基于PADS2004的高速PCB设计

在高速印刷电路板设计过程中,仅依靠个人经验布线,往往存在巨大的局限性,因而高速电路设计的仿真显示出越来越重要的地位。借助仿真软件,通过对高速信号线进行布局布线前仿真和布局布线后仿真,可以发现和解决信号完整性、串扰、EMC等问题。本文主要介绍了使用PADS2004/hyperLynx软件进行印刷电路板的仿真,通过对高速数字电路中的阻抗匹配、传输线长度及EMC问题的仿真,根据仿真结果分析给出了相应解决办法。文章还对高速电路设计中电源层分配、时钟设计进行了讨论。     

高分辨率雷达信号参数对目标识别的影响

采用模板匹配分类器,对具有大、中、小3个尺寸级别的9类目标进行基于高分辨率雷达距离像(HRRP)的识别仿真试验,系统地研究了识别概率-信噪比-雷达带宽/载频之间的三维变化关系,分析了雷达信号参数对目标识别的影响,得到了有价值的研究结论。     

一种新型三维光正交码的设计

基于光正交码(OOC)编码技术,提出了一种新型空/时/频三维OOC的设计方案,对光信号在时、频和空域进行编码,该码具有理想的自/互相关特性。通过仿真比较,在容量和系统的误码率等性能方面比一、二维OOC都有较大的提高,因而能很好地适应未来高密集光纤通信。     

基于虚拟曝光图像的立体高动态范围图像合成算法

本文提出基于多视点多曝光图像的立体高动态范围图像合成算法。首 先,考虑多视点多曝光 图像以及相机响应函数曲线的特性,提出一种虚拟曝光图像绘制算法,将不同曝光的图像绘 制到同一视点;然后, 为了使绘制曝光图像保留更多细节和结构,需要对绘制虚拟曝光图像进行空洞填补及边缘修 复,故引入了边缘差值 掩膜图,对图像边缘信息进行校正平滑处理;最后利用绘制的虚拟曝光图像合成立体高动态 范围图像。实验结果表 明,获得的绘制曝光图像与参考曝光视点图像之间的结构相似性高达0.99以上,且合成的 高动态范围图像质量高。     

倒装晶片装配工艺及其对表面贴装设备的要求

随着市场对于电子产品特别是消费型电子产品持续要求越来越高,要求其短小轻薄、功能高度集成、价格更加便宜、储空间更大,元件的小型化高密度封装形式越来越多,如多模块封装（MCM）、系统封装（SiP）、倒装晶片（FC）等应用得越来越多。这些技术的出现更加模糊了一级封装与二级装配之间的界线,勿庸置否,随着小型化高密度封装的出现,对高速与高精度装配的要求变得更加关键。相关的组装设备和工艺也更具先进性与高灵活性。由于倒装晶片比BGA或CSP具有更小的外形尺寸,更小的球径和球间距,它对植球工艺、基板技术、材料的兼容性、制造工艺以及检查设备和方法提出了前所未有的挑战。     

Impression creep characterization of 90Pb-10Sn microelectronic solder balls at subsolvus and supersolvus temperatures

The creep behavior of Pb-10wt.%Sn, a common high-lead solder used in microelectronic packaging, was studied by impression creep testing of ball-gridarray (BGA) solder balls attached to an organic substrate, both above and below the solvus temperature (408 K). Below the solvus temperature, the solder microstructure consists of roughly equiaxed grains of the Pb-rich solid solution α, which contains <5wt.%Sn in solution, with a coarse dispersion of Sn-rich β precipitates. Here, the creep behavior of the solder is controlled by dislocation climb via dislocation core diffusion, yielding n≈4 and Q≈60 kJ/mole. Above the solvus temperature, where the entire 10wt.%Sn is in solution, the creep mechanism becomes controlled by viscous glide of dislocations, limited by solute drag, with n≈3 and Q≈92 kJ/mole. Based on experimental data, creep equations for the as-reflowed solder in the two temperature regimes are given. Comparison of the present data with those available in the literature showed good agreement with the proposed laws.     

Numerical Simulation of Pulse Shortening in RBWOs

Pulse shortening hinders improvement of microwave output energy for high power microwave tubes. So far, it is also an unresolved problem in the field of high power microwave devices.In this paper, relativistic backward wave tube (RBWO) is treated as an example to study the pulse shortening phenomena. The influences of gas existing in the tube and explosive emission in inner surface of RBWO are all investigated by means of the particle-in-cell method. Through the simulation results, it can be predicted that the background gas in the tube is one but not the most important factor resulting in pulse shortening, in order to broaden the pulse width of gas-filled RBWO, the pressure of the filled gas must be controlled in a proper value. The explosive emission in the surface of slow wave structure due to intense electric field is one of the most important factors causing pulse shortening in high power microwave tube.Some methods to overcome this kind of explosive emission are also given.     

列阵透镜对能量测量影响的分析

结合列阵透镜的透过率分析了其后的光场分布。列阵透镜由多个列阵元拼接而成，用以改善主透镜焦点附近能量分布的均匀性。列阵透镜在提高辐照均匀性的同时，给能量测量带来了不利的影响。这是由于经过列阵元的相邻子光束会产生干涉，干涉条纹处的激光能量密度和功率密度相应都大为增加，其数值在干涉区域中心处能上升到原来的4倍。更高的能量密度和功率密度对能量计提出了更苛刻的要求。在没有采取适当措施的时候使用，就会损坏能量计。     

一种新的红外连续变焦系统无热化设计方法

针对红外连续变焦系统受温度影响导致变焦曲线变化、调焦补偿复杂等问题,分析了温度变化时系统各组件的相互关系,提出一种新的无热化方法,通过变倍组和补偿组的局部无热化设计,使系统仅通过变倍组和补偿组的线性平移就能对温度影响进行补偿,变焦曲线不需改变,降低了调焦机构的控制难度。采用该方法设计了12倍中波红外连续变焦系统,通过局部无热化设计,仅通过一组变焦曲线以及随温度的线性平移,实现在25~300 mm焦距范围、-45~50 ℃的全温度范围在30 lp/mm的MTF在0.3左右,接近衍射极限水平。具有连续变焦、高变倍比、变焦曲线无热化、分辨率高、结构简单、控制系统简化等优点。     

Direct Writing Micropatterns with a Resolution up to 1 µm

Solution processes have been widely used to fabricate micropatterned surfaces for its mild operation conditions. However, current approaches suffer from limitations of either low resolution or high cost. Here, a facile approach is proposed for direct writing micropatterns with a resolution up to ≈ 1 µm using a unit of triple conical fibers with the side‐by‐side parallel arrangement. With this unit, the resolution of the micropatterns can be mainly controlled by the single central conical fiber, with one side of the fiber facilitating continuous and steady liquid transfer onto the substrate and the other side mechanically supporting the whole unit. Particularly, the unit enables tunable dimension of the micropatterns within a rather large scale from ≈ 1 µm to ≈ 1.3 mm by varying the writing parameters (speed, height, and angle). Moreover, the unit is applicable for direct patterning various liquids, even into microline arrays, with a high resolution. It enables direct writing conductive microline with a width of ≈ 1 µm in a centimeter length scale, which can be used for constructing microcircuits. It is envisioned that the result offers a new perspective for preparing high‐resolution micropatterns using solution processes.