使用铜纳米和银纳米的电路形成技术

概述了使用纳米粒子的电路形成技术。     

Surface-tension measurements of the eutectic alloy (Ag-Sn 96.2 at.%) with Cu additions

The maximum bubble-pressure method has been used to measure the surface tension and density of liquid alloys (Ag-Sn)_eut + Cu (X_Cu = 0.005, 0.020, 0.0375, and 0.065 (mole fraction)). The surface tension and density measurements were curried out in the temperature ranges of 262–942°C and 264–937°C, respectively. The linear dependencies of surface tensions and densities on temperature were observed, and they were described by straight-line equations. It has been found that the additions of Cu to the Ag-Sn eutectic alloy increase the surface tension. Experimental data of the surface tension were compared with those from modeling based on Butler’s method, using the optimized-thermodynamic parameters from the literature, and a slight tendency contrary to the experimental results was observed.     

Grain morphology of Cu damascene lines

The evolution of the grain structure through annealing of narrow damascene Cu interconnects is important for any further design of highly integrated circuits. Here we present a comprehensive transmission electron microscopy study of damascene lines between 80 nm and 3000 nm wide. Experimental results clearly indicate that morphology evolutions through annealing are strongly influenced by the line width. If the lines are wider than 250 nm a strong connection between the grain structure within the lines and the overburden copper is present at least after sufficient annealing. Once the lines are as small as 80 nm the grain structure within the lines are only weakly connected to the overburden copper grown above.     

Development of compatible wet-clean stripper for integration of CoWP metal cap in Cu/low-k interconnects

Implementation of CoWP metal caps into Cu/low-k integration schemes requires a wet stripper that not only gives efficient cleaning but also has good compatibility to CoWP and low-k dielectrics. This paper describes a novel non-fluoride CoWP compatible stripper, developed based on a systematic study of the effect of stripper components, i.e. solvent, corrosion inhibitor, and stripper pH. Electrochemical methods were used to characterize galvanic corrosion of the CoWP/Cu couple and to estimate CoWP etch rate. Our studies showed that a traditional fluoride stripper caused severe damage to CoWP capping layer. The new stripper achieved a good balance between cleaning efficiency and compatibility to CoWP and low-k dielectrics, and demonstrated significant advantages in electrical properties over the traditional fluoride stripper.     

Sn3.8Ag0.7Cu和Sn37Pb焊点界面显微结构研究

利用扫描电子显微镜（SEM）和透射电子显微镜（TEM）研究了Sn3.8Ag0.7Cu（Sn37Pb）/Cu焊点在时效过程中的界面金属间化合物（IMC）形貌和成份。结果表明：150℃高温时效50、100、200、500h后,Sn3.8Ag0.7Cu（Sn37Pb）/Cu焊点界面IMC尺寸和厚度增加明显,IMC颗粒间的沟槽越来越小。50h时效后界面出现双层IMC结构,靠近焊料的上层为Cu6Sn5,邻近基板的下层为Cu3Sn。之后利用透射电镜观察了Sn37Pb/Ni和Sn3.8Ag0.7Cu/Ni样品焊点界面,结果显示,焊点界面清晰,IMC晶粒明显。     

Sn-3.0Ag-0.5Cu真空再流焊工艺技术研究

为了获得低热阻和解决不同焊接材料之间的热应力匹配问题,大功率DC-DC模块电源产品广泛采用了载体组件作为功率元器件热沉的散热方法。载体组件由金属基板和陶瓷基板焊接而成,为了得到无空洞的焊接界面,载体组件采用了真空再流焊工艺技术。文中从焊料形态、焊接表面处理、真空度等几个方面介绍了载体组件的Sn-3.0Ag-0.5Cu真...     

Electromechanical properties of printed copper ink film using a white flash light annealing process for flexible electronics

We report on a systematic study of the electromechanical properties of flexible copper (Cu) thin film for flexible electronics. Cu ink is synthesized with chemical reduction process. Cu ink film spin-coated on a polyimide substrate is annealed with white flash light, also known as intense pulsed light (IPL), which guarantees a room temperature and sub-second process in ambient conditions. IPL annealed Cu film shows the electrical resistivity of 4.8 μΩ cm and thickness of 200 nm. The electromechanical properties of IPL annealed Cu film are investigated via outer/inner bending, stretching, and adhesion tests, and it is compared with conventional electron-beam evaporated Cu film. IPL annealed Cu film shows a constant electrical resistance within a bending radius of 6 mm. The bending fatigue test shows that the Cu film can withstand 10,000 bending cycles. In the stretching test, the Cu film shows a 50% increase in resistance when a strain of 2.4% was induced. At 4% strain, the resistance increases more than 200%. Meanwhile, the electron-beam evaporated film shows a constant resistance up to a strain of 4%. Lower stretchability of IPL annealed Cu film is attributed to its inherent cracks and porous film morphologies. IPL annealing induces the local melting at the interface between the substrate and Cu film, which increases the adhesion strength of the Cu film. These results provide useful information regarding the mechanical flexibility and durability of the nanoparticle films for the development of flexible electronics.     

GPU集群能耗优化控制模型研究

随着大数据技术的发展,GPU集群作为一种高效的并行系统被应用到大规模数据实时计算中.能量是实时计算时重要的资源,GPU集群的能耗优化及实时消减成为一个具有挑战性的问题.从集群全局角度引入模型预测控制策略,并建立闭环反馈机制的多输入多输出控制器.通过调整计算频率和改变活跃流多处理器来改变能耗状态,利用反馈和滚动优化机制完成对未来的控制预判,实现消减冗余能耗的目标.实验表明:控制模型的精度和节能效果优于基准模型,而且具有较好的稳定性,适合应用到大规模数据实时计算中.     

热处理工艺对Al/Cu双金属复合界面的影响

采用POLYVAR-MET型金相显微镜、带有GENESIS60S能谱仪的Sirion200场发射扫描电镜对经高温和低温退火处理的Al/Cu双金属复合界面组织进行观察分析,研究热处理工艺对界面组织及扩散层厚度的影响规律,并进一步通过冷轧实验研究扩散层厚度与界面结合强度的关系,获得综合满足材料结合强度和成型性能的热处理工艺。结果表明:高温退火处理的Al/Cu复合试样难以实现稳定的塑性成型,低温退火处理能使界面结合牢固,冷变形塑性好;Al/Cu双金属复合材料的界面扩散结合层厚度的最佳范围为1.2~3.5μm;最佳工艺为低温退火加热到300~350℃,保温45~60 min。     

Al2O3陶瓷表面的准分子激光活化沉积金属Cu技术

本文研究了通过ＸｅＣｌ准分子激光照射Ａｌ２Ｏ３陶瓷表面后,使其表面沉积金属Ｃｕ的技术,实验结果表明,Ａｌ２Ｏ３试样浸入Ｃｕ２ＳＯ４溶液后,金属Ｃｕ膜只沉积于激光照射区。经准分子激光照射,Ａｌ２Ｏ３表面结构的变化和Ａｌ富集区的产生是金属Ｃｕ沉积的主要原因。