Study on the fluid/structure interaction at different inlet pressures in molded packaging

This paper presents the computational study of fluid/structure interaction (FSI) analysis in the molding process using the Mesh-based parallel Code Coupling Interface (MpCCI) method with finite volume coding (FLUENT 6.3) and finite element coding (ABAQUS 6.9). The FSI analysis is implemented on the molded package during the encapsulation process with different inlet pressures. Real-time flow visualization, deformation and stress of the silicon die during the encapsulation process are presented in this paper. A fluctuation phenomenon of the silicon die is found in the encapsulation process when the inlet pressure increases. The maximum deformation during the process is determined at different locations on the silicon die, calculated during the final stage of the filling process. The deformation and stress of the die is exponentially increased with increasing inlet pressure. The maximum stress on the solder bump is concentrated near to the inlet gate. Thus, the present FSI analysis approach is expected to be a guideline or reference and provides better understanding of the encapsulation process for package design in the microelectronic industry.     

Thickening and Rheological Properties of Crystalline Polyester Used in Low Pressure Sheet Molding Compounds

Low pressure sheet molding compound (LPMC,1.0-3.0 MPa,95-103 ℃) is a new kind of thermosetting material with crystalline polyester as a physical thickenner.LPMC is different from conventional SMC using an earth oxide thickening agent (e.g.MgO) as chemical thickenner,it relies on the physical thickening of crystalline polyester.Crystalline polyester resin is the key material to mold LPMC parts.Currently there was no report about the thickening mechanism of crystalline polyester in LPMC.In this article,crystalline polyester resins,whose melting points were between 45 ℃ and 89 ℃,were synthesized by a two-step esterification.The melt points of crystalline polyesters are controlled by regulating the mol ratio of the two glycols and the two acids.And by means of varying the content of crystalline polyester resin,the thickening effect on resin paste is investigated.In addition,the thickening mechanism of crystalline polyester in LPMC was investigated by FTIR and DSC analysis.The effects of the diameters and viscosity of crystalline polyester on the rheological property and fiber distribution of LPMC sheets were studied,too.Results show that the thickening effect is excellent when the weight content of crystalline polyester resin is 3%.And there exists three kinds of functions acting in the process of thickening:swelling,hydrogen bonds and induction crystallization.During the preparing process of resin paste in LPMC,the temperature of resin paste must be kept at 90 ℃.In addition,crystalline polyester make LPMC have a perfect fluid property.When the viscosity of LPMC sheet is beyond 1 kPa s,the fiber orientation is not obvious.But when the viscosity of LPMC sheet is about 500 Pa s,the fiber shows a certain degree of orientation.Moreover the study of physical and chemical thickening mechanism of crystalline polyester and the rheological discipline of LPMC sheets in the hot mould will provide the researchers and enterprises with theory guidance.     

Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer Application

<正>Packaging of MEMS ( micro-electro-mechanical system ) devices poses more challenges than conventional IC packaging, since the performance of the MEMS devices is highly dependent on packaging processes. A Land Grid Array ( LGA ) package is introduced for MEMS technology based linear multi-axis accelerometers. Finite element modeling is conducted to simulate the warpage behavior of the LGA packages. A method to correlate the package warpage to matrix block warpage has been developed. Warpage for both package and sensor substrate are obtained. Warpage predicted by simulation correlates very well with experimental measurements. Based on this validated method, detailed design analysis with different package geometrical variations are carried out to optimize the package design. With the optimized package structure, the packaging effect on accelerometer signal performance is well controlled.     

塑封胶吸湿对器件分层影响的研究

进行3种塑封胶的吸湿试验来证实其在相同器件中的不同可靠性表现由吸湿量的差异造成,得到了树脂相同的塑封胶的吸湿量与二氧化硅填充量之间的关系。证实了MSL3条件下塑封胶吸湿遵循Fick定律,并且得到了MSL3条件下3种塑封胶中湿气的扩散系数。综合考虑回流过程中蒸汽压、塑封胶吸湿膨胀和热膨胀,进行了界面分层风险的定量分析。     

平行缝焊盖板镀层结构的热分析

平行缝焊是陶瓷封装中应用最为广泛的高可靠性气密性封装方式之一。由于焊接过程中,盖板表面镀层会发生熔化、破坏等过程,可伐基底会被暴露在环境中,导致盐雾腐蚀失效。利用Abaqus有限元分析软件,选择2种代表性的可伐盖板镀层结构,分析不同加载温度条件下可伐盖板及其表面镀层的温度分布。仿真结果表明,当可伐盖板采用Ni/Au的镀层结构时,控制焊接温度范围为1200~1400℃,有希望保证平行缝焊耐盐雾腐蚀可靠性,并给出其耐盐雾腐蚀机理。     

电子塑封材料南海环境贮存试验研究

对4种模塑封装材料，两种芯片涂层材料封装的微电路样品在西沙天然暴露站进行了22个月的贮存试验，并设计制作了一种简便有效的测试系统，贮存试验的结果表明，在芯片上加氮化硅钝化层比不加钝化层具有更好的防护效果；与聚酰亚胺胶内涂层相比，硅酮胶内涂层更能有效地阻止水分到达芯片的表面，由于材料本身的差异，不同厂家生产的模塑封装材料对微电路的影响也不同。     

垂直腔面发射激光器的TO封装工艺操作误差分析

采用FRESNEL光学软件和MATLAB编程,详细分析了垂直腔面发射激光器的TO封装工艺操作误差对耦合效率的影响.发现在芯片横向偏移、芯片倾斜和管帽倾斜这三种操作误差中,管帽倾斜对封装组件的耦合效率影响最大.     

可见光通信中菲涅耳透镜仿真设计与优化

可见光通信是一种在白光LED技术上发展起来的新兴光无线通信技术,具有发射功率高、无电磁干扰等优点。相比常规透镜,在可见光通信系统的光接收天线上,使用菲涅耳透镜可以降低成本,减小透镜厚度和接收焦距。本文利用Zemax软件对菲涅耳透镜进行了设计、仿真与优化,首先分析了透镜设计技术要求,提出了基于菲涅耳透镜的设计与仿真方法及参数设置,然后对几类透镜进行了仿真与性能分析,在此基础上进行了透镜设计优化。结果表明,在光垂直入射且探测器尺寸为1.5×1.5mm2情况下,可保证F数＜1,并得到优化的透镜结构和参数,使集光效率达到90%,为基于菲涅耳透镜的天线设计提供了理论与应用基础。     

AuSn合金在电子封装中的应用及研究进展

AuSn合金焊料因其具有优良的抗腐蚀、抗疲劳特性和高强度、高可靠性等优点而在气密性封装、射频和微波封装、发光二极管(LED)、倒装芯片(Flip-chip)、激光二极管(LD)、芯片尺寸封装(CSP)等方面得到广泛的应用。从电子封装无铅化和合金焊料的可靠性等方面,对AuSn合金焊料的物相结构和材料性能进行了讨论,并对AuSn合金焊料在电子封装中的应用及其研究进展进行了总结和展望。     

基于家庭关联关系识别模型的电信融合套餐营销

本文回顾了中国电信承接原联通C网以来的全业务融合套餐现状,分析了识别原有CDMA手机号码与固定电话号码的关联关系对于电信融合套餐营销的意义,详细描述了利用决策树算法来构建家庭关联关系识别模型的过程和方法,并简要介绍了如何应用模型结果进行融合套餐的针对性营销.