导电胶粘剂的研究进展

随着微电子技术的发展以及环保意识的增强,作为Pb/Sn焊料替代物的导电胶粘剂,已成为当前研究的热点和重点。介绍了导电胶粘剂的导电机理及其组成、功能和分类。重点概述了近年来国内外导电胶粘剂的研究现状,并展望了未来导电胶粘剂的研究方向。     

三层材料微悬臂梁模型及其在红外焦平面像元设计中的应用

双材料梁因其良好的热机械特性作为敏感部件被广泛用于热能传感器中.采用微电子工艺实现的双材料梁通常由金属和非金属作为主要功能材料构成,若两层材料之间粘附性差,则需加入一层粘附材料.根据材料力学热应力和弯拉组合理论,建立了用于分析具有中间粘附层的复合双材料(即三层材料)微悬臂梁的关于材料物理参数、结构尺寸与梁受热弯曲产生转角关系模型;利用此模型和工艺中常用材料,研究了三层材料微悬臂梁的材料选取、各层材料厚度匹配等优化设计问题.通过对像元仿真和对硅工艺制造的红外焦平面阵列(IRFPA)芯片进行测试,验证了模型的正确、合理和适用性.     

Flexible Osteogenic Glue as an All-In-One Solution to Assist Fracture Fixation and Healing

Osteogenic glue that reproduces the natural bone composition represents the final frontier of orthopedic adhesives with the potential to revolutionize surgical strategies against comminuted fractures. However, it is difficult to achieve an all-in-one formula, which could provide flexible and reliable adhesiveness while avoiding interfering with or even promoting the healing of glued fractures. Herein, an osteogenic glue characterized by inorganic-in-organic integration between amine-modified mesoporous bioactive glass nanoparticles (AMBGN) and bioadhesive gelatin-dextran network (GelDex) is introduced as an all-in-one tool to flexibly adhere and splice bone fragments and subsequently guide fracture healing during degradation. Relying on such integration, a 4-fold improvement in cohesiveness is presented, followed by a nearly 5-fold enhancement in adhesive strength in ex vivo porcine bone samples. The reversible and re-adjustable adhesiveness also enables glue to effectively splice intricate fragments from highly comminuted fractures in the rabbit radius in an in vivo environment. Moreover, well-preserved organic–inorganic integrity during degradation of the glue guides sustained interfacial osteogenesis and achieve satisfying healing outcomes in glued fractures, as observed by the 2-fold improvement in biomechanical and radiological performance compared with commercially available cyanoacrylate adhesives. The current findings propose an all-in-one solution for the fixation of bone fragments during surgery.     

影响厚膜导体附着力的几种因素

厚膜导体是厚膜混合集成电路中的一个重要组成部分,在电路中起有源器件的互连线、多层布线、电容器电极、外贴元器件的引线焊区、电阻器端头材料、低阻值电阻器、厚膜微带等作用.在厚膜混合集成电路的生产过程中,为了评价成膜基片的性能及焊接的效果,在做剪切强度测试时,经常会遇到焊盘脱落现象,这给厚膜电路的产品质量带来很大隐患.文章通...     

Omnidirectional Bending and Pressure Sensor Based on Stretchable CNT‐PU Sponge

Bending and pressure sensors are very essential for evaluating external stimuli in human motions; however, most of them are separate devices. Here, two orthogonal carbon nanotube–polyurethane sponge strips (CPSSs) are used, each of which has different resistances when bent or pressed, to fabricate a multi‐functional stretchable sensor capable of detecting omnidirectional bending and pressure independently. Due to the shape of the strip, the resistance of CPSS changes differently when bent along different directions. Based on this feature, two perpendicular CPSSs can reflect information of both bending distance and bending direction. After basic measurement data are obtained, a function set can be formulated to calculate bending distance and bending direction simultaneously. The errors of bending distance and bending angle can be controlled to less than 4%. With the help of the triboelectric effect, which only happens when the device is pressed, the sensor can differentiate bending and pressure effectively, ensuring the device works in complex situations.     

Self‐Hydrophobization in a Dynamic Hydrogel for Creating Nonspecific Repeatable Underwater Adhesion

Adhesive hydrogels are widely applied for biological and medical purposes; however, they are generally unable to adhere to tissues under wet/underwater conditions. Herein, described is a class of novel dynamic hydrogels that shows repeatable and long‐term stable underwater adhesion to various substrates including wet biological tissues. The hydrogels have Fe³⁺‐induced hydrophobic surfaces, which are dynamic and can undergo a self‐hydrophobization process to achieve strong underwater adhesion to a diverse range of dried/wet substrates without the need for additional processes or reagents. It is also demonstrated that the hydrogels can directly adhere to biological tissues in the presence of under sweat, blood, or body fluid exposure, and that the adhesion is compatible with in vivo dynamic movements. This study provides a novel strategy for fabricating underwater adhesive hydrogels for many applications, such as soft robots, wearable devices, tissue adhesives, and wound dressings.     

基于工控机和VC的点阵布胶

介绍一种采用螺杆泵式点胶器的接触式布胶试验装置,论述了装置的系统组成及功能,针对系统中的关键组成部分—z轴的运行模式进行了深入的分析和研究;通过VC++6.0设计的用户界面,设定有关参数以控制x、y运动平台、z轴的运动和挤胶过程,达到了应用的要求。     

Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications

A highly reliable conductive adhesive obtained by transient liquid‐phase sintering (TLPS) technologies is studied for use in high‐power device packaging. TLPS involves the low‐temperature reaction of a low‐melting metal or alloy with a high‐melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag‐coated Cu, a Sn96.5‐Ag3.0‐Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 °C, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.     

导电银胶触变性的研究

以环氧树脂为基体,银粉为填料,制备出IC封装用导电银胶。研究了环氧树脂与银粉的比例、银粉的形貌和粒径以及触变剂SiO2的用量对导电银胶触变性的影响。结果表明,银胶触变性随树脂/银粉质量比的减小而增大,当其为0.2时,触变指数达到5.68。在一定粒径范围内,银胶的触变性与银粉粒径呈反比关系;银胶触变性随SiO2的用量增大而增大。     

聚氨酯——聚丙烯酸酯复合聚合物乳液的研究

本文研究了几种聚氨酯——聚丙烯酸酯乳液复合的方法，制备了新单体N-（4’-甲基3’-二正丁脲基）苯基氨基甲酸内烯酰氧-2-丙酯，使其与丙烯酸酯类单体共聚，显著提高了聚合物的抗张强度，简单介绍了聚合物膜接技法，共混复合法和种子聚合法的实施方法，聚合物膜性能及粒子结构等有关研究内容，实验表明，用几种方法都可以获得综合性能好的复合聚合物乳液。