一种三电平高压变频器IGBT驱动电路的实现

三电平高压变频器对IGBT驱动电路有特殊的要求,比如:高低压侧的隔离问题、绝缘等级、动态驱动能力以及快速保护功能都有严格的要求。采用美国Unitrode公司生产的UC3726/3727驱动IGBT芯片对,两芯片可组合使用,从而可以达到理想的驱动效果。测试结果表明了该方法的可行性。     

带压焊接堵漏的技术措施

针对电厂运行中经常出现设备需要带压堵漏的情况,介绍了带压焊接堵漏的工艺措施。根据安全生产的实际需要和工作实践,给出带压焊接堵漏的注意点。该技术使设备尽快恢复正常工作,节省了资金和时间。     

弹簧储能液压机构永磁液压阀设计及特性分析

针对弹簧储能液压机构中电磁液压阀存在的问题,设计了一种新型液压阀-永磁液压阀。给出永磁液压阀的结构并阐明其工作原理,对用于液压阀上的永磁机构进行设计及对永磁液压阀进行特性分析。最后通过以上分析,设计出满足工程需要的永磁液压阀。     

Development and test in grid of 630 kVA three-phase high temperature superconducting transformer

Abstract A 630-kVA 10.5 kV/0.4 kV three-phase high temperature superconducting (HTS) power transformer was successfully developed and tested in a live grid. The windings were wound by hermetic stainless steel-reinforced multi-filamentary Bi2223/Ag tapes. The structures of primary windings are solenoid with insulation and cooling path among layers, and those of secondary windings consist of double-pancakes connected in parallel. Toroidal cryostat is made from electrical insulating glass fiber reinforced plastics (GFRP) materials with room temperature bore for commercial amorphous alloy core with five limbs. Windings are laid in the toroidal cryostat so that the amorphous core operates at room temperature. An insulation technology of double-half wrapping up the Bi2223/Ag tape with Kapton film is used by a winding machine developed by the authors. Fundamental characteristics of the transformer are obtained by standard short-circuit and no-load tests, and it is shown that the transformer meets operating requirements in a live grid. __________ Translated from Proceedings of the CSEE, 2007, 27(27): 24–31 [译自:中国电机工程学报]     

泵浦用大功率半导体激光器研制与应用发展状况

详尽地介绍了当前可以使用半导体泵浦的固体激光器泵浦要求，相应的半导体泵浦源的发展状况，存在的问题，最后介绍了列阵和耦合两种提高半导体泵浦源功率，改善其光束质量的方法。     

Thermodynamic modeling of the Au-In-Sb ternary system

The phase diagram of the Au-In-Sb ternary system is of importance in predicting the interface reaction between In-based solders and the Au substrate. Using the calculated phase diagram method and based on experimental data of thermodynamic properties and phase boundaries, the Au-Sb binary system was assessed, and the In-Sb binary system was revised. On the basis of the constituent binary systems, Au-Sb, In-Sb, and Au-In, the Au-In-Sb ternary system was modeled. Several isothermal and vertical sections were calculated, among which the one at 500 K reproduces the experimental diagram well.     

90nm工艺及其相关技术

ITRS2001规划2004年实现90nm工艺,英特尔、AMD等世界顶级半导体公司将于2003年采用90nm工艺量产微处理器和逻辑器件。这样使ITRS2001整整提前了一年。90nm工艺包括193nm光刻技术、高k绝缘材料、高速多层铜互连技术、低k绝缘材料、应变硅技术和电压隔离技术等新技术。193nm光刻技术是实现90nm工艺达量产的最关键技术,为此,必须采用193nmArFstepper(准分子激光扫描分步投影光刻机)。讨论了90nm工艺达量产的难点,如掩模版成本较高、成品率较低和应用面暂时不宽等。     

高速补充信道对cdma2000-1x前向链路功率分配的影响

分析了cdma2000-1x系统的前向信道发射功率分配。通过仿真试验及理论推导，给出了导频信道和业务信道信号质量之间的相互依赖关系并绘出导频信号和业务信道之间的相关性曲线：根据这种相关性曲线，从而发现使总发射功率最小的最佳导频功率；最后提出并分析了高速补充信道对cdma2000-1x前向链路功率分配的影响。     

数字控制通讯电源高压防护研究

介绍了一种数字控制通讯电源高压防护电路及其控制方法。数字信号控制器通过检测交流输入电压和PFC输出电压状况做出智能判断,控制高压防护电路中主继电器和辅助继电器的断开和吸合状态,从而对实现通讯电源快速有效的高压防护,提高了通信电源的可靠性。     

IDT70261在DSP高速实时通信中的应用

介绍了IDT70261的结构特点和基本功能，详细阐述了IDT70261的忙仲裁逻辑、双边中断逻辑和标识器逻辑，给出了一种基于IDT70261的TMS320LF240X和TMS320C54X之间高速实时通信接口设计以及软件实现方案。