高层印制线路板正面临的对位挑战

封装工业正在推动着印制线路板技术水平朝着半导体要求的方向发展。高密度印制线路板正广泛用于网络路由器、自动测试设备和服务器领域。高密度要求(>150 IO/cm~2)正成为客户的普通需求。为满足现有的高密度封装要求,由于线宽、线距和通孔孔径正接近传统制作极限,普遍的方法就是不断增加印制线路板的层数。这些特征正驱动着印制线路板在基材、图像转移、蚀刻、电镀、阻焊、测试流程和对位系统的变化。此文主要讲述了印制线路板特性的变化趋势和利用对位模式和雷利分布去预测满足高级对位要求的能力以及印制线路板各流程中有关对准度的控制要点。     

High‐pressure processing effects on the mechanical,barrier and mass transfer properties of food packaging flexible structures: a critical review

Food products can be high‐pressure processed (HPP) either in bulk or prepackaged in flexible or semi‐rigid packaging materials. In the latter case the packaging material is subjected, together with the food, to high‐pressure treatment. A number of studies have been performed to quantify the effects of high‐pressure processing on the physical and barrier properties of the packaging material, since the integrity of the package during and after processing is of paramount importance to the safety and quality of the food product. This article reviews the results of published research concerning the effect of HPP on packaging materials. Copyright © 2004 John Wiley & Sons, Ltd.     

纳米陶瓷的制备

纳米陶瓷材料可显著降低材料的烧结致密化程度,节约能源;并可改善陶瓷材料的性能,提高其使用可靠性。主要介绍了纳米陶瓷的制备方法,包括纳米陶瓷粉体的制备、成型和烧结。     

Green and self-lubricating polyoxymethylene composites filled with low-density polyethylene and rice husk flour

Polyoxymethylene (POM) composites filled with low-density polyethylene (LDPE) and rice husk flour (RHF) were prepared by injection molding. The POM/5 wt % LDPE/7.5 wt % RHF composite exhibited the lowest wear rate, whereas the coefficient of friction remained low, and the POM/5 wt % LDPE/5 wt % RHF composite had the best mechanical properties. X-ray diffraction analysis was carried out, and the worn surfaces were examined with scanning electron microscopy. The results showed that the addition of the filler reduced the crystallinity degree of the POM composites. The main wear mechanism for unfilled POM was adhesion, whereas for the POM composites, wear seemed to occur mainly by fatigue and abrasion. It was experimentally confirmed that the POM composite filled with LDPE and RHF, which is well-performing, low-cost, and environmentally friendly, could be a potential material for tribological applications. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

4F0.06AC树脂吹塑薄膜技术的探讨

在加工应用试验的基础上。探讨了加工温度、吹胀比、超想线高度及设备对４Ｆ０．０６ＡＣ薄膜适宜的加工条件。     

Advances in titanium metal injection molding

The approaches to production of titanium powder injection molded parts are reviewed. Historically, oxygen levels have been too high for structural use (particularly with the Ti-6Al-4V alloy). However, recent advances in starting powders, binders and sintering facilities now allow oxygen levels in the Ti-6Al-4V alloy to be controlled to about 0.2 wt.% oxygen. This should result in significant expansion of the titanium PIM market place into aerospace, automobiles, surgical instruments, dentistry, communication devices (such as computers and cell phones), knives and guns. __________ Translated from Poroshkovaya Metallurgiya, Vol. 46, No. 5–6 (455), pp. 118–125, 2007.     

柯伐镀金盖板电化学腐蚀的剖析及其防腐措施

对半导体器件封装的气密性失效进行了研究。发现，柯伐镀金盖板遭致电化学腐蚀是导致气密性失效的主要原因。对电解液的形成和电化学腐蚀机理进行了深入的分析。提出了防止腐蚀，提高器件气密可靠性的思路和方法。     

基于COM＋技术的Web服务封装研究

早期的信息管理系统都是用于实现企业特定的业务功能而建立的,包括对企业生产、供应、销售以及客户服务等的控制和管理。企业按照职能部门建立了各种企业信息系统,这些信息管理系统被其所在部门所使用,并在实际的工作生产中发挥了巨大作用。该文从整体考虑各个企业信息管理系统,并根据具体业务的需求对这些系统进行统一编排,通过一个合适的集成平台把现有企业信息管理系统进行有机的整合起来,使各＂信息孤岛＂联系起来。     

基于MPC850 VxWorks系统的BSP设计

首先介绍嵌入式系统VxWorks及其启动过程;分析了基于MPC 850最小系统的硬件和BSP的执行流程;重点研究了MPC850BSP的设计与应用程序加载,包括其硬件驱动程序的设计、应用程序加载、建立调试环境和target server的配置等;基于MPC850系统的Vxworks BSP调试平台的实现,对Vxworks上层应用软件和底层硬件驱动的并行开发有着很重要的意义。     

DETECTOR: A knowledge-based system for injection molding diagnostics

A knowledge-based system (KBS) for diagnosis of multiple defects in injection molding is presented. The general scheme for knowledge representation based on fuzzy set theory has been shown useful in representing inexact and incomplete information for developing the KBS. An optimality criterion is created for selecting a simple and best cover to explain the given problem. An efficient search algorithm for finding such cover is also discussed.