All‐Carbon Nanotube‐Based Flexible Field‐Emission Devices: From Cathode to Anode

The fabrication of a flexible field‐emission device (FED) using single‐walled carbon nanotube (SWNT) network films as the conducting electrodes (anode and cathode) and thin multi‐walled CNT/TEOS hybrid films as the emitters is reported. P‐type doping with gold ions and passivation with tetraethylorthosilicate (TEOS) made the SWNT network film highly conductive and environmentally stable, and hence a good alternative to conventional indium tin oxide electrodes. CNT/TEOS hybrid emitters showed high current density, low turn‐on field, and long‐term emission stability, compared with CNT emitters; these characteristics can be attributed to the TEOS sol, acting both as a protective layer surrounding the nanotube tip, and as an adhesive layer enhancing the nanotube adhesion to the substrate. All‐CNT‐based flexible FEDs fabricated by this approach showed high flexibility in field emission characteristics and extremely bright electron emission patterns.     

端环氧基聚丁二烯的合成研究

以端羟聚丁二烯(HTPB)为引发剂,三氟化硼乙醚为催化剂,环氧氯丙烷为单体,发生阳离子开环聚合反应,形成两端为氯化聚醚的聚丁二烯(CTPB).在碱性条件下,CTPB发生关环反应形成端环氧基聚丁二烯(ETPB).讨论了NaOH/CTPB摩尔比、反应温度和反应时间对CTPB关环反应的影响.ETPB环氧值为0.549.考察了...     

基于环氧树脂的低红外发射率材料研究

将环氧树脂与对醇酸清漆、聚氨酯清漆、酯胶清漆在红外性能、力学性能和耐化学性能方面进行比较,在红外性能差别不大的条件下,环氧树脂的力学性能和耐化学试剂性能优势突出,是制备红外复合涂层的理想粘合剂。对环氧树脂掺杂平均粒径48μm片状铝粉,对不同铝粉质量分数和不同厚度的涂层进行测试和表征。结果表明,以环氧树脂为基体制备出的低红外发射率材料,在铝粉质量分数为30%,漆膜厚为30～45μm时,红外发射率为0.25。     

导电胶粘剂的研究进展

随着微电子技术的发展以及环保意识的增强,作为Pb/Sn焊料替代物的导电胶粘剂,已成为当前研究的热点和重点。介绍了导电胶粘剂的导电机理及其组成、功能和分类。重点概述了近年来国内外导电胶粘剂的研究现状,并展望了未来导电胶粘剂的研究方向。     

银粉形貌及表面处理对导电胶性能的影响

利用四点探针和电子万能试验机分别测定了同种树脂体系中不同银粉形貌及银粉表面处理下导电胶的体积电阻率和剪切强度,探索了银粉含量、形状尺寸及表面处理对导电胶性能的影响规律.     

导电银胶触变性的研究

以环氧树脂为基体,银粉为填料,制备出IC封装用导电银胶。研究了环氧树脂与银粉的比例、银粉的形貌和粒径以及触变剂SiO2的用量对导电银胶触变性的影响。结果表明,银胶触变性随树脂/银粉质量比的减小而增大,当其为0.2时,触变指数达到5.68。在一定粒径范围内,银胶的触变性与银粉粒径呈反比关系;银胶触变性随SiO2的用量增大而增大。     

适合批量生产的GaAs数字IC背面金属化工艺

当前,IC逐步向高集成度、高密度、多功能方向发展,管芯尺寸也在增大;剪切力是器件考核的基本项目,随管芯面积的增大而增大,这就对背面金属化可靠性提出了较高的要求.本文通过分析、实验、分析改进的方法,提出了适合批量生产又兼顾成本因素的数字背面金属化工艺,使背面金属化性能满足了器件可靠性要求.     

大功率扬声器与功率有关的若干问题

在大功率扬声器设计中音圈线径设计是关键。从介绍音圈线径与功率的关系开始,谈到最大振幅(位移)及各注意要点,最后介绍了大功率扬声器用胶粘剂的一些使用问题。     

Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications

A highly reliable conductive adhesive obtained by transient liquid‐phase sintering (TLPS) technologies is studied for use in high‐power device packaging. TLPS involves the low‐temperature reaction of a low‐melting metal or alloy with a high‐melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag‐coated Cu, a Sn96.5‐Ag3.0‐Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 °C, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.     

基于工控机和VC的点阵布胶

介绍一种采用螺杆泵式点胶器的接触式布胶试验装置,论述了装置的系统组成及功能,针对系统中的关键组成部分—z轴的运行模式进行了深入的分析和研究;通过VC++6.0设计的用户界面,设定有关参数以控制x、y运动平台、z轴的运动和挤胶过程,达到了应用的要求。