摩擦衬片包角对盘式制动器尖叫影响的仿真分析

摩擦衬片包角对制动尖叫具有重要影响。针对某通风盘式制动器,建立有限元复模态模型并通过尖叫台架试验进行了正确性验证。基于该模型针对5种包角水平的摩擦衬片,通过仿真计算分析其对制动尖叫倾向性的影响,并从制动块自由模态特性、盘块间接触压力分布、不稳定模态频率及模态耦合特性角度解释了不同摩擦衬片包角对制动尖叫的影响机制。分析表明：摩擦衬片包角的改变会同时引起制动块结构特性变化和接触压力分布的变化,进而引起不稳定模态数量、频率和模态耦合特性的改变。     

玻璃固载TiO2/纳米纤维素复合薄膜的制备及其光催化性能

将微晶纤维素溶解于NaOH-尿素的低温溶液中形成纤维素溶液, 在水浴中再生形成纳米纤维素溶液。然后将纳米纤维素溶液与TiO₂(P25)混合, 并添加少量的钛酸正丁酯作为交联剂形成复合溶液。将制备得到的复合溶液通过流延法固载到玻璃片表面形成玻璃固载的TiO₂/纳米纤维素复合膜。通过SEM、XRD表征了复合膜的形貌与结构。将玻璃固载的TiO₂/纳米纤维素复合膜在紫外光下进行光催化降解甲基橙(MO)以评估复合膜的光催化性能, 研究了纳米TiO₂含量对复合膜光催化性能的影响, 复合膜的重复使用性能以及光降解的动力学过程。结果表明: 复合膜对MO的光催化降解能力可达90%以上, 与纯TiO₂粉末相当, 并重复使用3次光催化性能基本保持不变。复合膜对甲基橙的降解动力学符合一级动力学特征。当纳米TiO₂相对于纤维素的质量分数为33.3%时, 光催化活性最高, 动力学速率常数为0.035 min^-1。     

聚乳酸纤维仿毛织物的染整工艺研究

由于聚乳酸纤维属于脂肪族聚酯,具有与PET相同疏水性及熔点较低、不耐高温和强碱的特点,因此采用低碱退浆、分散染料染色的染整工艺.文章介绍了实验材料聚乳酸纤维(PLA)仿毛机织物的烧毛、退浆、练漂、热定形、染色的工艺参数和染整加工中的加工要点及注意事项,着重分析了pH值、染色时间、染色温度对上染率的影响,并得出最佳的染色工艺参数:染色pH值5,温度110℃,时间35 min.     

复合型散热硅橡胶研究

研究了氧化铝和氮化硼粒子用量对硅橡胶热膨胀系数、热稳定性及热导率的影响.发现加入两种填料均显著降低了橡胶热膨胀系数,提高了热稳定性及热导率;试验测试热导率和理论计算值差距较大,用Agari模型分析了两种填料对硅橡胶热导率差异影响的原因.按照一定比例混合这两种填料所得混合填料填充硅橡胶可获得最大热导率及较佳性能.所制备的复合硅橡胶具有很好的物理性能,是作为散热使用的弹性导热垫片的理想材料.     

B4 用染色法记录液体中大功率超声场的分布

利用染料在纸上染色可以方便，快速地记录液体中大功率超声场的分布，本文给出这一套验研究的结果，表明该方法在声化学和超声清洗等大功率超声液体处理应用中，对于测量空化强度的空间分布是一种实用，可取的方法。     

改性胡麻纤维的染色性能分析

文章对胡麻改性前后上染率进行了研究.胡麻纤维经碱改性后,纤维的聚合度、结晶度和取向度都有不同程度的下降,纤维上染率也有了明显提高.此外,碱改性还能使麻纤维产生物理化学变化和结构的变异,使麻纤维的回弹性和柔软度得到改善,抗皱性能提高,大大改变了其制品的服用性能.     

Degradation of Anionic Dye Eosin by Glow Discharge Electrolysis Plasma

This paper describes a novel method for the degradation of eosin by using glow discharge electrolysis （GDE）. The effects of various parameters on the removal efficiency were studied. It was found that the eosin degradation could be raised considerably by increasing the applied voltage and the initial concentration, or by decreasing pH of the aqueous solution. Fe^2＋ ion had an evident accelerating effect on the eosin degradation. The degradation process of eosin obeyed a pseudo-first-order reaction. The relationship between the degradation rate constant k and the reaction temperature T could be expressed by Arrhenius equation with which the apparent activation energy Ea of 14.110 kJ· mol^-1 and the pre-exponential factor k0 of 2.065× 10^-1 min^-1 were obtained, too. The determination of hydroxyl radical was carried out by using N, N-dimethyl -p-nitrosoaniline （RNO） as a scavenger. The results showed that the hydroxyl radical plays an important role in the degradation process.     

涤纶纤维低温热溶染色助剂CWL的应用研究

助剂CWL用于涤纶纤维热溶染色能够显著降低染色温度,具有较好的增深效果和显著的增溶作用。染浴中加入自制涤纶纤维低温染色助剂CWL2g／L,能够在低于正常染色温度30％T达到正常温度的染色深度,从而大幅度节约能源。添加助剂CWL2g／L后,在染料质量一体积分数15g／L的条件下就可以达到染料20g／L的染色深度,可以节约染料量25％。添加助剂后的染色试样能够保持良好的色牢度,断裂强力也提高很多。     

YT62型液力偶合器故障分析及处理

针对YT62型液力偶合器在实际运行过程中经常出现的泵轮侧推力轴承温度偏高、泵轮和涡轮侧推力瓦块烧毁以及泵轮叶片断裂等故障进行分析及探讨,提出了改造偶合器泵轮侧推力瓦块定位盘,扩大泵轮侧径向推力轴瓦中分面的油槽通流面积,在断裂的泵轮叶片最接近180°对称的叶片上挖去和断裂叶片大小相同的部分,将转子动平衡校验后回装等处理方法和改进措施。改进后的实际运行效果表明,设备安全可靠性得到了很大提高,运行良好。     

Interconnection Technology Based on InSn Solder for Flexible Display Applications

A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than 150°C. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than 150°C. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip‐chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a 20 μm pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at 130°C.