电沉积Ni-W合金镀层的X射线光电子能谱分析

采用X射线光电子能谱（XPS）对电沉积Ni-W合金镀层表面膜进行了分析。研究结果表明，Ni-W合金镀层表面存在一层薄的氧化膜，而钨的氧化作用远大于镍，Ni-W合金镀层中W含量的提高对耐蚀性起决定作用。     

高可靠镀Ni／Au工艺及其在微波PTFE电路上的应用

介绍了高可靠电镀Ｎｉ／Ａｕ工艺在ＰＴＦＥ微波印制电路上的应用，并分析了氨基磺酸盐镀软镍和亚硫酸盐镀软金工艺的影响因素及提高Ｎｉ／Ａｕ镀层之间附着力的措施。通过实验及应用证明了与直接镀金工艺相比，在软基材ＰＴＦＥ敷铜箔板上镀Ｎｉ／Ａｕ工艺能大大提高微波电路的可焊性，高温稳定性和长期可靠性，并且用其所制作的微波器件的高频性能也优于直接镀金工业。     

Catalytic behavior of YBa2Cu3O7-x in the partial oxidation of methanol to formaldehyde

The partial oxidation of methanol to formaldehyde was studied over YBa₂Cu₃O_7-x catalyst in a flow reactor. The structural change of YBa₂Cu₃O_7-x before and after the reaction was measured by means of XRD and iodometric titration method. The catalytic characteristics of YBa₂Cu₃O_7-x for the partial oxidation of methanol to formaldehyde was due to copper ions. It was found that Cu⁺² was responsible for the higher selectivity for formaldehyde.     

空气中烧成的镍导体及其应用

将空气中烧成的镍导体用于散热制冷片制作工艺中，可降低成本，提高合格率。通过实验得到的最佳值为：镍导体中４号玻璃（ＳｉＯ２＞３０，Ｂ２Ｏ３＞１０，ＰｂＯ＜５５，ＴｉＯ２少许）的含量４．５％，化学镀镍时间５０ｍｉｎ，方阻４７．５ｍΩ／□，附着力８．１Ｎ／ｍｍ２。     

Preparation of ultra-fine copper powder and its lead-free conductive thick film

In this paper, non-agglomerated monodispersed ultra-fine copper metallic powders have been synthesized with chemical reduction method. Fine lead-free glass powders were also prepared by solid synthesis process. Thick film paste prepared by above-mentioned copper metallic powders and lead-free glass powders was applied as conductive paste of MLCC. Mixture of glass and zinc oxide give the thick film a high adhesion strength which is attributed to the rough interface from interfacial reaction between glass and chip, and a good densification. Diffusion of metal between copper thick film and nickel thick film is clear. Ni-Cu solid solution appears under high temperature firing.     

Hydriding and Dehydriding Characteristics of Mechanically Alloyed LaMg_(17) Ni Composite Material

Magnesiumandmagnesiumalloyshavebeenin vestigatedashydrogenstoragematerialsforseveralde cadesbecausefarmorehydrogenbyweightcanbestoredinthemthaninmostoftheothercurrentlyknownhydrogenstoragealloys .Moreover ,thehighnaturalabundanceofMg ,itslightmassandenviron mentalcompatibilitypotentiallymakemagnesiumoneofthemostprospectivecandidatesforfuturehydrogenstoragematerials .Unfortunately ,thepracticalappli cationofMganditsalloyshasbeenlimitedonlytocertainstoragedevicebecauseoftheirpoorhydriding dehydr…     

Characterization of two-phase nickel aluminides produced by pressure-assisted combustion synthesis

Two-phase (B2+L1₂) nickel aluminide intermetallic compounds were synthesized by the pressure-assisted volume combustion synthesis (CS). The production and characterization of the samples containing NiAl+Ni₃Al were investigated. Aluminum (99% pure, 15 μm) and carbonyl nickel (99.8 pure, 4-7 μm) powders were used. The production of intermetallic compound was carried out at 1050 °C under 150 MPa uniaxial pressure in open air atmosphere in an electrical resistance furnace for 60 min. The formation temperature of intermetallic compound was determined by differential scanning calorimeter (DSC) analysis, and exothermic temperature of powder mixture was determined as 653 °C. The characterization of samples was confirmed by optical microscope, SEM and XRD analysis. It was observed that the structure of compound has very low porosity and the formation of NiAl was completed successfully. The relative density of test materials measured according to Archimedes’ principle was 98.04%. The microhardness of test materials was about 351 HVN₁.     

Copper(II) removal from aqueous solutions by fly ash

The removal of Cu(II) by adsorption on fly ash has been found to be concentration, pH and temperature dependent. The kinetics of adsorption indicates the process to be diffusion controlled. The Langmuir constants have been calculated at different temperatures, and the adsorption has been found to be endothermic (ΔH = 15.652 kcal mol^?1). The maximum removal is observed at pH 8.0, and variation in adsorption with pH has been explained on the basis of surface ionisation and complexation.     

A kinetic model for the acid-oxygen pressure leaching of Ni–Cu matte

A semi-empirical mathematical model for the acid-oxygen pressure leaching of Ni–Cu matte is presented, based on data from batch leaching experiments. The primary controlling factor in the leaching process is found to be galvanic inhibition of the more highly oxidized copper and nickel sulfide species by less oxidized species, particularly Ni alloy and Ni₃S₂. The leaching rate of many species is greatly reduced by the presence of one or both of these phases, and others will not commence leaching until neither is present. The mathematical model is based on first-order chemical reaction controlled rate expressions, as the reactions occurring are electrochemical in nature. Mass transfer effects are included only empirically. Some possibly diffusion-related phenomena are noted, although the model is not extended to incorporate these effects on a fundamental level. The model is verified and extended by the inclusion of several different factors that were tested experimentally. The effects of variations in O₂ flow rate and partial pressure, initial particle size, reaction pulp density and initial acid concentration were all studied, and included in the model. Variations in O₂ flow rate and partial pressure are found to affect the reaction rates via the dissolved oxygen concentration in the solution phase.