急冷铜合金的位错与时效亚晶

用ＴＥＭ与ＳＥＭ分别考察了急冷态Ｃｕ－０．８４Ｃｒ－０．０５Ｚｒ合金中的位错与随后时效组织中的亚晶形态。结果表明，该合金急冷组织中的高密度位错构成位错网络，在较高温时效过程中通过发生多边化转变成网络状与纤维状时效亚晶的亚晶界。     

Role of temperature gradient in liquid／solid phase solution-diffusion bonding

The liquid-film solution-diffusion bonding of ZCuBe2. 5 alloys was conducted using Cu-based alloy powders. The tensile strength of the joint is up to 318 MPa. With the increase of temperature gradient, the bonding time decreases and the interlace migration velocity increases remarkably. The appropriate temperature gradient is 5 -40 K/cm. Under fixed bonding time, the thickness of diffusion layer increases with the increase of temperature gradient, and this tendency becomes more remarkable with the prolonging of bonding time.     

基于人工神经网络的铜合金形变热处理工艺和性能

利用神经网络对Cu-Cr-Zr合金变形量、时效温度和时间与硬度和电导率样本集进行训练和学习，采用改进的BP网络算法-Levenberg—Marquardt算法，建立了形变热处理工艺BP神经网络模型，得出了具有较高综合性能的最佳工艺参数：在80％变形量，450-480℃，2～5h形变热处理条件下，硬度和电导率分别可达HV150～157和74％～77％(IACS)。     

Microstructures and properties of Sn-Ag-Cu lead-flee solder alloys containing La

Trace amounts of La were utilized to improve the melting behaviors, microstructures, tensile properties and microhardness of Sn-3.0Ag-0.5Cu lead-free solder alloy. La has little effect on the melting behavior of Sn-3.0Ag-0.5Cu alloy according to the differential thermal analysis （DTA） tests. The X-ray diffraction （XRD） patterns show that β-Sn, Ag3Sn and Cu6Sn5 coexist in the as-cast solder alloys and LaSn3 phases emerge when adding 0.4% La. The microstructures modified by La are more uniform and much finer than that of baseline alloy, and the coarse LaSn3 particles with complex dendrites are observed by optical microscopy （OM） and scanning electron microscopy （SEM） when the addition of La is up to 0.4%. The composition of the LaSn3 phases is identified by energy-dispersive spectroscopy （EDS）. There are considerable improvements in mechanical properties with 0.05% and 0.1% addition, but degenerations by adding 0.4%La. The Vickers microhardness of β-Sn and eutectic area are both enhanced with the addition of La and the microhardness of LaSn3 is much larger than those of β-Sn and eutectic area.     

CuCr25触头材料的喷射成形制备及其组织分析

研究了CuCr25合金的快速凝固喷射成形制备工艺，考察了喷射成形过程中各工艺参数对沉积坯件成形性的影响，观察和对比了喷射成形、真空熔铸和真空浸渗3种不同工艺制备的触头材料的显微组织。结果表明：喷射成形制备的材料具有典型的快速凝固组织，合金化状况良好，微观组织均匀，Cr析出相细小并弥散地分布在Cu基体中，Cr颗粒尺寸大约为3～10μm。这将大幅度提高材料的耐电压、抗电击穿等电学性能。     

引线框架材料C194x的组织性能分析

利用光镜、SEM和TEM等手段研究了热处理对合金微观组织的影响，通过测定应力-应变曲线、维氏硬度和电导率来研究合金的性能变化规律，并分析了材料组织性能变化的机理。     

氯化物熔体中电解制备Dy—Cu中间合金的研究

用循环伏安法、恒电位电解断电后的电极电位－时间曲线、电位阶跃法和Ｘ射线衍射法研究了Ｃｕ电极在ＮａＣｌ－ＫＣｌ－ＤｙＣｌ３熔体中的电化学行为，获知Ｄｙ在Ｃｕ电极上的还原过程是首先生成Ｄｙ－Ｃｕ合金，然后才析出纯金属Ｄｙ．测得Ｄｙ－Ｃｕ合金在１０７３Ｋ的标准生成自由能；在１０２３－１１４３Ｋ范围内，Ｄｙ原子在Ｄｙ－Ｃｕ合金相中的扩散系数与温度的关系式为ｌｎＤ＝－６７．１×１０３／ＲＴ－１５．８，其扩散活化能为６７．１ｋＪ·ｍｏｌ－１．用自耗阴极法制取了Ｄｙ－Ｃｕ中间合金并对其工艺条件进行了探讨。电解制取了含Ｄｙ高达９２％（质量分数）的Ｄｙ－Ｃｕ中间合金，其组成为ＤｙＣｕ和Ｄｙ，电流效率可达８０％．     

退火温度对铜合金-镍复合材料组织与力学性能的影响

对3种铜合金-镍复合材料进行了不同温度的退火处理，通过力学拉伸试验和电子探针(EPMA)观察与分析，研究了退火温度对3种复合材料的金相组织、元素扩散以及力学性能的影响。结果表明，经300℃以上温度退火处理后，3种复合材料的抗拉强度、屈服强度和硬度均随退火温度的升高而降低，而伸长率则随退火温度的升高而增大，铜合金与镍之间的Cu／Ni元素均发生了扩散，但主要是铜元素向镍层的扩散。合适的退火温度有利于提高复合材料的综合性能。     

Effect of solid fraction on steel-mushy Cu-graphite pressing bonding

The pressing bonding of steel plate to QTi3.5-3.5graphite slurry was studied. The bonding conditions were 620℃ for preheating temperature of steel plate, 530℃ for preheating temperature of dies, 50 MPa for pressure and 2 min for pressing time. The relationship between the solid fraction of QTi3.5-3.5graphite slurry and the interracial mechanical property of bonding plate was obtained. The results show that when the solid fraction of QTi3.5-3.5graphite slurry is smaller than 45.8%, the interracial shear strength of bonding plate increases with the increasing of solid fraction. When the solid fraction is larger than 45.8%, the interracial shear strength decreases with the increasing of solid fraction. When the solid fraction is 45.8%, the largest interracial shear strength of bonding plate 127 MPa can be got, and the interface is made up of Fe-Cu solid solution.