喷射沉积7075/SiCp铝基复合材料挤压变形的数值模拟

采用Deform-2D有限元软件对喷射沉积7075／SiCp铝基复合材料挤压变形进行数值模拟。模拟采用的挤压变形条件为：挤压比4-100，锭坯预热温度300-450℃，挤压杆速度2-20mm／s。结果表明：在挤压变形区内应力及温度变化剧烈，且在模子入口处均出现最大值；挤压比和挤压速度越大，应力越大，温度效应也越显著。喷射沉积7075／SiCp铝基复合材料最佳挤压条件为：锭坯预热温度350-400℃、挤压比16-50、挤压杆速度5～15mm／s。数值模拟结果和工艺实验测量值吻合较好。     

Infiltration kinetics of pressureless infiltration in SiCp／Al composites

The pressureless infiltration kinetics was investigated by plotting the infiltration distance as function of the infiltration time. The effects of key process parameters such as time, temperature, Mg content on the pressureless infiltration of silicon carbide particle compacts were studied and quantified. The preform with high volume fraction SiC was obtained by mixing SiC particles with bimodal size distribution, whose diameters are 5 and 50 btm, respectively. The results show that an incubation period exists before infiltration, the influence of temperature on the incubation time exceeds that of Mg content, infiltration rate increases with the increasing temperature and Mg content, infiltration rate decreases as Mg consumes. A model of macroscopical infiltration and microscopical infiltration of liquid alloy in porous SiC preform was proposed.     

脉冲电场作用下SiCp/2014颗粒增强铝基复合材料的制备

介绍了一种新的制备颗粒增强铝基复合材料的方法，对处于熔点以上的铝液及SiCp颗粒施加一定时间的电脉冲，观察其凝固组织，发现增强颗粒分布均匀，基体合金晶粒细小，致密度正常，强度，耐磨性较高，该 方法是一种简单易行的制备颗粒增强铝基复合材料的新方法。     

电子封装SiCp/Al复合材料的制备与性能

研究了无压渗透法制备电子封装SiCp/Al复合材料过程中,烧结工艺对SiC预制件开孔率、抗压强度的影响,以及渗透工艺对Al液渗透形成复合材料的影响,并对所制备的复合材料热物理性能和表面涂覆进行了评价。结果表明,经1100℃分段烧结的SiC预制件开孔率、抗压强度较好;Al液浇铸温度、保温温度分别在750～850℃、800～900℃的范围时,SiC预制件的渗透效果较好;所制备的55%SiCp/Al复合材料相对密度为98.3%,热膨胀系数在（7.23～9.97）×10-6K^-1之间变化,热导率为146.5～172.3W/（m.K）,复合材料表面涂覆性能可行性好。     

Interface structure and formation mechanism of vacuum-free vibration liquid phase diffusion-bonded joints of SiCp/ZL101A composites

The vacuum-free vibration liquid phase(VLP) diffusion-bonding of SiCp/ZL101A composites was investigated. The effects of vibration on the interface structure, the phase transformation and the tensile strength of bonded joints were examined. Experimental results show that the oxide film on the surface of the composites is a key factor affecting the tensile strength of boned joints. The distribution of the oxide layers at the interface changes from a continuous line to a discontinuous one during vibration. The tensile strength of the VLP diffusion-bonded joints increases with the vibration time, and is up to the maximum of 172 MPa when the vibration time is 30 s. The phase structure of the bond region changes from the Zn-Al-Cu hyper-eutectic (η (β η) (β η ε)) phases to Al-rich Al-base solid solution (α-Al) with increasing the vibration time.     

离心力作用下Al/SiCp系统二维凝固过程的数值模拟

采用数值计算方法对离心浇铸下Al/SiCp系统的二维凝固过程进行了研究，给出了各种因素对最终颗粒分布的影响，结果表明，从外侧面冷却时凝固件中颗粒的分布由内侧向外侧可依次分为以下区域：颗粒体积分数为零区、颗粒梯度区、颗粒堆积区以及最外侧的梯度薄层。外部介质对流换热系数减小时，颗粒堆积区和颗粒体积分数近似为零区范围将增大，而颗粒梯度区范围则会减小；颗粒尺寸增大或铸模转数增加时，也会产生同样情况。     

SiCp/2024 复合材料棒材半固态挤压数值模拟

SiCp/2024复合材料棒材半固态挤压是一个典型的半固态触变成形过程,尤其对高固相分数(～60%),更接近于塑性加工中超塑性变形机制.对其加工过程进行了数值模拟,以便揭示高固相体积分数半固态触变成性的规律.研究表明稳态触变挤压的关键是在于保证压力下速度与半固态坯料的凝固速度相协调,只有当变形区坯料保持在固相分数较高固-液态或刚凝固完状态时,才能实现稳态的触变挤压过程;随着挤压温度的升高,挤压力减小其等效应力、等效应变值更均匀,且等效应力减小;随着摩擦系数的减小,平均拉应力值减小.     

高体积比SiCp/6063Al复合材料的铝基钎料制备及钎焊工艺研究

采用快速甩带技术制备了(Al-10Si-20Cu-0.05Ce)-1Ti(质量分数/%)急冷箔状钎料,并对60%体积分数的SiCp/6063Al复合材料进行真空钎焊实验,然后对钎料及接头的显微组织与性能进行测定和分析。结果表明,急冷钎料的微观组织细小、成分均匀,厚80~90μm,主要包含Al、CuAl2、Si和Al2Ti等相。当升高钎焊温度(T/℃)或延长保温时间(t/min),SiCp/钎料界面的润湿性改善,6063Al基体/钎料间互扩散和溶解作用增强,接头连接质量逐渐提高。当T=590℃、t=30min时,接头抗剪强度达到112.6 MPa;当T=590℃、t=50min时,少量小尺寸SiCp因液态钎料排挤而分散于钎缝,因加工硬化而使接头强度递增7.3%。然而,当T≥595℃、t≥60min时,SiCp偏聚于钎缝,导致接头组织恶化,且剪切断裂以脆性断裂为主。综合考虑钎焊成本与接头强度使用要求,确定最佳钎焊工艺为590℃、30min。     

不同应力比下SiCp/Al复合材料疲劳裂纹扩展行为

为了研究应力比对SiC颗粒增强铝基复合材料疲劳性能的影响,采用真空液态搅拌法制备了SiCp/Al复合材料,并对CT试样循环加载测定其裂纹扩展曲线.研究了三种不同应力比下的裂纹扩展行为,结果表明:随着应力比R增大,疲劳裂纹扩展速率da/dN降低.疲劳裂纹的断口形貌塑性断裂越明显,裂纹尖端塑性区增大,裂纹尖端钝化越显著,二次裂纹数量增加.     

SiCp／ZA30复合材料摩擦磨损特性研究

研究了ＳｉＣｐ／ＺＡ３０复合材料的摩擦磨损特性。结果表明：ＳｉＣｐ／ＺＡ３０复合材料的耐磨性优于高铝锌基合金，并随ＳｉＣ粒子加入量的增加而增大。