脉冲电镀最佳参数之探索和优化

本文利用正交实验法对脉冲电镀各控制参数进行试验,对影响分散能力、镀层可靠性及外观质量的各种因素进行探讨,寻找影响外观质量的显著因子并加以控制,同时进一步优化脉冲电镀的工艺参数。     

Deep‐UV Photochemistry and Patterning of (Aminoethylaminomethyl)phenethylsiloxane Self‐Assembled Monolayers

The 193 nm photochemistry of (aminoethylaminomethyl)phenethylsiloxane (PEDA) self‐assembled monolayers (SAMs) under ambient conditions is described. The primary photodegradation pathways at low exposure doses (< 100 mJ cm^–2) are benzylic C–N bond cleavage (ca. 68 %), with oxidation of the benzyl C to the aldehyde, and Si–C bond cleavage (ca. 32 %). Amine‐containing photoproducts released from the SAM during exposure remain physisorbed on the surface, where they undergo secondary photolysis leading to their complete degradation and removal after ca. 1200 mJ cm^–2. NaCl(aq) post‐exposure rinsing removes the physisorbed materials, showing that degradation of the original PEDA species (leaving Si–OH) is substantially complete after ca. 450 mJ cm^–2. Consequently, patterned, rinsed PEDA SAMs function as efficient templates for fabrication of high‐resolution, negative‐tone, electroless metal and DNA features with good selectivity at low dose (i.e., ca. 400 mJ cm^–2) via materials grafting to the intact amines remaining in the unirradiated PEDA SAM regions.     

对ADSL接入方式铜缆可用线对率的分析

指出了为发展ADSL而提高市话音频铜线电缆的传输质量和维护水平的必要性,分析了铜线电缆线对有关指标参数低劣的原因和对传输ADSL的影响,并提出了一些改进的意见。     

空调器用风冷冷凝器换热能力实验研究

实验测定了几种不同铜管、肋片组合的冷凝器在不同的风量和风机转速下的换热量，发现采用内螺纹铜管和迎风侧平片、背风侧冲缝片的冷凝器具有最优的换热性能。分析了多流路冷凝器中不同流路之间的制冷剂分配不均匀性和再热现象。     

铜在高纯净钢中析出过程的观察

利用透射电子显微镜观察了铜在高纯净钢中的析出过程，发现早期析出阶段有类B2结构的亚稳相出现，分析了铜在高纯净钢中的析出贯序，研究结果对分析铜在高纯净钢中的时效强化机理具有重要意义。     

图形电镀铜的常见缺陷及故障排除

本文主要阐述印制电路板生产中图形电镀铜常见缺陷及成因,查找影响其品质的因素和工序并结合相关生产制定相应的预防措施,有效提高产品质量。     

Copper phthalocyanine as corrosion inhibitor for ASTM A606-4 steel in 16% hydrochloric acid

A study based on the corrosion inhibition properties of copper phthalocyanine is described. Coverage degrees of copper phthalocyanine (Cu-phcy) on ASTM-A606-4 steel, obtained by weight loss measurements, were fitted to Langmuir, Frumkin, Temkin and Flory–Huggins adsorption isotherms. A better fit to the Langmuir isotherm was obtained. The polarization curves showed that polarization of both the anodic and cathodic reactions were verified for concentrations higher than 10^–4 M, indicating a mixed type action. Only the anodic reactions were polarized for lower concentrations. At high frequencies the Nyquist diagrams showed one capacitive loop attributable to double layer charging and a small one at intermediary frequencies attributable to the faradaic process of hydrogen evolution. The formation of an adsorbed film was characterized by increasing charge transfer resistance values in the low frequency range for increasing inhibitor concentrations. According to the techniques used in this study, copper phthalocyanines showed a high corrosion inhibiting efficiency for all concentrations.     

孔径法测量铜带残余应力的试验研究

介绍了用于薄板残余应力测量的新方法——孔径法,该方法是通过测量冲孔直径的变化来间接求出各方向的残余应力;文中详细阐述了残余应力的标定方法;由于可针对不同材料建立了被测材料的平均应力(σ_l)与被测板材宽度(B)、厚度(H)以及冲孔后直径变化率(△D_i/D)之间的数学模型,因而使薄板残余应力测量变得简便而经济;此外还对该方法的分辨率与测量精度进行了实验、计算与分析。     

对乙酰基偶氮胂与铜的显色反应研究及应用

研究了对乙酸基偶氮肿与铜的显色反应。结果表明，在弱酸性介质中，铜与对乙酰基偶氮胂形成稳定的蓝色配合物，其最大吸收峰位于６２０ｎｍ，表观摩尔吸光系数达４．８６×１０４Ｌ·ｍｏｌ－１·ｃｍ－１。配合物的组成比为Ｃｕ：对乙酰基偶氮胂＝１：２，表现稳定常数为１．８９×１０１０，铜的含量在０～４０μｇ／２５ｍＬ范围内符合比尔定律。显色反应具有较好的选择性，应用于铝合金中铜的测定，结果满意。     

化学镀SiCp／Ni－P复合镀层与基体结合强度及其影响因素

论述了ＳｉＣｐ／Ｎｉ－Ｐ复合镀层与钢基体的结合强度及其影响因素。复合镀层中离界面５μｍ厚度以内区域的组成及应力状态对镀层／基体的界面结合有决定性作用，在该区域以外ＳｉＣ粒径变化不影响镀层的结合强度。适当的热处理可提高界面结合力。