Adsorption behavior of cross-linked chitosan modified by graphene oxide for Cu（Ⅱ） removal

Cross-linked chitosan（CS）,cross-linked chitosan/graphene（CS/RGO10） and cross-linked chitosan/graphene oxide（CS/GO10） were prepared as adsorbents for Cu（Ⅱ）.The effects of pH,contact time,adsorbent dosage and initial concentration of Cu（Ⅱ） on the adsorbing abilities of CS,CS/RGO10 and CS/GO10 to Cu（Ⅱ） were investigated.The results demonstrate that the adsorption capacities of CS/GO10 and CS/RGO10 are greater than that of CS,especially at pH 5.0 and the adsorption capacities are 202.5,150 and 137.5 mg/g,respectively.Their behaviors obey the Freundlich isotherm model very well.Additionally,CS/GO10 has the shortest time to achieve adsorption equilibrium among them and can be used as a perspective adsorbent for Cu（Ⅱ）.     

Full color white light,temperature self-monitor,and thermochromatic effect of Cu+ and Tm3+ codoped germanate glasses

Lighting sources with full-color visible output are widely preferred in practical applications. In addition, modern lighting sources also tend to be intelligentized, and the intelligentization asks for smart luminescence materials. In this work, we attempt to develop novel full-color emitting material with temperature sensing and thermochromatic ability. To this end, the Cu²⁺ is successfully reduced to Cu⁺ which is incorporated into the germanate glasses. The glasses are prepared via a melt-quenching technique using graphite powders as reducing reagent. The supper-broadening of the excitation and the emission spectra of Cu⁺ in the germanate glasses are observed. Full-color emission is realized by introducing Tm³⁺ as co-dopant to provide the blue component in the spectra. The energy transfer behavior between Cu⁺ and Tm³⁺ is investigated, and it is found that these two luminescence centers are independently existent without energy transfer between them. The chromatic properties of the Cu⁺/Tm³⁺ co-doped glasses are tuned by Tm³⁺ concentration and excitation wavelength. The temperature sensing based on the fluorescence intensity ratio technique is demonstrated, and a constant sensitivity for the temperature detection is obtained. Moreover the thermochromatic property is also investigated, and it is found that the studied Cu⁺/Tm³⁺-doped glasses exhibit excellent thermochromatic performance.     

锶对消失模铸造B319铝合金铜相的影响

在消失模铸造慢冷条件下，B319铝合金组织中除存在α—Al枝晶及Si相外，还存在珊瑚状的A12Cu相及针状的β—Fe相，且Si相及针状β-Fe相可以作为Al2Cu的形核基底。Sr变质引起了离异共晶反应，使A12Cu相在缺乏Si相的区域析出，并促使Si在Cu相中溶解。研究还表明，采用0．03％Sr可以获得较好的变质效果，并使A1—Si共晶温度从575．9℃下降到566．4℃，从Cu相析出温度从520．4℃下降到512．5℃。     

Negative ion etching of Al−Si−Cu by employing a magnetic filter in halogen plasmas

Al etching was studied employing negative ions generated in downstream Cl₂ plasma. The Al etch rate by the alternate irradiation of positive and negative ions was two times higher than that by usual positive ions. In order to etch the Al film practically on an insulator covered electrode coupled with RF power, reduction of the negative self bias voltage (Vdc) was examined using a magnetic filter which traps electrons. The reason for the high etching reactivity is that the dominant negative ions F in SF₆ and Cl⁻ in Cl₂ plasmas are atomically very similar to the radicals. Addition of SF₆ and H₂ to a Cl₂/BCl₃ mixture reduced Vdc significantly. However, fluorine and hydrogen atoms inhibited Al etching in spite of sufficient ion energy.     

Al2O3/Cu复合材料的内氧化制备及性能研究

采用高能球磨制备出亚稳态的Cu-1%Al（质量分数）合金粉,再将Cu2O粉与其一起进行高能球磨,然后将复合粉末压坯在N2保护炉中同时进行氧化和烧结,制备出Al2O3/Cu复合材料。分析了分别采用湿法球磨和干法球磨时的合金化效果,讨论了模压压力对材料性能的影响。结果表明,对于Cu-Al混合粉来说,采用湿法球磨容易产生分层,采用干法球磨具有良好的合金化效果;在本试验条件下,750MPa为最佳的模压压力,但烧结后材料的电导率还是偏低,因此有必要进行后续的处理来进一步提高材料的性能。     

高温预析出对Al-Zn-Mg-Cu铝合金显微组织、强度和应力腐蚀抗力的影响

通过改变固溶条件 ,对Al Zn Mg Cu高强铝合金采用先高温后低温的两步固溶处理 (高温预析出 )来改善晶内和晶界的析出状态 ,研究了高温预析出对Al Zn Mg Cu铝合金的金相组织、强度和应力腐蚀性能的影响。结果表明 ,4 6 5℃高温预析出在保持较高强度和塑性的同时 ,可以改善合金的抗应力腐蚀性能     

弥散强化铜基复合材料钎焊接头强度

从冶金方面就如何改善Al2O3P颗粒与钎缝的化学相容性及工艺参数对钎焊接头力学性能的影响进行了初步探讨。研究结果表明。当保温时间较短时，由于钎缝中含有较多的Al2O3P颗粒相，且有偏聚的趋势，钎焊接头强度较低；延长保温时间，钎料中活性组元Ti与Al2O3P颗粒反应，可以有效控制Al2O3P含量，从而减缓其不利影响，使钎焊接头强度大幅度提高。     

内氧化制备Cu/Al2O3弥散强化铜的组织性能研究

实验用Cu2O粉作氧化剂,采用简化的内氧化法工艺,在900℃下使Cu-Al合金薄平板内氧化,获得Cu/Al2O3复合材料。研究不同氧化时间(3、6、10 h)下的Cu/Al2O3复合材料的组织特征及性能。研究表明:复合层中Al2O3颗粒呈弥散状分布;复合层表面和内部的晶粒大小明显不同,由于表面Al2O3析出较早,阻止晶粒的充分长大;表面晶粒较小,表面硬度随时间延长而升高。     

Al2O3/Cu复合材料强化机理研究

采用内氧化法制备了Al2O3／Cu复合材料，进行了高温电子拉伸实验，并通过微观组织观察，分析了该复合材料的强化机理。拉伸实验结果显示：Al2O3／Cu复合材料不仅室温强度很高，而且高温时仍保持较高的强度。微观组织观察分析表明：细小的Al2O3颗粒的弥散分布是该复合材料具有高强度的主要原因，表现在：Al2O3颗粒存在能够抑制Cu基再结晶的进行；Al2O3颗粒的存在阻碍晶界亚晶界运动，从而阻碍晶粒长大；Al2O3颗粒的阻碍位错运动，增加位错密度；Al2O3颗粒的存在提高材料的蠕变抗力。     

内氧化法制备Al2O3/Cu复合材料的再结晶

利用内氧化法制备了Al2O3/Cu复合材料,研究了该材料在不同冷拔变形量和Al2O3含量下,其硬度值随退火温度变化的规律,并进行了显微组织结构分析。结果表明:采用内氧化法制备的Al2O3/Cu复合材料,在铜基体中弥散分布着纳米级的Al2O3颗粒;经900℃×1h退火后,其硬度可保持室温的87%以上;其再结晶温度高达1000℃;变形量和Al2O3含量增加均使硬度提高,但对软化和再结晶温度影响不大。