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61.
Chenglin Li Qingyuan Du Changhao Liu Yi An Ying Liu Xiuting Zheng Yue Ru Dali Gao Daming Wu Jingyao Sun 《应用聚合物科学杂志》2023,140(1):e53252
Due to the rapid development of multifunctional and miniaturized electronic devices, the demand for polymer composites with mechanical properties, high-thermal conductivity, and dielectric properties is increasing. Therefore, the heat dissipation capacity of the composite must be improved. To solve this problem, we report a glass fabric (GF)/boron nitride (BN) network with a highly thermally conductive hetero-structured formed using polyvinyl alcohol (PVA) as an adhesive. The GF and BN are furtherly modified by (3-aminopropyl)triethoxysilane (APTES) for better thermal conductivity enhancement. When the BN content is 30%, the thermal diffusion coefficient and thermal conductivity of obtained PVA-mBN@mGF (PBG) are 2.843 mm2/s and 1.394 W/(m K), respectively. Epoxy (EP) resin is then introduced to prepare PBG/mBN/EP laminated composites via the hot pressing method as applied as thermal conductive composites. A highest thermal conductivity of 0.67 W/(m K) of PBG/mBN/EP laminated composites is obtained, three times higher than that of pure EP. In addition, the PBG/mBN/EP laminated composites also present favorable mechanical, electrically insulating, and dielectric properties. 相似文献
62.
Resin-based composites used in spacecraft face risks from space debris and high-energy charged particles during their long-term service in the space environment. This work proposes a novel microcapsule (MC) and its cyanate ester (CE) resin-based composites (CE/MCs) with self-healing ability and gamma radiation shielding ability. The multifunctional epoxy/lead tungstate (EP@PWO) microcapsules are developed through self-assembly method and in-situ precipitation method. These microcapsules and curing agent 4,4′-diaminodiphenylsulfone (DDS) are incorporated into the CE resin to form resin-based composites with low curing temperature, self-healing ability, and gamma radiation shielding ability. Various approaches including chemical characterizations (X-ray diffractometer, fourier-transform infrared, energy dispersive spectrometer), microscopy (optical microscope, scanning electronic microscope), and thermal analysis (differential scanning calorimeter, thermogravimetric analysis) are utilized to demonstrate the successful encapsulation of the EP resin by PWO shell and good thermal stability of this material. The mechanical property, self-healing ability, and gamma radiation shielding property are investigated via fracture toughness test and using a NaI (Tl) spectrometer. In comparison with pure CE resin, the fracture toughness of the CE/MCs composites can increase by 66.5%, and the self-healing efficiency can reach up to 56%, indicating that the microcapsules have good toughening and self-healing abilities. The microcapsules and their composites also exhibit good gamma radiation shielding properties. 相似文献
63.
BACKGROUND: Bio‐based polymers from vegetable oils are excellent alternatives to petroleum‐based resins for both environmental and economic reasons. A detailed understanding of the cure behavior of bio‐based polymers is essential to optimize cure schedules and the final properties of the polymers. In this work, the cure of newly developed linseed oil‐based thermosetting resins, synthesized using Grubbs' first‐generation catalyst and a bis‐norbornadiene cross‐linking agent by ring‐opening metathesis polymerization, is characterized using differential scanning calorimetry (DSC) and parallel plate oscillatory rheometry. RESULTS: Experimental results reveal that the rate of cure increases and the gel time decreases with increasing cross‐linker loading; however, the activation energy of the cure does not vary systematically with cross‐linker loading. Phenomenological reaction models are used to describe the dynamic DSC measurements and to determine the kinetic parameters which facilitate cure predictions under isothermal conditions. CONCLUSION: This work demonstrates that the cure kinetics of a linseed oil‐based thermosetting resin can be controlled by varying the cross‐linker loading. Furthermore, the kinetic parameters and cure rates at any cross‐linker loading for this system can be described by a simple autocatalytic reaction model which facilitates development of cure schedules. Copyright © 2009 Society of Chemical Industry 相似文献
64.
A new class of thermosetting resins has been developed that is based on the cationic copolymerization of regular soybean oil (SOY), low saturation soybean oil (LSS), or conjugated LSS (CLS) with various alkene comonomers initiated by boron trifluoride diethyl etherate (BFE) or related modified initiators. The activation energy for the gelation process for these thermosets ranges from 95 to 122 kJ/mol. A time‐temperature‐transformation (TTT) isothermal cure diagram has been established for the model system LSS45–ST32–DVB15–(NFO5–BFE3) ie 45 wt% low saturation soybean oil, 32 wt% styrene, 15 wt% divinylbenzene, and 5 wt% Norway fish oil ethyl ester plus 3 wt% boron trifluoride diethyl etherate. The effect of curing conditions on the thermophysical and mechanical properties, including the mechanical damping and shape memory properties, has been subsequently investigated using this model thermoset. These findings allow the efficient optimization of desired properties for specific applications. © 2003 Society of Chemical Industry 相似文献
65.
How the physical confinement of phenolic resin in nano porous silica (8 nm ≤ pore diameter (Dp) ≤ 125 nm) affected the polymer's curing behavior was examined by conducting differential scanning calorimetry experiments at 320 K ≤ T ≤500 K. Our results suggested that upon incorporating the phenolic resin into the silica, its curing temperature was lowered. However, what was interesting was that there was an inverse linear dependence between the pore size and the curing temperature, i.e., the smaller the pore diameter the higher the curing temperature. There was evidence that phenolic resin was unable to penetrate into 8 nm‐sized pores. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci, 2006 相似文献
66.
The conditions and methods of preparing novel melamine–formaldehyde–cyclohexanone coatings are presented. The coatings were prepared by dissolving melamine in reactive solvents based on formaldehyde and cyclohexanone. The latter were prepared at different molar ratios of the components. The water resistance of the resulting coatings was measured. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 99: 1083–1092, 2006 相似文献
67.
从塑料和聚合物的特性、塑料焊接方法分类、焊接的基本步骤、焊接特点方面介绍了塑料和聚合物的超声焊接。一般认为,超声焊接的研究内容主要是研究与超声有关的焊接声参数方面的问题。其实,在国外更多地是从材料方面研究焊件在焊接过程中物理性能的变化,对此做了较详尽的介绍。超声波在热塑性粘弹性介质中传播相对于金属介质来说有较大耗损,文中也介绍了测定粘弹性介质复杨氏模量的基本方法。 相似文献
68.
The curing kinetics and chemorheology of a low‐viscosity laminating system, based on a bisphenol A epoxy resin, an anhydride curing agent, and a heterocyclic amine accelerator, are investigated. The curing kinetics are studied in both dynamic and isothermal conditions by means of differential scanning calorimetry. The steady shear and dynamic viscosity are measured throughout the epoxy/anhydride cure. The curing kinetics of the thermoset system is described by a modified Kamal kinetic model, accounting for the diffusion‐control effect. A chemorheological model that describes the system viscosity as a function of temperature and conversion is proposed. This model is a combination of the Williams–Landel–Ferry equation and a conversion term originally used by Castro and Macosko. A good agreement between the predicted and experimental results is obtained. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 3012–3019, 2003 相似文献
69.
70.
The curing kinetics of styrene (30 wt %) and cardanyl acrylate (70 wt %), which was synthesized from cardanol and acryloyl chloride, was investigated by differential scanning calorimetry under isothermal condition. The method allows determination of the most suitable kinetic model and corresponding parameters. All kinetic parameters including the reaction order, activation energy Ea and kinetic rate constant were evaluated. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 2034–2039, 2002 相似文献