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121.
122.
J. C. Jones H. Rahmati T. D. H. Do 《Journal of chemical technology and biotechnology (Oxford, Oxfordshire : 1986)》1992,54(4):317-318
Wood shaving samples were heated in both cubic baskets and in a previously described system realising the conditions of the ‘infinite slab’ in thermal ignition. Results from the two sets of experiment were found to be totally consistent with each other. 相似文献
123.
聚乙烯醇膜的阻醇及导电性能(Ⅱ)戊二醛交联聚乙烯醇膜 总被引:3,自引:0,他引:3
为提高直接甲醇燃料电池(DMFC)用膜的阻醇性能,采用在渗透蒸发领域广泛使用且具有良好分离效果的聚乙烯醇(PVA)为主要材料,制备了戊二醛(GA)交联PVA膜,考察了此类膜的阻醇及质子导电能力。PVA(GA)膜的阻醇效果较目前在DMFC中广泛使用的Nation膜有显著提高,但其自身不具有质子导电能力,需外加电解质溶液以提高其电导率。 相似文献
124.
The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73–9% Zn and 0–3.0% Ag. The scanning
electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis
results indicate that Ag5Zn8 and AgZn3 become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations
gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure
when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure
of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these
solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%.
Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0%
to 3.0% 相似文献
125.
Novel diols containing imide groups were prepared via condensation of aromatic dianhydrides with 5‐amino‐1‐naphthol. The diimide–dinaphthols prepared were characterized by conventional methods and used to synthesize new poly(urethane–imide)s (PUIs). All the polymers were characterized and their physical properties, such as solubility, solution viscosity, thermal stability, and thermal behaviour were studied. The polymers obtained showed more thermal stability than typical polyurethanes because of the presence of the imide groups. Copyright © 2003 Society of Chemical Industry 相似文献
126.
Addressing the potential for drop impact failure of Pb-free interconnects, the shear ductility after extensive aging of Sn-Ag-Cu
(SAC) solders has been improved radically by Co or Fe modifications. Several other SAC+X candidates (X=Mn, Ni, Ge, Ti, Si,
Cr, and Zn) now have been tested. Solder joint microstructures and shear strength results show that new SAC+X alloys also
suppress void formation and coalescence at the Cu (substrate)/Cu3Sn interface (and embrittlement) after aging at 150°C for up to 1,000 h. Microprobe measurements of 1,000 h aged samples suggest
that Cu substitution by X is usually accentuated in the intermetallic layers, consistent with X=Co and Fe results. 相似文献
127.
128.
Plastisols, which are a blend of poly(vinyl chloride) resin and a plasticizer (DEHP), were used as a toughening agent of a resol resin in order to improve the mechanical properties. It was not possible to formulate resol blends by adding more than 10 % of plastisol owing to a lack of apparent homogeneity in the systems, which also showed many air bubbles. The relationship between dynamic mechanical, mechanical and thermal properties and the amount of plastisol added was studied. It was determined from the infrared spectroscopy and dynamic mechanical results that the resol–plastisol blends seem to be formed by a reaction between the phenol and PVC giving a higher crosslinked structure. An improvement in the thermal resistance of the blends at lower temperatures was observed with an increase in the percentage of plastisol. Flexural analysis showed the elastic behaviour of the systems. However, it was not possible to observe the effect of the plasticizer (DEHP) owing to the low quantity of plastisol that was added to the resol. Copyright © 2004 Society of Chemical Industry 相似文献
129.
Conducting composites of polythiophene (PTP) and polyfuran (PF) with acetylene black (AB) were prepared via chemical oxidative polymerization of thiophene and furan in a suspension of AB in CHCl3 at room temperature using anhydrous FeCl3 as the oxidant. Formation of PTP and PF and their subsequent incorporation in PTP–AB and PF–AB composite systems were confirmed by FTIR analysis. Scanning electron microscope analysis showed the presence of compact clusters of particles in both composites. Transmission electron micrographs of PTP–AB and PF–AB composites showed formation of globular polymer encapsulated AB particles with average diameters of the order of ~100 nm in both systems. Thermogravimetric analysis revealed that the overall thermal stability varied in the order: AB > PTP–AB > PTP and AB > PF–AB > PF. DC conductivity values for the PTP–AB and PF–AB composites were of the order of 10?2 and 10?3 S cm?1, respectively. Copyright © 2004 Society of Chemical Industry 相似文献
130.
董志武 《高分子材料科学与工程》1992,8(6):72-78
用TMA方法研究了双向拉伸PET膜和容器的热收缩特性,讨论了热收缩和分子结构的关系和各种影响因素。实验结果表明,TMA是研究和测试取向聚合物材料热收缩的简便有效方法。 相似文献