结构形式对椭圆扁管管内传热与流阻性能影响

利用数值模拟方法结合场协同理论,对直椭圆扁管、单向螺旋椭圆扁管和变向螺旋椭圆扁管管内传热与流动情况进行了数值模拟计算和理论分析,比较研究了不同的Re、Pr下,3种椭圆扁管的管内传热与流阻特性。结果表明,单向螺旋椭圆扁管和变向螺旋椭圆扁管与直椭圆扁管相比有很好的强化传热性能,而变向螺旋椭圆扁管要比单向螺旋椭圆扁管的强化传热性能更好。在管内流体具有高Pr及低Re的条件下,2种螺旋椭圆扁管的强化传热效果显著,可作为很好的强化传热元件应用于工程实际中。     

裂解炉炉管基于风险的检验

管式裂解炉炉管受炉内高温及管内介质压力的共同作用,易发生蠕变等现象,因此,对裂解炉炉管进行风险评价尤为重要。应用API 581基于风险的检验规范对炉管的失效可能性及失效后果分别进行定量计算,并由此得到裂解炉炉管的定量风险结果和基于风险的检验周期,为裂解炉的风险控制与管理提供依据。     

沉管隧道水下最终接头施工技术初探

简述了沉管隧道水下最终接头施工技术的应用现状，结合具体隧道工程实例，从外模工程、混凝土结构两方面介绍了最终接头施工技术，表明了该技术具有运用价值。     

Vapor absorption by LiBr aqueous solution in vertical smooth tubes

Heat and mass transfer in a falling film vertical in-tube absorber was studied experimentally with LiBr aqueous solution. The presented results include the effect of solution flow rate, solution subcooling and cooling water temperature on the absorption in a smooth copper tube 16.05 mm I.D. and 400 mm long. The experimental data in the previous report for a 1200-mm-long tube was also re-examined and compared. It was demonstrated by the observation of the flow in the tube that the break down of the liquid film into rivulets leads to deterioration of heat and mass transfer at lower film Reynolds number or in longer tubes. An attempt to evaluate physically acceptable heat and mass transfer coefficients that are defined with estimated temperature and concentration at the vapor–liquid interface was also presented.     

Determining the Instantaneous Effective Energy of x-Ray Tube Bremsstrahlung

A method is described for determining the instantaneous effective energy of x-ray tube brehmsstrahlung by means of two semiconductor detectors employing epitaxial GaAs structures and a measurement circuit, which together determine the effective energy with an error of 5% in the range 20–80 keV in the presence of nonlinearity in the detector response.     

Effect of Sb implantation on copper silicides formation and morphology after annealing of Cu/Si structures

In this work, the solid state reaction between a thin film of copper and silicon has been studied using Rutherford backscattering spectroscopy, X-ray diffraction, scanning electron microscopy and microprobe analysis. Cu films of 400 and 900 Å thicknesses are thermally evaporated on Si(1 1 1) substrates, part of them had previously been implanted with antimony ions of 5×10¹⁴ or 5×10¹⁵ at. cm⁻² doses. The samples are heat-treated in vacuum at temperatures in the range 200–700 °C for various times. The results show the growth and formation of Cu₃Si and Cu₄Si silicides under crystallites shape dispatched on the sample surface, independently of the implantation dose. On the other hand, it is established that the copper layer is less and less consumed as the antimony dose increases, resulting in the accumulation of Sb⁺ ions at silicide/Si interface and in the silicide layer close to surface. The exposure of samples to air at room temperature shows the stability of Cu₄Si phase whereas the Cu₃Si silicide disappears to the benefit of the silicon dioxide formation. The observed phenomena are discussed.     

魏氏组织对20#碳钢H2S应力腐蚀开裂性能的影响

文章对H₂S-CO₂-H₂O腐蚀环境下发生H₂S应力腐蚀的20^＃碳钢弯管（无缝钢管）进行了成分、组织、拉伸、硬度和应力腐蚀开裂等性能的试验研究，并与同材质、同时投产、腐蚀环境基本相似而未发生应力腐蚀开裂的在役弯管及未使用的新弯管作对比，结果表明魏氏组织是引起20^＃钢发生应力腐蚀开裂的主要原因；正火能消除魏氏组织，降低钢的应力腐蚀开裂敏感性。     

铜蒸气激光器种子注入光腔的参数计算

用矩阵光学理论计算了由主振荡器和功率放大器组成的种子注入光腔。主振荡器光腔是由曲率半径R1=-250mm,R2=5000mm,相距L=2375mm的球面镜组成的正支非稳腔;功率非稳腔是由曲率半径R3=400mm,R4=5600mm,相距S=3000mm的球面镜构成的负支非稳腔。理论计算表明,该种子注入光腔可输出光束发散角约几十微弧的激光,可满足铜蒸气激光器主振荡器功率放大器(MOPA)的技术要求。     

Atomic layer chemical vapour deposition of copper

Copper films with (1 1 1) texture are of crucial importance in integrated circuit interconnects. We have deposited strongly (1 1 1)-textured thin films of copper by atomic layer deposition (ALD) using [2,2,6,6-tetramethyl-3,5-heptadionato] Cu(II), Cu(thd)₂, as the precursor. The dependence of the microstructure of the films on ALD conditions, such as the number of ALD cycles and the deposition temperature was studied by X-ray diffraction, scanning electron microscopy (SEM), and transmission electron microscopy. Analysis of (1 1 1)-textured films shows the presence of twin planes in the copper grains throughout the films. SEM shows a labyrinthine structure of highly connected, large grains developing as film thickness increases. This leads to low resistivity and suggests high resistance to electromigration.     

薄壁圆筒试样的扭转断裂曲线

通过比较多种材料的光滑薄圆筒和切口薄壁圆筒试样的扭断裂曲线，测向两种试验的断裂韧性ＫＩＩＣ相同，从而间接证实了利用光滑薄壁筒测定延性金属断裂韧性ＫＣ方法的正确性。