反应性丙烯酸酯制备常温无溶剂涂料

文章利用丙烯酸酯树脂预聚物与交联单体在引发剂和促进剂的作用下进行自由基聚合反应交联成膜,制备了一种低粘度,高固含量,表干时间短,低污染,硬度高,柔韧性好,附着力强,耐候性好的涂料。文中着重探讨了丙烯酸酯树脂预聚物的合成,并对涂膜性能进行了测试;找到了控制预聚物粘度的方法及涂料的适宜配方;可为丙烯酸类路标涂料的生产应用提供一定的借鉴。     

无溶剂复合技术的特点及相关设备结构分析

在分析国内外无溶剂复合设备现状的基础上,论述了无溶剂复合设备在结构设计上无烘干道、结构紧凑、耗能少等特点,并指出国内外无溶剂复合设备在涂布系统、复合单元、收卷单元、张力控制以及供胶系统等方面的创新点和性能参数。通过比较国内外先进无溶剂复合设备的优缺点,指出国内无溶剂复合设备的主要差距。最后提出了国内外无溶剂复合设备正朝着高效率、多功能、数字化、自动化发展的趋势。     

无溶剂环氧自流平地坪涂料技术探讨

无溶剂环氧自流平地坪涂料以其优异的施工性、流平性、柔韧性、耐冲击性、耐化学介质腐蚀等特点,广泛用于各行各业的工业厂房.本文研究了组成该地坪涂料的环氧树脂、活性稀释剂、固化剂、颜填料及助剂的各种性能特点和对涂层性能的影响,探讨了无溶剂环氧自流平地坪涂料系统的施工工艺,对工程应用具有一定的指导意义.     

新型绝缘树脂性能及应用

本文介绍了FUCHEM系列无溶剂绝缘树脂的性能及应用,着重探讨了产品的阻燃、低收缩、高耐腐蚀、高耐热等特性。     

自流平环氧地坪涂料的研制

介绍了自流平环氧地坪涂料的组成和研制。通过对各种原材料的选择、涂层性能的测试，确定了涂料配方。     

Wafer Scale Solventless Adhesive Bonding with iCVD Polyglycidylmethacrylate: Effects of Bonding Parameters on Adhesion Energies

Initiated chemical vapor deposition (iCVD) polyglycidylmethacrylate (PGMA) thin films are investigated as adhesives for wafer‐scale bonding of 300 mm silicon substrates and demonstrated to form highly uniform, void‐free bond interfaces. The effects of bonding temperature and pressure on critical adhesion energy (G_c) between iCVD PGMA and silicon are studied using the four‐point bend technique. G_c values can be varied over an order of magnitude (0.59–41.6 J m⁻²) by controlling the bonding temperature and the observed dependence is attributed to changes in the physical (diffusion) and chemical (crosslinking) properties of the film. Thermal degradation studies using spectroscopic ellipsometry reveal that the iCVD PGMA films can crosslink when annealed above 120 °C in air. Further, changes in polymer behavior associated with annealing temperature are demonstrated to influence the crack propagation interface between the bonded substrates. These findings demonstrate the feasibility of iCVD polymer films for both temporary “thermoplastic,” and permanent “thermoset” bonding with potential applications in 3D integrated circuit technologies.     

Application of chemo-rheology to establish a process window for a new solventless system to manufacture pre-pregs and laminates for electronic applications

The most common commercial processes for manufacturing pre-pregs for electronic applications use solvent-based epoxy systems. Solvents are environmentally unfriendly and contribute to voids in the pre-preg and laminate. Voids cause product variability, which is a major source of scrap in board shops. In this paper, we use chemo-rheological and kinetic measurements to identify a potential epoxy-based resin system for a solventless process that is based on injection pultrusion. Differential scanning calorimetry and rheological data show that the candidate system does not react appreciably without catalyst up to temperatures of 170 °C or with catalyst at temperatures <110 °C. The system solidifies at temperatures <105 °C. The overall viscosity of the resin system is dependent on the temperature, degree of cure, and filler content. Kinetic rate and viscosity rise expressions to be used in process modeling and optimization have been developed. A preliminary process window for the process is established. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 601–610, 2001     

一种无溶剂自流平环氧地坪涂料的研制

讨论了自流平环氧地坪涂料的组成和研制。与溶剂型地坪涂料相比较，该涂料具有绿色环保及自流平性。通过对各种原材料的选择、涂层性能的测试，确定了涂料配方。结果表明该地坪涂料具有耐磨、耐压、抗冲击、耐化学腐蚀等优异性能。     

环保型聚酯亚胺无溶剂浸渍漆的应用研究

介绍了一种风力发电机用环保型聚酯亚胺无溶剂真空压力(VPI)浸渍漆。通过各项试验表明:该浸渍漆具有较低的挥发性有机物(VOC)排放量及良好的工艺适应性,能完全满足风力发电机的VPI浸渍需求。     

聚酯型H级阻燃无溶剂浸渍漆性能的研究

采用加入自制烯基阻燃树脂组份的新方法,合成了一种新型的 H级阻燃无溶剂浸渍漆.研究了烯基阻燃树脂用量对绝缘漆综合性能,特别是阻燃性能的影响.分析比较了不同合成方法对产品粘温、耐热、电气等性能的影响.结果表明：该新型 H级阻燃无溶剂浸渍漆具有阻燃性能好、电气绝缘性能佳、低温快固化的特点;当阻燃组份用量为不饱和聚酯量 45%时综合性能最佳（氧指数为 38）.