反应器和钢烟囱整体吊装的难点和对策

介绍了在金陵石化炼油厂200万t/a柴油加氢装置建设中,将质量为237t的反应器和高60m的钢烟囱成功进行整体吊装过程中的关键技术.通过此项工程实践得出以下结论象钢烟囱这样细长重物的整体吊装,由两台吊车抬立起后,再由主吊车独立吊装就位的施工方法简单易行,安全可靠,应用范围广;结构复杂细长杆的吊装强度和挠度计算比较复杂,在计算过程中可以忽略部分次要件的质量,分别以两吊点为支点计算上下吊点所受的力,然后再按比例放余量,使两吊点受力之和等于细长杆的重力,计算挠度时,可以适当地把问题夸大化,从而建立近似的力学模型;高压厚壁重型容器的吊装,宜直接设置专门吊盖与大法兰用螺栓把紧起吊;施工现场地基坚实是保证吊车站位和吊装施工的前提条件.     

基于遗传算法的优化排样

介绍了遗传算法以及二维不规则图形的计算机优化排样，研究了二维不规则图形排样中如何建立遗传算法的目标函数，如何实现交叉、变异运算等优化过程，找到了运用遗传算法实现二维不规则图形优化排样的方法。通过计算机编制了运用遗传算法进行二维不规则图形优化排样的运算程序，并对部分样形进行了优化排样，结果比较满意。     

32位MIPS微处理器中乘法器的设计和实现

在Booth算法的基础上,结合MIPS 4KC微处理器中的流水线结构和乘法器的工作过程,提出了一种改进的Booth乘法器的设计方法,并采用全制定方法实现,用这种方法实现的乘法器单元具有面积小、单元电路可重复性好、版图设计工作量小、功耗低等特点.     

Facility layout problems: A survey

Layout problems are found in several types of manufacturing systems. Typically, layout problems are related to the location of facilities (e.g., machines, departments) in a plant. They are known to greatly impact the system performance. Most of these problems are NP hard. Numerous research works related to facility layout have been published. A few literature reviews exist, but they are not recent or are restricted to certain specific aspects of these problems. The literature analysis given here is recent and not restricted to specific considerations about layout design.

We suggest a general framework to analyze the literature and present existing works using such criteria as: the manufacturing system features, static/dynamic considerations, continual/discrete representation, problem formulation, and resolution approach. Several research directions are pointed out and discussed in our conclusion.     

浅谈书籍装帧设计

“佛靠金装，人靠衣装”。封面设计是书籍装帧设计的重要内容。封面设计要体现书的内容、性质、色彩要考虑读书对象、文化层次，装帧设计给人以美的感觉。     

给水铜管分水布置的支管缩径可行性分析

住宅给水铜管分水布置是一种技术可行、经济合理的管道布置方式。在确定了管道的设计要求后,分析了分水缩径后的流速情况,明确了分水布置方式中支管缩径的技术状况。分析表明,支管缩径是可行的。     

利用相对坐标轻松完成网格袋布局

网格袋布局管理器是java布局中最有用、最灵活、最复杂、最难掌握的一种布局管理器,实际上,如果我们明白了在布局时它利用了单元格相对坐标定位这一点,以及各个约束条件在布局中的作用,网格袋布局也会变得很轻松。     

Layout-Specific Circuit Evaluation in 3-D Integrated Circuits

In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit are fabricated on different wafers, and then, the wafers are bonded with a glue layer of Cu or polymer based adhesive. Using our layout methodology, designers can layout such 3D circuits with necessary information on inter-wafer via/contact and orientation of each wafer embedded in the layout. We have implemented the layout methodology in 3DMagic. Availability of 3DMagic has led to interesting research with a wide range of layout-specific circuit evaluation, from performance comparison of 2D and 3D circuits to layout-specific reliability analyses in 3D circuits. Using 3DMagic, researchers have designed and simulated an 8-bit encryption processor mapped into 2D and 3D FPGA layouts. Moreover, the layout methodology is an essential element of our ongoing research for the framework of a novel Reliability Computer Aided Design tool, ERNI-3D.     

山坡建厂与高台段的划分——荻港海螺水泥有限公司工程总体局与竖向设计

通过荻港海螺水泥有限公司(2×2500t/d)工程设计、建成投产的实践,阐述了水泥厂建在山坡上的厂址选择,总体规划布局,厂内道路最大坡度确定,高台段划分及边坡爆破,场地整平压实,护坡挡墙与厂房土建基础埋深等技术问题的处理方法,总结其设计成功的经验和不足之处,为同类型工厂总图布置提供借鉴.