钴基自修复聚酰胺导电高分子材料的制备与性能

以二聚脂肪酸、二乙烯三胺、尿素等为原料制备室温自修复型聚酰胺。通过溶液水热法制备导电单质钴颗粒,并采用纳米复合工艺将导电单质钴颗粒掺杂入自修复聚酰胺体系中,经高温模压制得一种新型钴基自修复聚酰胺导电高分子材料。采用傅里叶变换红外光谱仪、X射线衍射仪、扫描电子显微镜等仪器对单质钴和自修复聚酰胺进行结构表征。系统研究了自修复聚酰胺的自修复能力及抗溶胀性能,以及自修复导电高分子材料的导电和自修复性能。结果表明,所制备的单质钴平均粒径为3.43μm,且表面粗糙易于与聚酰胺基体复合;自修复聚酰胺基体在室温下的自修复次数可达20余次;当交联剂尿素用量为6.6 g/20 g二聚脂肪酸或交联温度为145℃时,自修复聚酰胺对水、碱溶液和油具有较好的综合抗溶胀性能。当单质钴质量分数达到50%后,自修复导电高分子材料的导电率发生突变,导电能力大幅提升;单质钴的加入降低了材料的自修复能力,但单质钴质量分数为50%的材料在室温下的自修复次数仍可达10余次。由于这种材料同时具有较好的导电性能和自修复性能,有望应用于可穿戴装备、电子器件等领域。     

Growth and properties of Cu3SbS4 thin films prepared by a two-stage process for solar cell applications

Cu₃SbS₄ is a promising material for thin film heterojunction solar cells owing to its suitable optical and electrical properties. In this paper, we report the preparation of Cu₃SbS₄ thin films by annealing the Sb₂S₃/CuS stacks, produced by chemical bath deposition, in a graphite box held at different temperatures. The influence of annealing temperature on the growth and properties of these films is investigated. These films are systematically analyzed by evaluating their structural, microstructural, optical and electrical properties using suitable characterization techniques. X-ray diffraction analysis showed that these films exhibit tetragonal crystal structure with the lattice parameters a=0.537 nm and b=1.087 nm. Their crystallite size increases with increasing annealing temperature of the stacks. Raman spectroscopy analysis of these films exhibited modes at 132, 247, 273, 317, 344, 358 and 635 cm⁻¹ due to Cu₃SbS₄ phase. X-ray photoelectron spectroscopy analysis revealed that the films prepared by annealing the stack at 350 °C exhibit a Cu-poor and Sb-rich composition with +1, +5 and −2 oxidation states of Cu, Sb and S, respectively. Morphological studies showed an improvement in the grain size of the films on increasing the annealing temperature. The direct optical band gap of these films was in the range of 0.82–0.85 eV. Hall measurements showed that the films are p-type in nature and their electrical resistivity, hole mobility and hole concentration are in the ranges of 0.14–1.20 Ω-cm, 0.05–2.11 cm² V⁻¹ s⁻¹ and 9.4×10²⁰–1.4×10¹⁹ cm⁻³, respectively. These structural, morphological, optical and electrical properties suggest that Cu₃SbS₄ could be used as an absorber layer for bottom cell in multi-junction solar cells.     

Influence of Yb Substitution for La on Thermophysical Property of La2AlTaO7 Ceramics

The (La_1−xYb_x)₂AlTaO₇ ceramics were synthesized by pressureless sintering process at 1600 °C for 10 h in air. The crystal phase, microstructure and thermophysical properties were investigated. Results show that pure (La_1−xYb_x)₂AlTaO₇ cermics with single weberite structure are prepared successfully. Owing to the reduction of crystal-lattice tolerance-factor, the thermal conductivity of (La_1−xYb_x)₂AlTaO₇ (x>0) ceramics increases with increasing Yb₂O₃ fraction at identical temperatures, which is lower than that of La₂AlTaO₇. Due to the relatively high electro-negativity of Yb element, the addition of Yb₂O₃ increases the thermal expansion coefficient of (La_1−xYb_x)₂AlTaO₇ ceramics.     

Investigating the effect of SPRM on mechanical strength and thermal conductivity of highly porous alumina ceramics

For recycling waste refractory materials in metallurgical industry, porous alumina ceramics were prepared via pore forming agent method from α-Al₂O₃ powder and slide plate renewable material. Effects of slide plate renewable material (SPRM) on densification, mechanical strength, thermal conductivity, phase composition and microstructure of the porous alumina ceramics were investigated. The results showed that SPRM effectively affected physical and thermal properties of the porous ceramics. With the increase of SPRM, apparent porosity of the ceramic materials firstly increased and then decreased, which brought an opposite change for the bulk density and thermal conductivity values, whereas the bending strength didn’t decrease obviously. The optimum sample A2 with 50 wt% SPRM introducing sintered at 1500 °C obtained the best properties. The water absorption, apparent porosity, bulk density, bending strength and thermal conductivity of the sample were 31.7%, 62.8%, 1.71 g/cm³, 47.1 ± 3.7 MPa and 1.73 W/m K, respectively. XRD analysis indicated that a small quantity of silicon carbide and graphite in SPRM have been oxidized to SiO₂ during the firing process, resulting in rising the porous microstructures. SEM micrographs illustrated that rod-like mullite grains combined with plate-like corundum grains to endow the samples with high bending strength. This study was intended to confirm the preparation of porous alumina ceramics with high porosity, good mechanical properties and low thermal conductivity by using SPRM as pore forming additive.     

Cold sintering process of Li1.5Al0.5Ge1.5(PO4)3 solid electrolyte

The recently developed technique of cold sintering process (CSP) enables densification of ceramics at low temperatures, i.e., <300°C. CSP employs a transient aqueous solvent to enable liquid phase‐assisted densification through mediating the dissolution‐precipitation process under a uniaxial applied pressure. Using CSP in this study, 80% dense Li_1.5Al_0.5Ge_1.5(PO₄)₃ (LAGP) electrolytes were obtained at 120°C in 20 minutes. After a 5 minute belt furnace treatment at 650°C, 50°C above the crystallization onset, Li‐ion conductivity was 5.4 × 10^?5 S/cm at 25°C. Another route to high ionic conductivities ~10^?4 S/cm at 25°C is through a composite LAGP ‐ (PVDF‐HFP) co‐sintered system that was soaked in a liquid electrolyte. After soaking 95, 90, 80, 70, and 60 vol% LAGP in 1 M LiPF₆ EC‐DMC (50:50 vol%) at 25°C, Li‐ion conductivities were 1.0 × 10^?4 S/cm at 25°C with 5 to 10 wt% liquid electrolyte. This paper focuses on the microstructural development and impedance contributions within solid electrolytes processed by (i) Crystallization of bulk glasses, (ii) CSP of ceramics, and (iii) CSP of ceramic‐polymer composites. CSP may offer a new route to enable multilayer battery technology by avoiding the detrimental effects of high temperature heat treatments.     

High thermal conductivity of spark plasma sintered silicon carbide ceramics with yttria and scandia

A fully dense SiC ceramic with a room‐temperature thermal conductivity of 262 W·(m·K)^?1 was obtained via spark plasma sintering β‐SiC powder containing 0.79 vol% Y₂O₃‐Sc₂O₃. High‐resolution transmission electron microscopy revealed two different SiC‐SiC boundaries, that is, amorphous and clean boundaries, in addition to a fully crystallized junction phase. A high thermal conductivity was attributed to a low lattice oxygen content and the presence of clean SiC‐SiC boundaries.     

Sm_2YbTaO_7和La_2AlTaO_7的热物理性能

采用固相反应法制备了Sm_2YbTaO_7和La_2AlTaO_7氧化物,并研究了其热物理性能。Sm_2YbTaO_7和La_2AlTaO_7氧化物在20℃~1200℃范围内的平均热导率分别是0.45 W/(m·K)和1.71 W/(m·K),明显低于现役的氧化钇部分稳定氧化锆陶瓷(YSZ)。与La_2AlTaO_7相比,Sm_2YbTaO_7较低的热导率可以归因于其取代原子与基质原子之间较高的原子质量差别,Sm_2YbTaO_7较高的热膨胀系数则可归因于其A位与B位离子之间较低的电负性差别。Sm_2YbTaO_7和La_2AlTaO_7的热导率和热膨胀系数均满足热障涂层的要求,具有做为新型热障涂层表面陶瓷层材料使用的潜力。     

稀土元素对纤维复合Cu-6%Fe合金组织和性能的影响

采用冷拉拔结合中间热处理方法制备了纤维复合强化Cu-6%Fe、Cu-6Fe%.0.05%RE和Cu-6%Fe-0.3%RE(质量分数)合金,观察并测定了不同变形程度下合金显微组织、力学性能和电学性能,研究了稀土微合金化在双相纤维强化Cu-Fe合金中的作用.添加0.05%～0.3%的稀土元素可以明显细化Cu-6%Fe合金初晶组织但对纤维复合形态不产生明显影响.随变形程度增大,合金强度上升而电导率下降.在较高变形程度条件下,稀土元素能够使Cu-6%Fe合金应变硬化效应减弱和电导率下降趋势变缓,导致在一定拉拔变形程度后含稀土合金的抗拉强度低于而电导率高于不含稀土合金.     

表面内氧化Al2O3/Cu-(Ce+Y)弥散铜薄板带的组织和性能

采用内氧化工艺,在950℃以工业N2中的余氧为内氧化介质对试样进行表面内氧化,成功制备了Al2O3/Cu复合材料,并对其组织和性能进行了分析.结果表明:Cu-Al-RE合金经950℃×2 h内氧化后,表面内氧化层厚度随着混合稀土含量的增加而增加,当超过0.1%(Ce+Y)时,表面内氧化层厚度略有降低;内氧化法制备的Al2O3/Cu-(Ce+Y)复合材料中弥散分布着大量纳米级的Al2O3颗粒;添加适量的混合稀土能改善Cu-Al合金的导电性,提高合金的硬度.     

固溶处理工艺对7449铝合金组织和性能的影响

通过硬度、电导率、拉伸试验及金相分析,研究了在460、475、490℃分别保温30、60、120 min的固溶工艺对7449铝合金组织和性能的影响。结果表明,475℃×1 h是该合金最优的固溶工艺,此时合金的综合性能最佳;且固溶处理＋自然时效态合金的抗拉强度、屈服强度和伸长率分别为561．32 MPa、362．19 MPa、22．92％;合金的固溶处理过烧温度为490℃;在固溶处理中,固溶温度比保温时间对该合金性能的影响更大。