取向的影响.利用X射线衍射(XRD)仪和原子力显微镜(AFM)表征了薄膜生长取向和表面形貌.XRD测量表明在标准摩尔配比情况下薄膜牛长从550 C近似c轴取向逐渐过渡到750℃近似a轴取向,而在铅过量情况下薄膜生长取向无明显过渡性变化;AFM测量表明PZT薄膜在近似C轴和a轴生长情况下,表面均方根(RMS)粗糙度分别为16.9 nm和13.7 nm,而在混合生长无择优取向的情况下,薄膜表面均方根粗糙度达到68 nm,这可能是两种取向竞争生长的结果.     

A novel polishing technology for epoxy resin based on 355 nm UV laser

The electromagnetic shielding film has drawn much attention due to its wide applications in the integrated circuit package, which demands a high surface quality of epoxy resin. However, gaseous Cu will splash and adhere to epoxy resin surface when the Cu layer in PCB receives enough energy in the process of laser cutting, which has a negative effect on the quality of the shielding film. Laser polishing technology can solve this problem and it can effectively improve the quality of epoxy resin surface. The paper studies the mechanism of Cu powder spraying on the compound surface by 355 nm ultraviolet (UV) laser, including the parameters of laser polishing process and the remains of Cu content on compound surface. The results show that minimal Cu content can be realized with a scanning speed of 700 mm/s, a laser frequency of 50 kHz and the distance between laser focus and product top surface of -1.3 mm. This result is important to obtain an epoxy resin surface with high quality.     

二氧化硅超薄膜的扫描隧道显微镜和扫描隧道谱研究

用超高真空热氧化方法在Si(111)清洁衬底上生长了二氧化硅超薄膜，并利用超高真空扫描隧道显微镜和扫描隧道谱技术对超薄膜的表面形貌和局域电学特性进行了研究。结果显示，在超薄范围二氧化硅呈层状生长，不同层的微分电导谱所测禁带宽度差别可以达到约3eV，形貌对二氧化硅带宽的影响小于膜厚的影响。     

溅射后退火反应法制备GaN薄膜的结构与发光性质

报道了用溅射后退火反应法在 Ga As (110 )衬底上制备 Ga N薄膜 .XRD、XPS、TEM测量结果表明该方法制备的 Ga N是沿 c轴方向生长的六角纤锌矿结构的多晶薄膜 .PL测量结果发现了位于 36 8nm处的室温光致发光峰.     

近空间升华沉积CdTe薄膜的微结构和PL谱

用近空间升华法在CdS薄膜上沉积了CdTe薄膜.研究了在两种保护气氛下所沉积的多晶CdTe薄膜在后处理后的微结构、表面形貌及光致发光(PL)谱,并研究了CdTe表面和CdS/CdTe界面的PL谱的区别,根据薄膜的微结构对碲化镉在太阳电池中的应用进行了讨论.     

光学薄膜在光通信中的应用

主要介绍了光学薄膜在光通信的无源型器件中的原理及应用,并与光纤光栅和平面光波导型的无源器件作简单比较。     

Measurement Method of the Thickness Uniformity for Polymer Films

Several methods for investigating the thickness uniformity of polymer thin films are presented as well their measurement principles.A comparison of these experimental methods is given.The cylindrical lightwave feflection method is found to can obtain the thickness distribution along a certain direction.It is simple and suitable method to evaluate the film thickness uniformity.     

锆酸铅薄膜的生长特性与表面化学态

以醋酸铅和异丙醇锆为原料，乙二醇甲醚为溶剂。通过溶胶-凝胶法和快速退火工艺在Pt(111)／Ti／SiO2／Si(100)基片成功地制备出不开裂的钙钛矿PbZrO3薄膜。用XRD和原子力显微镜测量了薄膜随退火温度变化的结构和表面形貌特征，用XPS测试了650℃退火PbZrO3薄膜的表面化学态。     

PECVD法低温沉积多晶硅薄膜的研究

在玻璃衬底上采用常规的PKCVD法在低温(≤400℃)条件下制得大颗较(直径＞100nm)、择优取向(220)明显的多晶硅薄膜。选用的反应气体为SiF4和H2混合气体。加入少量的SiH4后，沉积速率提高了近10倍。分析认为，在低温时促使多晶硅结构形成的反应基元应是SiFmHn(m n≤3)，而不可能是SiHn(n≤3)基团。