NdFeB水磁体表面离子镀Cu-Al-In三元仿金

分析了真空离子镀的基本原理，研究了NbFeB永磁合金表面离子镀Cu－Al-In三元仿金合金的新工艺。合金镀层晶粒较小，均匀美观，光泽柔和；合理的工艺条件为：偏压200V，主弧电流5A±0．25A，间距120mm，加热功率11kW，氩气分压1．33Pa～0．0133Pa，时间30min。     

化学镀Ni－Cu－P合金的工艺及镀层性能研究

探讨了化学镀Ｎｉ－Ｃｕ一Ｐ合金的镀液组成及工艺条件，并采用Ｘ射线衍射和弯曲法，研究了Ｎｉ－Ｃｕ－Ｐ镀层的组织结构和镀层结合力，结果表明，所研究的镀液组成，在适当工艺条件下，能够实现Ｎｉ、Ｃｕ离子的共沉积，并得到良好质量的合金镀层。经４００℃热处理，镀层中有和相析出，同时硬度达到最大值。镀态下，该镀层具有良好的结合力，且随镀层中铜含量的增加和热处理温度的提高，镀层结合力能得到进一步改善。     

新型合金代铬刷镀层的组织及强化机理的研究

采用Ｘ射线衍射仪，透射电镜和扫描隧道显微镜等手段对新型代铬镀层（Ｎｉ－Ｆｅ－Ｗ－Ｐ－Ｓ）相结构及组织进行了研究，并初步探讨了镀层的强化机理。研究表明，Ｎｉ－Ｆｅ－Ｗ－Ｐ－Ｓ合金镀层的组织是由含Ｆｅ、Ｗ、Ｐ、Ｓ的镍基固溶体和在其上弥散分布的金属间化合物Ｎｉ_３Ｆｅ所组成，镍基固溶体处于非晶和微晶的混合状态，合金镀层的镀态硬度为ＨＶ７００～７５０，在３００℃退火时。硬度达到最大值ＨＶ９００～９５０，其强化机理主要是微晶的晶界强化和Ｎｉ_３Ｆｅ的弥散强化。     

高铅硫化铜精矿的二段焙烧

高铅硫化铜精矿进行湿法铜铅分离时，焙烧过程因有低熔点组份产生，使培砂中铜浸出率仅为73％～82％，达不到工艺要求。经二段焙烧后消除了上述影响，铜浸出率达到97．4％，实现了铜铅分离。     

A review of the linear term in the low-temperature specific heat of La2CuO4 and La2?xMxCuO4 (M = Ba, Ca, Sr)

In this report I will summarize the results of an extensive review of the low-temperature specific heat of the La-based high-temperature superconductors, withT _c between 30 and 40 K, and the related nonsuperconducting compound La₂CuO₄. There have been two previous studies by Fisheret al. [1] and Fischeret al. [2] which also reviewed the low-temperature specific heat of these materials. This work was undertaken to extend a similar study of the 90 K superconductor YBa₂Cu₃O_7– which we recently completed [3]. This review will focus exclusively on the low-temperature specific heat and will update the previous studies by including recent results.     

Advantages of high-field tokamaks for fusion reactor development

High-field designs could reduce the cost and complexity of tokamak reactors. Moreover, the certainty of achieving required plasma performance could be increased. Strong Ohmic heating could eliminate or significantly decrease auxiliary heating power requirements and high values of n_E could be obtained in modest-size plasmas. Other potential advantages are reactor operation at modest values of , capability of higher power density and wall loading, and possibility of operation with advanced fuel mixtures. Present experimental results and basic scaling relations imply that the parameterB ²a, where B is the magnetic field and a is the minor radius, may be of special importance. A superhigh-field compact ignition experiment with very high values ofB ²a (e.g.,B ²a=150 T² m) has the potential of Ohmically heating to ignition. This short-pulse device would use inertially cooled copper plate magnets. Compact engineering test reactor and/or experimental hybrid reactor designs would use steady-state, water-cooled copper magnets and provide long-pulse operation. Design concepts are also described for demonstration/commercial reactors. These devices could use high-field superconducting magnets with 7–10 T at the plasma axis.     

Synthesis and microwave characterization of Co-SiC core-shell powders by electroless plating

Co-SiC core-shell powders were prepared by electroless plating. Scanning electron microscopy （SEM） revealed that Co-SiC core-shell powders were of nearly sphere-like shape and were about 0.3 pan. X-ray powder diffraction （XRD） patterns showed that the cobalt powder was hexagonal crystallite. The complex dielectric constant and the complex permeability of Co-SiC core-shell powders-paraffin wax composite were measured by the rectangle wavegnide method. It showed that the dielectric loss was less than 0.1 and the magnetic loss was about 0.2 in 8.2-12.4 GHz for prepared Co-SiC core-shell comoosite oowders.     

温度对Ni—P化学镀层结合力影响的研究

用弯曲法、划痕法研究了镀后加热温度对Ni-P化学镀层结合力的影响,结果表明:镀后退火温度越高,镀层结合力越好,但温度过高时,镀层硬度将下降。用金相观察及电子探针分析,探讨了镀后退火温度影响结合力的机理。结果指出:退火时将在镀层和基体界面上发生Ni与Fe的互扩散,形成Ni-Fe合金扩散层,从而提高了结合力。为了能在保证镀层硬度的前提下提高结合力,本文提出了二次镀覆的设想,获得较好试验结果。     

Inhibition behavior for copper corrosion by photoelectrochemical methods

wavelengthofmono chromatelightwas 4 2 0nm .3　RESULTSANDDISCUSSION3.1　ApplicationofphotoelectrochemicalmethodtoevaluatetheeffectsofinhibitorsforcoppercorrosionThestructuresoftheinhibitorsforcoppercorro sionshownintextareasfollows:Theinhibitioneffectsofdifferentinhibitorsforcoppercorrosioncanbeevaluatedby photoelec trochemicalmethod .AsshowninRef .[12 ],onanegativepotentialscan ,thepotentialcorrespondingtothecathodicphotocurrentJph=0isdefinedasΦV,atwhichCu2 Oontheelectrodesurfaceisc…     

Novel technology of purification of copper electrolyte

The effects of arsenic with different valence states on the purification of copper electrolyte were studied and a novel technology of purification of copper electrolyte by copper arsenite was proposed. The results show that the purification performance of As（Ⅲ） compounds is better than that of As（Ⅴ） compounds. The purification technology by copper arsenite has the advantages of simple operation, high purification performance and low cost in comparison with other technologies and its appropriate purification conditions are that copper arsenite concentration is 18 g/L, reaction temperature is 65 ℃ and reaction time is 8 h. The removal rates of Sb and Bi are 53.22% and 58.67% respectively under these conditions. The purification principle show that a kind of yellow precipitate mainly composed of arsenic, antimony （ Ⅴ ）, bismuth and oxygen forms in electrolyte after copper arsenite is added, and consequently antimony and bismuth are removed from electrolyte.