盛钢桶铝锆碳滑板的研究与生产

通过研究,在盛钢桶用铝锆碳滑板的生产过程中,调整了ZrO2的加入量,添加了复合抗氧化剂,使滑板具用较高的强度和抗氧化性能,提高了滑板的使用寿命.     

高层建筑损伤识别中的补偿算法

本文在已有研究工作的基础上，提出了处理激励测量信息不完备情况下的补偿算法。此方法主要针对高层建筑动力检测中强迫激励的情况，是一种基于时域的识别方法，该方法实际上是利用客观工程实际中结构系统激励所具有的物理持征作为识别计算的辅助条件，来解决测量信息的不完备性问题。算例分析表明了该方法的可行性。     

1,4,5,8-四氮杂氢化萘（2,3,-6,7）并双呋咱衍生物的合成

由1，4，5，8—四氮杂氢化萘(2，3，-6，7)并双呋咱经羟甲基化、酰化、硝化和叠氮化等反应合成出一系列热稳定的呋咱含能衍生物，并以^1HNMR、IR、MS、元素分析鉴定了其结构。     

Microstructure and thermal behavior of Sn-Zn-Ag solders

The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73–9% Zn and 0–3.0% Ag. The scanning electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis results indicate that Ag₅Zn₈ and AgZn₃ become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%. Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0% to 3.0%     

Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates

The morphologies of intermetallic compounds formed between Sn-Zn based solders and Cu substrates were investigated in this study. The investigated solders were Sn-9Zn, Sn-8.55Zn-0.45Al, and Sn-8.55Zn-0.45Al-0.5Ag. The experimental results indicated that the Sn-9Zn solder formed Cu₅Zn₈ and CuZn₅ compounds on the Cu substrate, while the Al-containing solders formed the Al_4.2Cu_3.2Zn_0.7 compound. The addition of Ag to the Sn-8.55Zn-0.45Al solder resulted in the formation of the AgZn₃ compound at the interface between the Al_4.2Cu_3.2Zn_0.7 compound and the solder. Furthermore, it was found that the cooling rate of the specimen after soldering had an effect on the quantity of AgZn₃ compound formed at the interface. The AgZn₃ compound formed with an air-cooling condition exhibited a rougher surface and larger size than with a water-quenched condition. It was believed that the formation of the AgZn₃ compound at the interface occurs through heterogenous nucleation during solidification.     

含有复合阻尼结构的压力波制冷机振荡管内流动分析

通过对含有复合阻尼结构的压力波制冷机振荡管内的流场分析，详细讨论了激波在接受管内的行为，数值计算同时表明：含有两道复合阻尼结构加上激波吸收腔完全可以将激波降低到工程上可以接受的程度。     

Study on Preparation and Application of Ti／Si Complex Zeolite

A Ti/Si complex zeolite has been prepared. X-ray diffraction and infrared spectrometry study has shown that two structures, namely the ZSM-5 and MCM-41, exist in the sample. BET tests have revealed that the complex zeolite contains regular mesopores of 2.6 nm. Ultraviolet spectrometry analysis has shown that the Ti species exist in the zeolite skeleton in the form of tetra-coordinate valence. The Ti/Si complex zeolite (TS-1/Ti-MCM-41) has apparently improved catalytic activity with respect to the macromolecular organic compound oxidation as compared to individual components of either Ti or Si containing zeolites (TS-1 and Ti-MCM-41).     

多面体含能材料的爆速和爆压预估

当采用R-P经验方法预估多硝基笼状化合物最大理论密度下爆速和爆压时,需要修正F因子中与分子结构有关的A/3项,使F因子包含有来自笼状分子高晶体密度和分子内部高张力能的贡献。与K-J方法相比,改进R-P方法既保持了原式的优点,又使预估结果获得明显改善。把K-J方法预估结果作为基础数据,利用改进R-P方法估算25种多硝基笼状化合物的爆速和爆压,结果表明该方法的相对误差分别为±1.9％和±5.2％。而用R-P方法时,预估爆速和爆压的相对误差分别为±14.0％和±21.4％。     

Microstructure evolution of nanostructured Ni3Al during annealing

A nanocrystalline layer was produced on the surface of Ni3Al intermetallic by means of surface mechanical attrition treatment. The surface nanocrystallites were annealed at 250-750 ℃ for 30 min. Microstructure evolution of nanocrystallites during annealing was studied by X-ray diffraction （XRD） and transmission electronic microscope （TEM）. The experimental results show that long-rang order recovers rapidly when annealing temperature is below 250℃ and changes slowly at 350-550 ℃, and then it increases rapidly at 750℃. The grain size of nanocrystallites of Ni3Al keeps stable and crystal defects recover when they are annealed below 550℃. The grains grow normally in low temperature annealing and abnormal growth occurs at 750℃.     

颗粒增强TiAl基复合材料及其Si的韧化作用研究EI

运用ＸＤ工艺制备了颗粒增强ＴｉＡｌ基复合材料。增强颗粒均匀分布于ＴｉＡｌ基体中并细化ＴｉＡｌ合金。通过在ＴｉＢ_２／ＴｉＡｌ、ＴｉＣ／ＴｉＡｌ复合材料中加入适量的Ｓｉ，颗粒增强ＴｉＡｌ基复合材料的室温延性得到了改善。