Assessment of vitrified CBN wheels for precision grinding

Methods of measuring topographical features of grinding wheels are reviewed. Each technique has advantages and limitations for resolution, measuring depth, ease of application, data analysis and interpretation. Results obtained vary according to the method and instrument employed. Advantages and difficulties experienced with different techniques are discussed. Different replication techniques and materials are compared and suggestions made. A set of parameters that describe the wheel and grain characteristics is defined. Experimental studies with grinding wheels having different structures are carried out in terms of observations and measurements of changes in wheel topography. Experimental results are analysed and discussed in relation to theoretical understanding of abrasive wear and loading.     

Laser Dressing of Metal Bonded Diamond Wheel

In this study, a laser beam is used as a non-contact thermal dressing tool for a bronze bonded diamond wheel. The pulsed-Nd:YAG laser beam is irradiated on the wheel surface and the bond material partially removed by laser irradiation only. In order to efficiently remove the bond material, it is necessary to direct an air jet on the spot irradiated by the laser so as to blow away the molten binder before it solidifies again. Less damage of diamond particles such as micro-cracks or graphitization occurs. In grinding with a laser-dressed wheel, the grinding forces are almost the same as those for a conventionally dressed wheel. Consequently, effective laser dressing can be expected with the associated dressing conditions.     

基于Rough集的磨削参数决策系统

本文介绍了5层模糊神经网络的优缺点，提出了基于Rough集构造模糊神经网络的方法，并应用于多传感器的磨削参数决策系统，达到控制磨削加工质量的目的。     

Stress due to a moving band source of heat and mechanical load on the work surface during grinding

The grinding operation is considered to be equivalent to a moving band source of heat and mechanical load on the surface of a semi-infinite solid, producing very high temperature on the surface of the workpiece. The resulting temperature may result in high stress in the workpiece. It is thus desirable to be able to predict the stress levels expected during the grinding process.     

Process Requirements for Cost-Effective Precision Grinding

Costs in precision cylindrical grinding are compared for different abrasives, machines and grinding conditions. The analysis is for repeated batch production. Account is taken of machine cost and abrasive cost. Cost comparisons were based on extensive trials to assess re-dress life against workpiece quality requirements. Experiments show that different workpiece materials require different strategies to reduce costs. Easy-to-grind AISI 52100 and difficult-to-grind Inconel 718 materials were ground at conventional speeds and at high speeds. It is shown that wheel speed affects production rate through acceptable values of re-dress life, removal rate and dwell time. Advantages were gained using vitrified CBN at conventional speed and at high speed. For both materials, vitrified CBN wheels used at high speed, gave better quality at lower cost than conventional abrasives. Wheel costs became negligible and labour costs greatly reduced. Re-dress life trials, usually neglected, are shown to be essential to reduce costs and maintain quality [1].     

An experimental investigation into soft-pad grinding of wire-sawn silicon wafers

Silicon is the primary semiconductor material used to fabricate microchips. A series of processes are required to manufacture high-quality silicon wafers. Surface grinding is one of the processes used to flatten wire-sawn wafers. A major issue in grinding of wire-sawn wafers is reduction and elimination of wire-sawing induced waviness. Results of finite element analysis have shown that soft-pad grinding is very effective in reducing the waviness. This paper presents an experimental investigation into soft-pad grinding of wire-sawn silicon wafers. Wire-sawn wafers from a same silicon ingot were used for the study to ensure that these wafers have similar waviness. These wafers were ground using two different soft pads. As a comparison, some wafers were also ground on a rigid chuck. Effectiveness of soft-pad grinding in removing waviness has been clearly demonstrated.     

Grinding-hardening with liquid nitrogen: Mechanisms and technology

This paper studies an innovative development of a steel grinding–hardening technology using an inert cryogen—liquid nitrogen. It was found that phase transformations took place during grinding with the application of liquid nitrogen and resulted in hardened surface layer in a ground component. The layer had a fine laths martensite structure which gave rise to a remarkably high hardness. It was also shown that the treatment can produce superior surface integrity, with compressive surface residual stresses and without surface oxidation. Due to the inert nature of the liquid nitrogen, the grinding process becomes environmentally conscious.     

Advances in Modeling and Simulation of Grinding Processes

In the last decade the relevance of modeling and simulation of grinding processes has significantly risen which is caused by industrial needs and is indicated by the number of publications and research activities in this area. This keynote paper results from a collaborative work within the STC G and gives an overview of the current state of the art in modeling and simulation of grinding processes: Physical process models (analytical and numerical models) and empirical process models (regression analysis, artificial neural net models) as well as heuristic process models (rule based models) are taken into account, and outlined with respect to their achievements in this paper. The models are characterized by the process parameters such as grinding force, grinding temperature, etc. as well as work results including surface topography and surface integrity. Furthermore, the capabilities and the limitations of the presented model types and simulation approaches will be exemplified.     

The influence of grinding technique on the liberation of clinker minerals and cement properties

This paper describes a study of the relationship between the physical, chemical and mineralogical parameters of cement products obtained by different grinding mechanisms namely high pressure grinding rolls (HPGR) and ball milling, and their effects upon the properties of cements prepared from the ground clinker. Samples were prepared as narrow size fractions and also as distribution samples. Characterization parameters were ascertained by using XRF, laser sizing, Blaine and BET surface area and image analysis methods. HPGR grinding resulted in higher degrees of liberation of clinker phases arising from the intergranular breakage along the grain boundaries compared to ball mill grinding. As for service properties, water demand of HPGR products was higher than ball mill products resulting from high micro fissured structure. Despite high liberation of particularly alite mineral in HPGR grinding, the compressive strength of ball mill products was slightly higher than HPGR products for narrow size samples. Finally, particle size distribution effect on strength was more obvious for distribution samples; generally ball milling gave higher strength values.     

基于区域权函数理论的多电极电磁流量计电极设计

基于Shercliff权函数提出区域权函数概念,设计多电极电磁流量计,通过测量管道截面不同位置的弦端电压,计算各区域的轴向平均速度,实现速度分布与体积流量的测量。着重研究了流量计电极设计,选取不锈钢平头方案的多电极电磁流量计,对于阀门下游的非轴对称单相流体积流量测量精度高于±1.0%,倾斜管固—液两相流实验证明:该设计对于两相流非轴对称的速度分布测量具备可靠性。