江西铜工业存在的问题及对策探讨

简要介绍了我国铜工业概况，重点分析了江西铜工业存在的问题，并提出发展对策，如优化铜产品结构、利用国内外两种资源和大力发展湿法炼铜等。江西要发挥潜在优势，建立我国铜加工材生产基地，利用外力，提高铜加工材的竞争力，由进口替代逐步走向增加出口。     

WC含量对弥散强化铜Cu/WC组织与性能影响的研究

对以WC粒子为第二相的弥散强化铜材料的组织与性能进行了研究。在同样条件下，用机械混料方法制备了不同WC含量的Cu/WC复合材料，分别测定了其密度，电阻率和硬度，结果表明：WC粒子是一种较为理想的弥散相，并且WC体积含量为1.2%时，细小的球形状第二相粒子均匀分布，弥散效果好，材料密度，硬度较高，而电阻率较小，综合性能较好。     

Fire performance of wood (Pinus radiata) treated with fire retardants and a wood preservative

In this work, we co‐formulated an oil‐borne copper naphthenate/permethrin wood preservative system with synthetic polymer‐based fire‐retardant additives prior to the impregnation of Pinus radiata sapwood. We evaluated what effect, if any, the preservative had upon the fire performance properties of the fire retardants and whether the fire retardants impacted on the fungicidal and termiticidal efficacy of the preservative. The fire retardants included halogenated and phosphorus‐based systems. A mass loss calorimeter, in conjunction with a thermopile, was used to measure the time to ignition and the peak heat release rate (PHRR) from which the fire performance index (FPI) was determined. The preservative properties were evaluated using termite and soil‐block decay bioassays. In summary, we found that the rate of fire growth was reduced when the fire retardants were used in combination with the wood preservative. We also found that the PHRR was a better determinant of fire performance than the FPI. The performance of the wood preservative was enhanced against fungal decay and termite attack when used in combination with the fire retardants. The fire retardants also demonstrated some wood preservative properties of their own. Copyright © 2008 John Wiley & Sons, Ltd.     

脉冲电镀的正向电流密度对深镀能力的影响

主要通过在正反向电流比、频率、脉冲宽度一定的条件下,改变正向电流密度的大小来研究其对PCB整板电镀铜深镀能力的影响。从测得的数据可知随着正向电流密度的增大,深镀能力先变大后变小,并对这个问题进行了理论分析。     

高厚径比盲孔电镀

盲孔能够大大的增加板的密度,从而减小板面积。介绍了有关高厚径比盲孔电镀的有关工艺,从激光钻孔、金属化孔和电镀几个方面对孔径4mil以上的盲孔电镀进行了研究。     

化学镀Ni—P镀层的X射线衍射研究

根据X射线衍射分析结果,对化学镀高P(含P>11wt％或19at％)Ni-P镀层加热时效时,镀层成分和加热温度对结构转变的影响作了研究,结果表明,高P共晶、过共晶(含P>11wt％或19at％)合金的结构转变有如下特征:(1)相同加热时效条件下,Ni-P合金的结构转变与成分有密切关系:(2)对同一成分的过共晶合金,Ni-P合金的结构转变与时效温度密切相关;(3)过共晶合金在290～360℃温度范围内时效处理,出现Ni_xP_y介稳相,X射线衍射分析认为Ni_xP_y为Ni_(12)P_5。     

Evaluation of rapeseed meals in broiler chicks: Effect of iodine supply and glucosinolate degradation by myrosinase or copper

In rapeseed meals (RSM) of a conventional (c) or a newly bred (n) variety 117 or 44 mmol glucosinolates and glucosinolate degradation products per kg dry matter were detected. Soaking meals in aqueous myrosinase or copper sulphate solution and subsequent drying reduced the content of antinutrients by more than 90%. Broiler chickens were fed (i) a glucosinolate-free diet, or this diet in which half the soybean meal was replaced by RSM of various origins and treatment; (ii) untreated cRSM; (iii) cRSM treated with myrosinase: (iv) cRSM treated with Cu (v) untreated nRSM; or (vi) nRSM treated with myrosinase. These diets were administered with or without supplementary iodine. Chickens receiving the iodine-deficient diets with myrosinase-treated RSM showed growth depression, incomplete feathering, leg injuries and severe goitre. In the serum T⁴ could not be detected. Giving myrosinase-treated RSM plus iodine, or giving other RSM diets irrespective of iodine administration, no growth depression was observed. RSM diets without iodine dosage markedly increased thyroid weight: there were no differences between the RSM variants. In contrast to the treatment with myrosinase, in the sera of the chickens fed on untreated RSM or RSM treated with copper T⁴ could be detected, suggesting that in iodine-deficient conditions differences in serum T⁴ concentration between RSM groups indicate a differing anti-thyroid activity. With iodine supplementation the RSM had a significant effect on thyroid weight. The largest thyroids (five-fold heavier) were in the animals with myrosinase-treated cRSM. The untreated cRSM and the nRSM trebled or doubled the thyroid weight, and the myrosinase-treated nRSM trebled it. The thyroid weight of chicks fed cRSM treated with copper did not differ significantly from the glucosinolate-free control. There was evidence that heating the myrosinase-treated RMS produced anti-thyroid compounds; these should be identified in further investigations.     

Effect of chloride ions on immersion plating of copper onto porous silicon from a methanol solution

The effect of chloride ions (Cl⁻) during the immersion plating of copper onto porous silicon (PS) from a methanol (MeOH) solution has been studied. The presence of Cl⁻ in the Cu²⁺ solution was found to slow down the rate of copper deposition, as confirmed by inductively coupled argon plasma emission spectroscopy and X-ray photoelectron spectroscopy measurements. The threshold concentration of Cl⁻ at which the deposition of copper is very severely diminished was found to be 0.1 M. The inhibition effect is discussed on the basis of the rest potential values of PS and polarization curve measurements. They revealed that the rest potential of PS upon dipping in these solutions appears to direct the metal deposition. Current density-potential curves show that at Cl⁻ concentrations higher than 0.1 M, the reduction of Cu ions proceeds in two steps; the reduction of Cu(II) to Cu(I) followed by the reduction of Cu(I) to Cu(0). This suggests that Cu(I) species in MeOH solution can be stable over a certain potential range and this stability of Cu(I) is responsible for the inhibition of metal deposition. Fourier transform infrared spectroscopy and scanning electron microscopy (SEM) were also performed to investigate the structural changes and characterizations of PS samples after the plating process.     

微光机电系统的微绞链研制

本文讨论了非硅微机械工艺和微绞链的研制工艺。我们研制的非硅表面微机械工艺采用两次或三次掩模电镀层，聚酰亚胺和光刻胶分别作为底层和第二、第三层的牺牲层。用这套工艺，研制成功了三种不同种类的微绞链。微绞链能在基片表面作０—１８０度自由转动。     

Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymers

Argon plasma-pretreated polyimide (PI, Kapton^® HN) films were subjected to UV-induced surface graft copolymerization with N,N′-(dimethylamino)ethyl methacrylate (DMAEMA) and 2-(trimethylammonium)ethyl methacrylate chloride (TMMAC). The DMAEMA graft-copolymerized PI (DMAEMA-g-PI) surfaces were also quaternized and amino-functionalized with 3-bromopropylamine hydrobromide (the Q-DMAEMA-g-PI surfaces). The surface composition and the degree of quaternization of the graft-modified PI films were determined by X-ray photoelectron spectroscopy. The DMAEMA-g-PI, Q-DMAEMA-g-PI and TMMAC graft-copolymerized PI (TMMAC-g-PI) surfaces can be activated directly by PdCl₂, in the absence of prior sensitization by SnCl₂ (the ‘Sn-free’ activation process), for the subsequent electroless plating of copper. A shorter induction time for the electroless deposition of copper was found for the palladium-activated Q-DMAEMA-g-PI and TMMAC-g-PI surfaces than for the palladium-activated DMAEMA-g-PI surface. The T-peel adhesion strength of the electrolessly deposited copper with the Q-DMAEMA-g-PI surface was enhanced to above 6 N/cm, in comparison to only about 4 N/cm for the DMAEMA-g-PI surface, about 2.5 N/cm for the TMMAC-g-PI surface, or about 0.5 N/cm for the PI surface with argon plasma treatment alone.