HA型粘结剂性能评判的研究

冷固结球团直接还原工艺成功的关键因素之一是成型粘结剂的选用。粘结剂性能评判 ,传统的方法是通过考查球团矿的机械强度来说明粘结剂性能的优劣 ,步骤繁锁。经过试验研究 ,本文提出了用粘度大小来评判粘结剂性能的直接方法并从理论上进行了论证。对于 HA型复合粘结剂 ,在六速旋转粘度计上测量 ,50 g复合粘结剂的粘度若大于或等于 6.5× 1 0 -3 Pa·s,表示粘结剂性能较好 ,能满足铁精矿冷固球团直接还原工艺的要求 ;若小于或等于 3.0× 1 0 -3 Pa· s,则表示该粘结剂性能较差。     

分离式热管换热器在脱硫装置的应用

介绍了分离式热管换热器的工作原理及其在工业脱硫装置中的应用，并不其余热回收情况与传统的二次中热方法相比较，阐明了其节能及环保作用。     

环境影响及计算机设备可靠性

和所有设备一样，计算机设备也是在一定环境中工作的，各种环境因素无时不对设备产生影响。要使计算机设备在各种环境中保持良好的性能，必须了解各种环境对计算机设备影响的机理和过程，分析在环境因素中那些因素是影响计算机设备的主要因素及其力度、频率、周期等，以便采取措施保护计算机设备正常工作。简要介绍除温度外，各种环境因素对计算机设备的影响。     

结合试飞特点,开展专用测试设备计量确认

根据我院专用测试设备计量确认现状及需求，对开展试飞专用测试设备计量确认工作的要求，步骤、确认原则，以及编定计量确认方法进行了必要的讨论分析。     

引进综采设备常用渐开线花键的标准及计算

根据煤矿引进的综采设备中采用不同标准渐开线花键的特点 ,提出了综采设备常用渐开线花键的测量与计算     

一种新颖的导弹起竖机构

一种新颖的导弹起竖机构，起竖油缸的上支点可以移动，能缩短起竖油缸的长度，改善起竖机构的受力，为快速起竖大型导弹探索了一条新途径。     

硼酸铝晶须增强环氧树脂和双马来酰亚胺树脂体系的研究

本文以硼酸铝晶须为增强剂，以4，5-环氧环己烷-1，2-二甲酸二缩水甘油酯(TDE-85)，甲基纳狄克酸酐(MNA)、N，N’-二胺基二苯甲烷型双马来酰亚胺(BMI)/O，O′-二烯丙基双酚A(BA)体系分别作为基体制备晶须增强复合材料。研究了晶须对树脂的尺寸、表面处理方法、含量对树脂体系力学性能和热性能的影响；通过扫描电子显微镜(SEM)分析了浇注体的弯曲、冲击断口，研究晶须的增强机理。     

一次盐水设备运行总结

介绍了内蒙古海吉氯碱化工股份有限公司6万t/a离子膜烧碱装置一次盐水设备的运行情况和运行过程中存在的问题及相应的技改措施.     

Effect of Bonder at Skin/Core Interface on the Mechanical Performances of Sandwich Structures Used in Marine Industry

The present work is aimed to extend the knowledge of mechanical properties of sandwich structures used for marine applications focusing on the possibility to increase the performances of such structures by adding a bonder at the skin/core interface. Therefore, three sandwich structures that are utilised in different structural components of a yacht were realised by manual lay-up. The mechanical characterisation was performed by flatwise compressive, edgewise compressive and three point flexural tests. The tests execution has allowed both to determine the mechanical performances and to understand the fracture mechanisms that take place when the bonder is added in the stacking sequence of the samples.     

Recent advances in isotropic conductive adhesives for electronics packaging applications

Isotropic conductive adhesives (ICAs) have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-bearing solders. Numerous studies have shown that ICAs possess many advantages over conventional soldering such as environmental friendliness, finer pitch printing, lower temperature processing and more flexible and simpler processing. However, complete replacement of soldering by ICAs is yet not possible owing to several limitations of ICAs which are mainly related to reliability aspects like limited impact resistance, unstable contact resistance, low adhesion and conductivity etc. Continued efforts for last 15 years have resulted in development of ICAs with improved properties. This review article is aimed at providing a better understanding of ICAs, their principles, performance and significant research and development work addressing the technological utility of ICAs.