CO_2激光合成陶瓷的研究

本文介绍了用CO_2激光合成Al_2O_3、Al_2O_3-5％mol Cr_2O_3固熔体,Al_2O_3-20％wtZrO_2(+3％molY_2O_3)混合体和Al_2(WO_4)_3陶瓷材料的方法。激光合成的Al_2(WO_4)_3为Al_2O_3-WO_3二元平衡相图中不存在的新化合物。对激光合成的陶瓷材料进行了组织形貌分析,并测量了其显微硬度,发现用激光合成的陶瓷较用昔通工艺制备的同种陶瓷有更高的硬度。     

复合环境下辨识陀螺误差模型的试验设计

过载振动复合环境对惯性仪表的测量误差有很大的影响。文中采用分析和试验相结合的方法，根据D-最优准则，进行了标定误差模型的试验优化设计，确定了十二位置试验法。利用该方法能够达到测试点数最少。     

Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds

Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to produce compressive stress in Sn electrodeposits and cause the growth of Sn whiskers. To determine if interfacial IMC is a requirement for whisker growth, bright Sn and a Sn-Cu alloy were electroplated on a tungsten (W) substrate that does not form interfacial IMC with the Sn or Cu. At room temperature, conical Sn hillocks grew on the pure Sn deposits and Sn whiskers grew from the Sn-Cu alloy electrodeposits. These results demonstrate that interfacial IMC is not required for initial whisker growth.     

环氧塑封料的性能和应用研究

介绍了环氧塑封料的国内外发展概况,着重论述了其物理性能、机械性能、热性能、导热性能、电性能、化学性能、阻燃性能、贮存性能、封装性能,以及应用中封装工艺、缺陷的解决办法,并就发展前景发表了自己的看法.     

改善经编复合灯箱布横向模量的研究

分析了导致经编复合灯箱布的衬纬纱屈曲的原因,通过改变骨架织物结构和与ＰＶＣ热粘合过程提高灯箱布的横向模量,从而改善国产灯箱布的使用质量。     

Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations

The effect of moderate electric current density (1 × 10³ to 3 × 10³ A/cm²) on the mechanical properties of Ni-P/Sn-3.5Ag/Ni-P and Ni/Sn-3.5Ag/Ni solder joints was investigated using a microtensile test. Thermal aging was carried out at 160°C for 100 h while the current was passed. The interfacial microstructure and intermetallic compound (IMC) growth were analyzed. It was found that, at these levels of current density, there were no observable voids or hillocks. Samples aged at 160°C without current stressing failed mostly inside the bulk solder with significant prior plastic deformation. The passage of current was found to cause brittle failure of the solder joints and this tendency for brittle failure increased with increasing current density. Fractographic analysis showed that, in most of the electrically stressed samples, fracture occurred at the interface region between the solder and the joining metals. The critical current density that caused brittle fracture was about 2 × 10³ A/cm². Once brittle fracture occurred, the tensile toughness, defined as the energy per unit fractured area, was usually lower than ~5 kJ/m², compared with the case of ductile fracture where this value was typically greater than ~9 kJ/m². When comparing the two types of joint, the brittle failure was found to be more severe with the Ni than with the Ni-P joint. This work also found that the passage of electric current affects the IMC growth rate more significantly in the Ni than in the Ni-P joint. In the case of the Ni joint, the Ni₃Sn₄ IMC at the anode side was appreciably thicker than that formed at the cathode side. However, in the case of electroless Ni-P metallization, this difference was much smaller.     

激光诱导Al等离子体连续辐射研究

分析了Ａｌ等离子体连续辐射特征。根据连续辐射强度的同时分布,简要讨论了激光诱导等离子了体连续辐射的产生机理。我们认为激光诱导等离子体的连续辐射的主要机制提轫致辐射和复合辐射。在激光脉冲作用到靶上的瞬间,轫致辐射占主导地位,在等离子体演化初期,复合辐射和轫致辐射共同产生等离子体连续辐射,在等离子体演化后期,连续辐射主要是轫致辐射产生的。     

A MEANS TO REDUCE FORMATION OF PRECURSORS OF 2-TRANS-NONENAL IN BREWING*

A method is described whereby the precursors of 2-trans-nonenal may be estimated in worts and beers. Treatment of malt grist or malt with a variety of polar substances is shown to reduce or eliminate the production of nonenal precursors during mashing. Beers made from worts so treated have enhanced flavour stability over those made conventionally.     

Noun Sense Identification of Korean Nominal Compounds Based on Sentential Form Recovery

In a machine translation system, word sense disambiguation has an essential role in the proper translation of words when the target word can be translated differently depending on the context. Previous research on sense identification has mostly focused on adjacent words as context information. Therefore, in the case of nominal compounds, sense tagging of unit nouns mainly depended on other nouns surrounding the target word. In this paper, we present a practical method for the sense tagging of Korean unit nouns in a nominal compound. To overcome the weakness of traditional methods regarding the data sparseness problem, the proposed method adopts complement‐predicate relation knowledge that was constructed for machine translation systems. Our method is based on a sentential form recovery technique, which recognizes grammatical relationships between unit nouns. This technique makes use of the characteristics of Korean predicative nouns. To show that our method is effective on text in general domains, the experiments were performed on a test set randomly extracted from article titles in various newspaper sections.     

Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder

Long-term, solid-state intermetallic compound (IMC) layer growth was examined in 95.5Sn-3.9Ag-0.6Cu (wt.%)/copper (Cu) couples. Aging temperatures and times ranged from 70°C to 205°C and from 1 day to 400 days, respectively. The IMC layer thicknesses and compositions were compared to those investigated in 96.5Sn-3.5Ag/Cu, 95.5Sn-0.5Ag-4.0Cu/Cu, and 100Sn/Cu couples. The nominal Cu₃Sn and Cu₆Sn₅ stoichiometries were observed. The Cu₃Sn layer accounted for 0.4–0.6 of the total IMC layer thickness. The 95.5Sn-3.9Ag-0.6Cu/Cu couples exhibited porosity development at the Cu₃Sn/Cu interface and in the Cu₃Sn layer as well as localized “plumes” of accelerated Cu₃Sn growth into the Cu substrate when aged at 205°C and t>150 days. An excess of 3–5at.%Cu in the near-interface solder field likely contributed to IMC layer growth. The growth kinetics of the IMC layer in 95.5Sn-3.9Ag-0.6Cu/Cu couples were described by the equation x=x_o+Atⁿexp [−ΔH/RT]. The time exponents, n, were 0.56±0.06, 0.54±0.07, and 0.58±0.07 for the Cu₃Sn layer, the Cu₆Sn₅, and the total layer, respectively, indicating a diffusion-based mechanism. The apparent-activation energies (ΔH) were Cu₃Sn layer: 50±6 kJ/mol; Cu₆Sn₅ layer: 44±4 kJ/mol; and total layer: 50±4 kJ/mol, which suggested a fast-diffusion path along grain boundaries. The kinetics of Cu₃Sn growth were sensitive to the Pb-free solder composition while those of Cu₆Sn₅ layer growth were not so.