硅压力传感器的可靠性测试

硅压力传感器的可靠性测试技术研究受到了国内外的重视，对它的测试项目及其加速寿命测试方法进行了综述。     

晶体硅中的铁沉淀规律

研究了在直拉单晶硅和铸造多晶硅中经110 0℃热处理快冷或慢冷条件下所形成的铁沉淀规律及其对少数载流子扩散长度的影响.红外扫描仪照片显示在直拉单晶硅中慢冷却形成的铁沉淀密度较低,而且其尺寸较大;在铸造多晶硅中,铁易在晶界上沉淀,沉淀规律也依赖于冷却速度.表面光电压仪测试结果表明:无论在直拉单晶硅材料中还是在铸造多晶硅材料中,快冷形成的铁沉淀对少数载流子扩散长度影响更大.实验结果可以用铁沉淀生成的热力学和动力学规律解释     

High resistivity measurement of SiC wafers using different techniques

To establish fast, nondestructive, and inexpensive methods for resistivity measurements of SiC wafers, different resistivity-measurement techniques were tested for characterization of semi-insulating SiC wafers, namely, the four-point probe method with removable graphite contacts, the van der Pauw method with annealed metal and diffused contacts, the current-voltage (I-V) technique, and the contactless resistivity-measurement method. Comparison of different techniques is presented. The resistivity values of the semi-insulating SiC wafer measured using different techniques agree fairly well. As a result, application of removable graphite contacts is proposed for fast and nondestructive resistivity measurement of SiC wafers using the four-point probe method. High-temperature van der Pauw and room-temperature Hall characterization for the tested semi-insulating SiC wafer was also obtained and reported in this work.     

Low-Power Log-Domain CMOS Filter Bank for 2-D Sound Source Localization

This paper proposes the design of a novel current-mode front-end for the extraction of localization spectral cues from two audio signals, together with test results. The front-end consists of two parallel filter banks, envelope extraction and comparison circuitry, together with an AGC loop. The extracted cues are intended to be further processed in order to determine the source azimuth and elevation. A current-mode log-domain implementation using subthreshold MOS operation is used for micropower operation while still achieving a good bandwidth and linearity. A current-mode solution is also preferred because of the ease of implementation of certain mathematical operations. The front-end splits the input signals into different frequency bands and computes monaural and interaural spectral cues from the resulting signal envelopes for each band. The front-end has been optimized to operate at a supply voltage of 1.8 V and most blocks have been designed using a differential architecture. To our knowledge, this is the first log-domain implementation of a front-end for 2-D localization cues extraction. The design has been carried out using a standard double-poly double-metal 0.8 m CMOS process with V _T = 0.8 V. The bandpass filters which form the main core of the chip exhibit a measured dynamic range of 62 dB corresponding to 1.9% THD, while the total power dissipation is 890 W.     

Low-resistance polysilicon process in contact application for high density devices

For the lowest resistance, it is required to have the epitaxial silicon contact between the silicon plug and the substrate and good step coverage at the high aspect-ratio contact holes, simultaneously. In this work, a double polysilicon (DPS) deposition technique was proposed for the requirements. The first, thin silicon layer is deposited in a single-wafer process chamber with an in-situ H₂-RTP (rapid thermal process) treatment for the epitaxial contact, and the second silicon layer is formed in a batch-type furnace for good step coverage. From chain resistance, Kelvin R_c, and current-voltage (I–V) measurement, the DPS process meets both low resistance and good uniformity, so that it suggests a breakthrough in the small-sized, semiconductor device application.     

Al2O3陶瓷激光铣削试验研究

采用Nd∶YAG脉冲激光器对Al2 O3陶瓷进行铣削加工试验。系统研究了工艺参数对铣削量和铣削面质量的影响规律 ,并利用优化的铣削工艺对Al2 O3陶瓷进行多种形状的铣削加工。     

氮化硅/石墨激光合金化涂层的组织结构与性能研究

为获得金属表面特别是高副接触金属表面含自润滑特性且具有高硬度耐磨特性的功能材料 ,研究了 45 # 钢表面激光合金化氮化硅 /石墨复合涂层的工艺方法、组织特征、界面形态及其形成机制 ,利用光学显微镜、扫描电镜和X射线能谱对所形成合金化层的元素分布和含量进行了分析 ,并对试样硬度进行了测定。结果表明 ,合金化层中元素Fe ,Co ,Si,C分布均匀 ;C含量达到了 15 6 9%,大部分以石墨的形式存在 ,具有一定的自润滑性能 ;但在形成合金化层的温度条件下 ,氮化硅分解严重 ;合金化层硬度提高的主要原因是Si Fe ,Co Fe固溶体的强化作用及高碳马氏体的生成和高硬度碳化物的存在。     

气象检测微系统软件开发

介绍了由硅微传感器组成的自动气象站网络 ,并对整个网络的数据采集和数据处理的系统软件的实现做了详细的说明 ,而且从系统的硬件组成到系统软件的模块设计都作了介绍。本软件完成了从远程控制系统采集现场的气象数据 ,实现了一机对多机的数据采集功能 ,同时对数据丢失的原因做了初步探讨     

用于硅衬底隔离的选择性多孔硅厚膜的制备

在硅衬底上形成高阻隔离层对于提高硅基射频电路的性能具有重要意义。采用多孔硅厚膜作为隔离层 ,能够极大地降低衬底高频损耗。本文对n+型硅衬底上选择性多孔硅厚膜的制备进行了研究。通过在阳极氧化反应中采用不同的HF溶液的浓度、电流密度和反应时间来控制多孔硅的膜厚、孔隙度等特性。有效地减少了多孔硅的龟裂失效 ,得到的多孔硅最大膜厚为 72 μm。并测量了多孔硅的生长速率与表面形貌     

硅压阻式传感器的温度特性及其补偿

基于硅压阻式传感器的工艺过程与后续电路设计 ,讨论了减小其温度影响的措施。文中对在相同的硅基底上 ,采用诸如扩散、离子注入、薄膜淀积以及溅射等不同加工工艺制作实现的不同的压敏电阻特性 ,特别是温度特性进行了探讨和比较。针对一种具体的硅杯结构的压阻式传感器 ,设计、选择了加工工艺 ,给出了压敏电阻的近似温度补偿公式 ,讨论了传感器补偿电路的实现方案