Neutron Stress Measurement of W‐Fiber Reinforced Cu Composite

Stress measurement methods using neutron and X‐ray diffraction were examined by comparing the surface stresses with internal stresses in the continuous tungsten‐fiber reinforced copper‐matrix composite. Surface stresses were measured by X‐ray stress measurement with the sin²ψ method. Furthermore, the sin²ψ method and the most common triaxal measurement method using Hooke's equation were employed for internal stress measurement by neutron diffraction. On the other hand, microstress distributions developed by the difference in the thermal expansion coefficients between these two phases were calculated by FEM. The weighted average strains and stresses were compared with the experimental results. The FEM results agreed with the experimental results qualitatively and confirmed the importance of the triaxial stress analysis in the neutron stress measurement.     

The fracture stress of chemical vapour deposited diamond

The factors which control the fracture stress of chemical vapour deposited diamond have been studied using the 3-point bend geometry. Fracture stress values of 300–800 MPa for the growth side and 600–1200 MPa for the nucleation side were recorded for samples of thickness 0.4–2.4 mm. A Weibull modulus of 23 was calculated for the growth surface data, showing that the fracture stress variability was low for a brittle material. A theory based on these results demonstrates that the material behaviour is remarkably simple, depending only on the grain size and the sample thickness, regardless of wide variations in other parameters such as optical transmission and stress state. The paper also contains a possible explanation for this well-defined behaviour based on microstress variations resulting from differences in defect density in different growth sectors within a grain.     

Application of boundary element method to 3-D problems of coupled thermoelasticity

This paper deals with a new boundary element method for analysis of the quasistatic problems in coupled thermoelasticity. Through some mathematical manipulation of the Navier equation in elasticity, the heat conduction equation is transformed into a simpler form, similar to the uncoupled-type equation with the modified thermal conductivity which shows the coupling effects. This procedure enables us to treat the coupled thermoelastic problems as an uncoupled one, A few examples are computed by the proposed BEM, and the results obtained are compared with the analytical ones available in the literature, whereby the accuracy and versatility of the proposed method are demonstrated.     

Flow stress of high density polyethylene and nylon 66 at high rates of strain

Measurement of the flow stress of high density polyethylene (HDPE) and nylon 66 at strain rates of 10³ s^?1 using a split Hopkinson pressure bar technique is discussed. The flow stress at a strain of 10% has been determined for both polymers at 20°C. The intrinsic errors involved in this technique are briefly reviewed. The results indicate that the flow stress of HDPE and nylon 66 were 50MPa and 150MPa, respectively, at strain rates of about 10³s^?1.     

Some experimental findings in compression-after-impact (CAI) tests of CF/PEEK (APC-2) and conventional CF/epoxy flat plates

Compression-after-impact (CAI) tests have been conducted for quasi-isotropic thick plates with 48 plies by using the NASA method and on plates with 32 plies by using the SACMA method. Specimens are made of CF/PEEK (APC-2) and conventional CF/epoxy for the NASA plates and CF/epoxy for the SACMA plates. In the NASA CAI tests, the sequence of delamination buckling and its propagation is clearly revealed through various experimental techniques. One major technique is moiré topography, and the other is thermo-mechanical stress analysis with a high-accuracy infrared sensor. The arrest of delamination propagation just before catastrophic failure due to high fracture toughness is clearly captured by the moiré camera. This behavior provides good CAI values of CF/PEEK. The initial buckling properties of the delaminated region by the impact are then extensively discussed. Numerical predictions of initial buckling stress have been obtained by modelled geometry of the delaminated region simplified from its precise structure clarified by ultrasonic C-scanning. They agree fairly well with the experimental results. The in-plane stress distribution in the delaminated region before initial buckling is measured by an infrared stress graphic system. This compared favorably with finite element predictions. Two types of symmetric buckling modes with respect to the central plate surface, twin and single peak ones, are experimentally captured.     

Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au

Excessive intermetallic compound (IMC) growth in solder joints will significantly decrease the reliability of the joints. IMC growth is known to be influenced by numerous factors during the component fabrication process and in service. It is reported that, other than temperature and holding time, stress can also influence the IMC growth behavior. However, no existing method can be used to study the effect of stress state on IMC growth in a controlled manner. This paper presents a novel method to study the effect of stress on interfacial IMC growth between Sn-Ag-Cu solder and a Cu substrate coated with electroless Ni immersion Au (ENIG). A C-ring was used and in-plane bending induced tensile and compressive stresses were applied by tightening the C-ring. Results revealed that in-plane compressive stress led to faster IMC growth as compared with in-plane tensile stress.     

On the microhardness testing of electrically stressed poly(phenylene oxide): Polystyrene blends

Microhardness measurements have been performed on untreated (virgin) and electrically stressed, solvent‐cast laboratory‐prepared samples of pure poly(phenylene oxide) (PPO), pure polystyrene (PS), and PPO : PS polyblends with different weight proportions. Results of such measurement on untreated polyblend sample show that microhardness (H_v) increases with increase in the content of PS up to 10 wt %, which attributed to the existence of homogeneous phase morphology. However, this feature is not observable in samples containing higher content of PS. Electrical stress is found to modify considerably the mechanical property of polymer. The effect of electric field on the microhardness of such samples (PPO : PS :: 90 : 10) has been characterized by the existence of a peak. Trapping of charge carriers in electrically stressed samples imparts hardening to the polyblend up to an applied step field of 190 kV/cm. However, the excessive charging beyond this step field value destroys this characteristic. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

10MeV中子引起的~（238）U，~（209）Bi，Fe和~9Be的次级中子

１０ＭｅＶ中子引起的￣（２３８）Ｕ，￣（２０９）Ｂｉ，Ｆｅ和￣９Ｂｅ的次级中子双微分截面测量祁步嘉，唐洪庆，周祖英，周陈维，沈冠仁，柯尊建，孙振强，夏海鸿（中国原子能科学研究院核物理所，北京２７５－４６信箱，１０２４１３）次级中子双微分截面是核工程设...     

AN EXPERIMENTAL-NUMERICAL METHOD FOR MEASURING CRACK PROPAGATING VELOCITIES UNDER STRESS WAVE LOADING

An experimental-numerical method for measuring dynamic crack propagating velocities under stress wave loading is established in this paper. The experiments of the three-point bend specimen are done on the improved Hopkinson bar. Deflection of loading point, dynamic load and instantaneous crack length are measured, then crack propagating velocities are calculated. Experiments on 40Cr steel show that the results given by this method have a good agreement with that obtained by the resistance fracture gage method. Therefore this method is feasible for measuring crack propagating velocities under high loading rate and will have wide application.