金属/陶瓷发热体钎焊接头的残余应力分析

采用热弹塑性有限元方法,在考虑了材料性能参数随温度变化情况下,分析了采用Ag—Cu—Ti钎料钎焊A12O3陶瓷与Ni金属丝的钎焊接头,在钎焊和随后再次加热过程中产生的应力大小和分布情况,计算中着重考虑了钎料对接头残余应力的影响。分析结果表明,在钎料与陶瓷的界面处存在着较大的残余拉应力,影响了钎焊接头的连接强度,并可能在界面的陶瓷侧产生裂纹。通过试验对比,认为在此类连接结构中,钎料是造成接头形成较大残余应力的主要因素。同时。选择合适厚度的钎料会降低钎焊接头的残余应力,改善接头连接强度。     

基于体全息的光电混合虹膜识别系统的研究

对基于体全息的光电混合虹膜识别系统进行了研究,采用基于联合最优小波包基的特征图像相关识别方法实现虹膜的光学识别。生成联合最优小波包基的特征图像以压缩存储的模板图像库,降低后处理数据量。改进最优小波包基优选标准,使所选最优基获得最大识别能力。采用统计特征识别的后处理方法使光电混合识别系统具有更好的适应性。系统仿真结果表明,所提出的系统既具有光学运算和体全息相关的高并行性,又具有计算机数值计算的高精度,获得了良好的识别效果。     

实现小波变换图像识别的光电混合实验系统

本文依据联合变换相关器,设计一套实现小波变换图像识别的光电混合实验系统,联合变换功率谱及相关输出强度分布分别用CCD采集并输入计算机进行处理,证明小波变换可以明显改善光学图像相关识别能力;同时,该系统提高了光学相关识别实验的灵活性和可操作性。     

一种基于干扰重构的自适应干扰对消算法

从干扰信号的波束域和时域特征入手,建立了基于四阶累积量联合对角化的干扰估计模型,提出了联合干扰重构和自适应对消的主瓣干扰抑制算法,给出了处理流程和工程应用条件,分析了干扰重构的相对误差,对信噪比损失性能进行了仿真分析,同时评估了对测角性能的影响。仿真结果表明,在干噪比大于40 dB、干扰与目标夹角大于1/8 波束宽度的条件下,该算法可有效抑制主瓣干扰,其重构的干扰信号与真实干扰信号相对误差小于2% ,干扰抑制后目标回波信噪比损失小于3 dB,测角精度恶化小于波束宽度的1/30。     

基于比累对切透镜的联合菲涅耳变换相关器特性研究

相关器的特性变化规律对其实际应用中参数的设定具有重要的指导意义。针对基于比累对切透镜的联合菲涅耳变换相关器,通过数值仿真详细分析了比累对切透镜缝宽变化对相关器输出特性和空变特性的影响。结果表明,比累对切透镜缝宽能一定程度地控制联合菲涅耳变换功率分布的有效面积、相关峰的尖锐度及其空变特性的敏感度。实验采用纯相位空间光调制器编码比累对切透镜相位掩模替代实体透镜的方式搭建了相关器,实验结果与仿真结果一致性好,进一步验证了上述结论的正确性。     

Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints

The shear strength of ball-grid-array (BGA) solder joints on Cu bond pads was studied for Sn-Cu solder containing 0, 1.5, and 2.5 wt.% Cu, focusing on the effect of the microstructural changes of the bulk solder and the growth of intermetallic (IMC) layers during soldering at 270°C and aging at 150°C. The Cu additions in Sn solder enhanced both the IMC layer growth and the solder/IMC interface roughness during soldering but had insignificant effects during aging. Rapid Cu dissolution from the pad during reflow soldering resulted in a fine dispersion of Cu₆Sn₅ particles throughout the bulk solder in as-soldered joints even for the case of pure Sn solder, giving rise to a precipitation hardening of the bulk solder. The increased strength of the bulk solder caused the fracture mode of as-soldered joints to shift from the bulk solder to the solder/IMC layer as the IMC layer grew over a critical thickness about 1.2 m for all solders. The bulk solder strength decreased rapidly as the fine Cu₆Sn₅ precipitates coarsened during aging. As a consequence, regardless of the IMC layer thickness and the Cu content of the solders, the shear strength of BGA solder joints degraded significantly after 1 day of aging at 150°C and the shear fracture of aged joints occurred in the bulk solder. This suggests that small additions of Cu in Sn-based solders have an insignificant effect on the shear strength of BGA solderjoints, especially during system use at high temperatures.     

Application of an asymmetrical four point bend shear test to solder joints

The asymmetrical four-point bend shear (AFPB) test method was used to measure the shear strength and creep properties through the stress relaxation experiments using three different Pb-free solder joint compositions in an assolidified condition. Since it was difficult to shear the uniform specimens and the local bending usually occurs at the inner loading points, the notches were introduced at the joint line to preferentially weaken this region. The stress analysis by finite element modeling showed that the straight notches transform the parabolic shear stress distribution in the uniform specimen into a relatively uniform shear distribution along the bond line in the notched specimens. Therefore, the shear strength results from the notched specimens are expected to be much more accurate. Experiments showed that both the Sn-3.6Ag-1Cu (wt.%) and Sn-3.6Ag-1Cu-0.45Co joints have superior strength and creep properties as compared to the Sn-3.5Ag joint. However, there was no statistical difference between the shear strength of the Sn-3.6Ag-1Cu and Sn-3.6Ag-1Cu-0.45 Co joints. Moreover, the difference between the creep resistance of these two types of joints was small.     

SMT焊点质量自动检测与智能鉴别技术

在分析SMT焊点组装质量常用检测技术的基础上,提出并介绍了基于SMT焊点虚拟成形技术的SMT焊点质量自动检测与智能鉴别技术的基本原理和方法,并对该技术的研究意义、主要研究内容和研究思路等进行了探讨。     

基于小波包变换与自适应阈值的SMT焊点图像去噪

为提高表面组装技术焊点图像去噪效果,提出一种基于小波包变换和自适应阈值的焊点图像噪声去除新方法.利用小波包变换对图像进行多层分解,通过对图像小波包树系数的分析,对小波包树系数高频部分和低频部分进行Wiener滤波;为提高去噪性能,通过计算小波包系数对应的中值绝对方差估计,提出一种改进的自适应小波包阀值算法,并对图像进行...     

发电机定子绕组接头焊接质量检测方法及判断标准

通过对鲁布革电厂发电机定子绕组接头焊接质量检测分析,探讨了接头焊接质量检测方法及判断标准。