Choice of reference surfaces for machined surface roughness in milling of SiC_p/Al composites

In order to choose the appropriate reference surface on the machined surface roughness of Si Cp/Al composites, the cutting experiments of Si Cp/Al composites were carried out, and the machined surface topography was measured by OLS3000 Confocal laser scanning microscope. The 3D measured data of machined surface topography were analyzed by the area power spectrum density. The result shows that the texture of machined surface topography in milling of Si Cp/Al composites is almost isotropic. This is the reason that the values of Rq at different locations on the same machined surface are obviously different. Through the comparison of performance of different filtering methods, the robust least squares reference surface can be used to extract the surface roughness of SiC p/Al composites effectively.     

SiCp—Al复合材料超塑性变形时的电场效应

研究了强电场对１５ｖｏｌ％ＳｉＣｐ／ＬＹ１２复合材料超塑性变形的影响。结果表明，合适的强电场可提高应变速率敏感性指数ｍ值，降低流动应力、提高极限延伸率，细化晶粒。因此，电场改善了ＳｉＣｐ－Ａｌ复合材料的超塑性能。     

Joining of SiCp/Al composites by insert powder layers

Mixed Al-Si, Al-Si-SiC and Al-Si-W powders were employed as insert layers to reactive diffusion bond SiCp/6063 MMC. The results show that SiCp/6063 MMC joints bonded by the insert layer of the mixed Al-Si powder have a dense joining layer with a typical hypoeutectic microstructure. Using mixed Al-Si-SiC powder as insert layer, SiCp/6063 MMC can be reactive diffusion bonded by a composite joint. Because of the SiC segregations, however, there are a number of porous zones in the joining layer, which results in the low shear strength of the joints, even lower than that of joints reactive diffusion bonded by the insert layer of mixed Al-Si powder. The W added into the insert layer of Al-Si-W nearly all reacts with Al to form intermetallic WAl12 during bonding. The reaction between the W and Al facilitates to form a dense joint of high quality, and the formed interrnetallic WAl12 has a reinforcing effect on the joints, which lead to the high shear strength of the joints. In general, under the condition of fixed bonding time （temperature）, the shear strengths of the joints increase as the bonding temperature （time） increases, but tend to a maximum at bonding temperature of 600℃ （time 90 min）.     

SiCp/LD2复合材料焊缝组织及性能

采用Al—Mg及Al-Si两种焊丝分别对SiCp／LD2复合材料进行了MIG焊，利用光镜、电镜及MTS-810试验机对焊缝的组织及性能进行了分析，结果表明，采用Al-Mg焊丝焊接时，熔池中Al—SiC间的界面反应程度均较大．生成了较多的针状Al4C3，且Al4C3的尺寸较大。采用Al-Si焊丝时，MIG焊熔池中的界面反应程度显著降低，仅生成了少量尺寸较小的针状Al4C3；利用Al—Si焊丝还可有效地防止焊缝熄弧处的宏观结晶裂纹。力学性能试验表明，用Al-Si焊丝焊接的接头强度比用Al—Mg焊丝焊接的接头强度高。     

无压反应烧结MOSi2—SiCp复相材料的制备与性能

采用无压反应烧结方法制备了MOSi2-SiCp复相材料。结果表明：直接采用元素粉Mo，Si与Si，C粉或SiC粉反应，较难制得致密的MOSi2-SiCp复相材料；而采用MoSi2合金粉同Si，C反应可获得致密的MOSi2-SiCp复相材料。同时对不同SiC含量的MOSi2-SiCp复相材料的强度和电阻率进行了测定分析，得到强度最高值为157MPa，电阻率随SiC含量的增加而增加。     

SiCp/Al复合材料脉冲激光焊接研究

研究了SiCp/Al复合材料的脉冲激光焊接。重点讨论了激光光强，脉冲作用时间及激光束聚焦位置等参数对焊缝熔深和宽度的影响；讨论了其界面反应对焊接接头力学性能的影响。研究结果表明，SiCp/Al复合材料的激光焊接区存在着3个组织性能明显不同的区域。     

石墨对亚微米SiCp/Cu复合材料耐磨性能的影响

以亚微米SiCp、石墨和铜粉为原料,采用冷压烧结和热挤压方法制备了亚微米SiCp/Cu基复合材料和亚微米SiCp 石墨/Cu基复合材料,考察了添加石墨对亚微米SiCp/Cu基复合材料硬度、拉伸性能、致密性和耐磨性的影响.结果表明,石墨的加入轻微降低了SiCp/Cu基复合材料的硬度、伸长率、致密性和耐磨性,在一定程度上提高了抗拉强度,并且磨损表面上的粘着、塑性变形和物质转移倾向亦明显降低,能起到较好的减磨作用.     

SiCp/Al复合材料搅拌铸造新型搅拌器流场及工艺研究

SiCp/Al复合材料搅拌铸造法虽然具有制备成本低、近终成型的优点,但是实现SiC颗粒在铝合金熔体的均匀分散难度很大,这与搅拌器结构及搅拌工艺有直接关系。采用数值模拟和实验相结合的方法开展了新型桨栅复合搅拌器设计及其工艺研究,比较了桨栅复合搅拌器与单一搅拌器的流场结构和速度场分布,并在此基础上进行了搅拌铸造工艺研究。结果表明:(1)桨栅复合搅拌器能够较好地实现复合材料大体积熔体的均匀搅拌和高速剪切,复合搅拌器内熔体的流场为较好的轴向和径向循环,液面更为平稳,搅拌转速500r/min时熔体最大速度为3.9m/s,流场结构和剪切速度均优于单一形式搅拌器;(2)用桨栅复合搅拌器进行20%(质量分数)SiCp/A357复合材料搅拌铸造工艺实验,在搅拌温度610℃、搅拌转速500r/min、搅拌时间20min的工艺条件下,SiC颗粒分布均匀且无气孔缺陷。     

高体积比SiCp/A356复合材料真空扩散钎焊接头组织与性能研究

采用快速甩带技术制备了7组(Al-33.3Cu-6.0Mg)-xNi(x=0,0.5,1.0,2.0,3.0,4.0,5.0,质量分数/%)急冷箔状钎料,分别对化学镀Ni-P合金前后的SiCp/A356复合材料进行真空扩散钎焊。通过剪切实验对钎焊接头的抗剪强度进行测定,并利用扫描电镜和能谱分析等方法对接头微观组织进行观察和分析。结果表明,当向Al-33.3Cu-6.0Mg钎料合金中添加不同含量的Ni时,其急冷钎料的固-液相线(504~522℃)变化较小;当w(Ni)=3%且在570℃、保温30min的钎焊工艺下,A356基体/钎料两界面间发生适当的互扩散和溶解现象(585℃时出现溶蚀缺欠),且部分钎料/SiC颗粒的接触界面发生Mg参与的化学反应,接头抗剪强度达到64.97 MPa;而在同种钎焊工艺下,对于化学镀Ni-P合金镀层后的SiCp/A356复合材料,其接头处A356基体/Ni-P合金镀层/钎料等接触界面易于形成富含Al、Ni的致密反应层,接头连接质量显著提高,且w(Ni)=4%时,接头抗剪强度达到79.96 MPa。     

粉末冶金法制备SiC_p/Al_2W_3O_(12)/Al复合材料及其热膨胀性能

通过添加适量的Al_2W_3O_(12)负热膨胀粉体来优化碳化硅颗粒增强铝基(SiC_p/Al)复合材料的热膨胀系数。实验采用固相法制备负热膨胀性能的Al_2W_3O_(12)粉体,并按10%,20%,30%的体积比添加至SiC_p/Al复合粉体中,利用粉末冶金工艺制备SiC_p/Al_2W_3O_(12)/Al复合材料。实验结果表明:制备的复合材料组织分布均匀,致密度良好。室温到200℃内,在Al基体质量分数不变的前提下,Al_2W_3O_(12)的加入有效降低了复合材料的热膨胀系数。