Layout-Specific Circuit Evaluation in 3-D Integrated Circuits

In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit are fabricated on different wafers, and then, the wafers are bonded with a glue layer of Cu or polymer based adhesive. Using our layout methodology, designers can layout such 3D circuits with necessary information on inter-wafer via/contact and orientation of each wafer embedded in the layout. We have implemented the layout methodology in 3DMagic. Availability of 3DMagic has led to interesting research with a wide range of layout-specific circuit evaluation, from performance comparison of 2D and 3D circuits to layout-specific reliability analyses in 3D circuits. Using 3DMagic, researchers have designed and simulated an 8-bit encryption processor mapped into 2D and 3D FPGA layouts. Moreover, the layout methodology is an essential element of our ongoing research for the framework of a novel Reliability Computer Aided Design tool, ERNI-3D.     

Thermomechanical stress fields in high-temperature fibrous composites. I: Unidirectional laminates

This two-part paper presents a closed-form procedure for evaluation of estimates of local thermomechanical stress fields in two-phase fibrous composites and laminates. The first part is concerned with a unidirectional elastic laminate subjected to uniform mechanical loads and to uniform changes in temperature. Both phases are assumed to be elastic, with temperature-dependent moduli and expansion coefficients; the solution reflects the influence of thermomechanical interactions. Exact solutions are not possible for any real system, because the local geometry is not known in detail. Instead, estimates of the fields are found from a modified Mori-Tanaka approximation. Examples are presented for two SiC/Ti---Al---Nb composites. Local stresses of interest are found after cooling from fabrication to room temperature. The presence of local yielding, and the influence of coupling terms on the local stress magnitudes are examined. Extension of the results to laminated plates is presented in Part II (Dvorak, G.J., Chen, T. & Teply, J., Composites Science and Technology, 43 (1992) 359–368, this issue).     

论住宅中的厨房设计

从多方面论述厨房设计中应遵循的原则及注意事项，以期对我国目前城市住宅建设中的厨房设计有所启示。     

大中型污水处理厂的设计

通过对广州市猎德污水处理厂的介绍，说明本工程厂区平面根据规划用地、工艺流程、外部及内部环境因地制宜进行布置，建筑立面造型综合考虑厂房的不同使用功能，力求打破以往的工业建筑模式，建成处处以人为本的生态花园式厂房。     

黑白电视机的电磁兼容设计

本文结合我厂μPC三片机的设计布局,探讨黑白电视机电路的电磁兼容设计。通过理论计算,提出中放屏蔽材料选择的理论依据。     

浅谈不同时期南非政府办公建筑的发展特征

南非的社会发展经历了殖民主义统治时期，种族主义统治时期和民主政府统治时期3个历史阶段。社会体制的变化深深影响了南非建筑的发展。尤其体现在政府办公建筑的形式上，本文按照历史发展的顺序，通过列举实例的方式，分别对这3个时期政府办公建筑的风格与布局牲进行了的探讨。     

解放思想 与时是 创新技术 加强管理 为实现油田高水平高效益开发而奋斗—在2001年度大庆油田有限责任公司开发技术座谈会上的讲话

对大庆油田2001年开发技术工作进行了总体评价，分析了油田开发所面临形势和存在的问题，提出的200年油田开发工作总体思路和目标是：紧紧围绕“高水平，高效益，可持续发展”的工作方针，认真按照“发展稳油控水技术，加快三次采油研究步伐，深化油藏地质研究，优化规划方案设计，强化油田科学管理，提高开发总体效益”的要求，进一步解放思想，与时俱进，突破四人束缚，创新九项技术，强化六项管理，加强队伍建设，把油田开发工作推向一个新的水平。     

AutoCAD在更改连铸设备布局设计中的应用

将AutoCAD应用到更改连铸设备布局设计中，可使更改过程一目了然。