ULSI多层互连中的化学机械抛光工艺

介绍了化学机械抛光(CMP)技术在大规模集成电路多层互连工艺[1]中的重要作用,对CMP过程和CMP的影响因素进行简单分析。总结出CMP技术在多层互联平坦化中的优势,介绍目前常用互连材料中SiO2介质及其金属材料钨和铜的化学机械抛光常用分析机理,并简单介绍了各种互联材料常用的抛光液及抛光液的组分,对抛光液作了简单的对比。针对传统CMP过程存在的问题,分析了皮带式和固定磨料的CMP技术。     

TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology

The present status of work on diffussion barriers for copper in multilevel interconnects is surveyed briefly, with particular emphasis on TiN and TaN, and silicon dioxide as the interlayer dielectric. New results are presented for these materials, combining thermal annealing and bias temperature stress testing. With both stress methods, various testing conditions are compared using capacitance-vs-voltage (C-V) and leakage current-vs-voltage (I-V) measurements to characterize the stressed samples. From an evaluation of these data and a comparison with other testing approaches, conditions for a consistent testing methodology of barrier reliability are outlined.     

碱性铜粗抛液中氧化剂对化学机械平坦化的影响

针对不合腐蚀抑制剂苯并三氮唑(BTA)的碱性铜粗抛液,通过对3英寸(1英寸=2.54 cm)铜片上的动态抛光速率和静态腐蚀速率的研究来模拟评估氧化剂对晶圆表面平坦化的影响.在12英寸铜镀膜片和TM1图形片上分别研究氧化剂体积分数对表面平坦化的影响.实验结果表明:动态抛光速率和静态腐蚀速率均随着氧化剂体积分数的增加先逐渐增大,达到最大值,然后下降,趋于平缓.片内非均匀性和剩余高低差均随H2O2体积分数的增加,先呈下降趋势,后缓慢上升.当氧化剂体积分数为3％时,动态去除速率(vRR)为398.988 nm/min,静态腐蚀速率vER为6.834 nm/min,vRR/vER比值最大,片内非均匀性最小为3.82％,台阶高低差最小为104.6 nm/min,此时晶圆片有较好的平坦化效果.     

Eu3+掺杂Na2La2Ti3O10红色荧光粉的光谱性质

采用传统高温固相法制备了不同Eu³⁺浓 度掺杂的Na₂(La1－xEux) ₂Ti₃O10荧光粉,研究了Eu³⁺浓度 对样品结构及发光性质的影响。X射线衍射(XRD)结果表明Eu³⁺掺杂浓度不大于40%的 样品为四方相Na₂La₂Ti₃O10;当 Eu³⁺浓度达到60%时,出现了正交相NaEuTiO₄。对样品进行 激发、发射光谱的 测试发现,样品可被较 宽波段的紫外光有效激发,获得明亮的红橙色光发射,且Na₂La₂Ti₃O₁₀到Eu 3+存在有效的能量传递。利用 Van模型,证实了Eu³⁺间的交换相互作用是引发浓度猝灭的主要原因。利用Auzel模型 ,解释了Eu³⁺发光的自猝 灭行为。测试了样品在不同温度下的发射光谱和时间衰减曲线,确定样品发光产生 温度猝灭的主 要机理是Crossover过程。利用Arrhenius公式对实验数据进行拟合,确定激活能值约为0.26eV,说明Na₂(La1－xEux)₂Ti₃O₁₀荧光粉具有较好的发光热稳定性。     

电路板嵌入元器件有机模块技术的开发

为了提高电子组装密度,基板嵌入元器件的三维安装模式受到人们更多的关注.介绍了一种以铜芯为基板核心材料的元器件嵌入技术(EOMIN),详细叙述了其外形结构和制造工艺,并通过实验与FR-4基板嵌入元器件和低温共烧陶瓷基板(LTCC)安装元器件进行比较,通过实验数据对比得出EOMIN元器件嵌入技术具有导热性能好,抗疲劳性强,承受热冲击时铜的塑性变形量小,连接可靠性高等优良特性的结论.     

改善PCB镀铜均镀性

该文阐述了改善PCB镀铜均镀性的基本方法。     

Copper‐Based Nanostructured Coatings on Natural Cellulose: Nanocomposites Exhibiting Rapid and Efficient Inhibition of a Multi‐Drug Resistant Wound Pathogen,A. baumannii,and Mammalian Cell Biocompatibility In Vitro

This paper describes a layer‐by‐layer (LBL) electrostatic self‐assembly process for fabricating highly efficient antimicrobial nanocoatings on a natural cellulose substrate. The composite materials comprise a chemically modified cotton substrate and a layer of sub‐5 nm copper‐based nanoparticles. The LBL process involves a chemical preconditioning step to impart high negative surface charge on the cotton substrate for chelation controlled binding of cupric ions (Cu²⁺), followed by chemical reduction to yield nanostructured coatings on cotton fibers. These model wound dressings exhibit rapid and efficient killing of a multidrug resistant bacterial wound pathogen, A. baumannii, where an 8‐log reduction in bacterial growth can be achieved in as little as 10 min of contact. Comparative silver‐based nanocoated wound dressings–a more conventional antimicrobial composite material–exhibit much lower antimicrobial efficiencies; a 5‐log reduction in A. baumannii growth is possible after 24 h exposure times to silver nanoparticle‐coated cotton substrates. The copper nanoparticle–cotton composites described herein also resist leaching of copper species in the presence of buffer, and exhibit an order of magnitude higher killing efficiency using 20 times less total metal when compared to tests using soluble Cu²⁺. Together these data suggest that copper‐based nanoparticle‐coated cotton materials have facile antimicrobial properties in the presence of A. baumannii through a process that may be associated with contact killing, and not simply due to enhanced release of metal ion. The biocompatibility of these copper‐cotton composites toward embryonic fibroblast stem cells in vitro suggests their potential as a new paradigm in metal‐based wound care and combating pathogenic bacterial infections.     

Gas Responsive Nanoswitch: Copper Oxide Composite for Highly Selective H2S Detection

A nanocomposite material based on copper(II) oxide (CuO) and its utilization as a highly selective and stable gas‐responsive electrical switch for hydrogen sulphide (H₂S) detection is presented. The material can be applied as a sensitive layer for H₂S monitoring, e.g., in biogas gas plants. CuO nanoparticles are embedded in a rigid, nanoporous silica (SiO₂) matrix to form an electrical percolating network of low conducting CuO and, upon exposure to H₂S, highly conducting copper(II) sulphide (CuS) particles. By steric hindrance due to the silica pore walls, the structure of the network is maintained even though the reversible reaction of CuO to CuS is accompanied by significant volume expansion. The conducting state of the percolating network can be controlled by a variety of parameters, such as temperature, electrode layout, and network topology of the porous silica matrix. The latter means that this new type of sensing material has a structure‐encoded detection limit for H₂S, which offers new application opportunities. The fabrication process of the mesoporous CuO@SiO₂ composite as well as the sensor design and characteristics are described in detail. In addition, theoretical modeling of the percolation effect by Monte‐Carlo simulations yields deeper insight into the underlying percolation mechanism and the observed response characteristics.     

Cu/Ta/SiO_2/Si多层结构的纳米压痕研究

利用磁控溅射方法在Si衬底上沉积钽层以及铜层,并利用纳米压痕技术对Cu/Ta/SiO_2/Si多层膜结构进行了硬度和弹性模量的表征,研究发现多层膜结构的硬度随着薄膜厚度的增加而降低,然而弹性模量与膜厚之间并没有这样的关系。利用聚焦离子束（FIB）工艺将纳米压痕区域剖开,并通过透射电子显微镜（TEM）表征发现在纳米压痕过后,钽以及二氧化硅界面有了明显的分层现象,这一点表明层与层之间较弱的键合在相对大的负荷下遭到了破坏。