钢铁件无熔盐覆盖光亮热浸镀铝-一种无污染镀铝新工艺

提出了一种无污染光亮镀铝工艺。在熔融的热浸镀铝液中添加少量（小于0．1％）抗氧化合金以代替熔盐覆盖。观察了镀铝件的外观、微观结构，并测试了其各项性能，该工艺所得镀铝件光亮洁白，具有优良的耐磨、耐蚀及抗高温氧化性能。     

酸性低温脉冲化学镀镍磷合金的性能

介绍了低温脉冲化学镀镍的研究工作。结果表明：由于电脉冲的催化作用，使得酸性化学镀镍的施镀温度降低至５０℃时，仍具有１１μｍ／ｈ的沉积速度，镀层磷含量达１０．４８ｗｔ％，结构组织仍为非晶态。其镀层的性能与８０℃施镀的化学镀镀层性能相当。     

Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Plasma Graft Copolymerization and UV‐induced Graft Copolymerization with 4‐Vinylpyridine

Surface modification of two types of fluorinated polyimide (FPI) films, either by plasma polymerization and deposition of 4‐vinylpyridine (4VP) or by UV‐induced graft copolymerization with 4VP under atmospheric conditions, was carried out for adhesion enhancement with the electrolessly deposited copper. X‐ray photoelectron spectroscopy (XPS) and Fourier transform infrared (FTIR) results revealed that the pyridine groups in the plasma polymerized 4VP (pp‐4VP) layer could be preserved to a large extent under proper glow discharge conditions. The grafted 4VP layer with well‐preserved pyridine groups was used not only as the chemisorption sites for the palladium complexes (without the need for prior sensitization by SnCl₂) during the electroless plating of copper, but also as an adhesion promotion layer for the electrolessly deposited copper. The T‐peel adhesion strength of the electrolessly deposited copper with both the 4VP plasma‐polymerized FPI (pp‐4VP‐FPI) film and the 4VP graft‐copolymerized FPI (4VP‐g‐FPI) film was much higher than that of the electrolessly deposited copper with the pristine or the Ar plasma‐treated FPI films. The high adhesion strength between the electrolessly deposited copper and the surface‐modified FPI film was attributed to the fact that the plasma‐polymerized and the UV graft‐copolymerized 4VP chains were covalently tethered on the FPI surfaces, as well as the fact that these grafted 4VP polymer chains were spatially and reactively distributed into the copper matrix.

     

添加剂对镀锡引线可焊性的影响

分析了镀暗锡和光亮镀锡引线的可焊性，讨论了添加剂对镀锡引线可焊性的影响，适量的添加剂能提高引线的平整性和可焊性，获得了具有良好可焊性所需的最佳添加剂的加入量。     

Nd-Fe-B永磁体化学镀Ni-P合金工艺研究

粘结型Nd—Fe-B永磁体具有组织疏松、孔隙率高、强度低、耐热性差等特点。试验了孔隙封闭、除毛刺、边角滚光及活化除去基体氧化膜等前处理技术。研究化学镀Ni—P工艺，选择一次性化学镀Ni—P合金工艺，成功地解决了Nd—Fe-B永磁体的防腐技术问题。既简化了工艺流程，缩短了施镀时间，又降低了成本。本工艺亦适合烧结型Nd—Fe-B永磁体的防腐。     

碳酸钙粉体无钯活化化学镀银研究

采用无钯活化粉体化学镀技术制备了银包碳酸钙导电粉体.探讨了表面处理和PH值对沉积效果的影响,以及复合粒子的结合强度.通过扫描电镜(SEM),X射线能量色散谱仪(EDS)和X射线衍射(XRD)对复合粉体进行表面形貌分析和成分测试.结果表明:碳酸钙粉体经WD-50表面处理后,生成的银粒子粒径较小,对碳酸钙粒子的包覆均匀致密.随着镀液pH值的升高,银的析出量增大,粉体表观颜色变浅.调节镀液pH至13.0,得到了镀层结合强度高的银包碳酸钙复合粉体.     

Electroless nickel plating on the surface of carbon fibers

The electroless nickel plating on the surface of carbon fibers was prepared by pretreating the carbon fibers in order to increase their conductivity,and consequently enhance the EMI shielding effectiveness of the composites.The relationship between the performance of depositing coat and pH value,temperature,reaction time and the way of agitation was studied.Results show that the depositing quality is stable under pH between 4.5 and 5.0,temperature between 75 ℃ and 85 ℃,reaction time for 10 min and air agitation.The uniform and compact nickel layer deposited on carbon fibers was proved by XRD and SEM,and the electrical resistivity of carbon fibers with nickel coating was tested.Results indicate that the electrical resistivity of carbon fibers with electroless nickel plating is decreased by an order of magnitude compared with that of carbon fibers.It means that nickel coating can greatly improve the electromagnetic interference shielding properties of carbon fibers.     

基于粒子群优化的多弧离子镀膜 温度控制模糊系统

分析了多弧离子镀膜层沉积过程的特点,提出一种基于粒子群优化的PID插值自适应控制与模糊控制相结合的自适应控制算法,并用MATLAB仿真软件对控制算法进行仿真。结果表明,该控制方案简单、有效,能满足多弧离子镀膜温度控制要求。     

硬质CrN_x薄膜的高温氧化研究

利用热阴极离子镀膜技术在硬质合金上制备CrNx薄膜。在400℃-800℃区间选取7个温度对试样进行氧化处理后,通过X射线衍射仪（XRD）、扫描电镜（SEM）、自动划痕仪、精密电子天平进行成分、结构及性能分析,研究其氧化过程和性能。结果表明：在700℃以下,CrNx薄膜具有良好的抗高温氧化性。     

高速钢表面PN＋PVD复合处理工艺和性能研究

采用多弧离子镀设备,在高速钢W18Cr4V上先进行等离子氮化,再沉积TiN薄膜,研究了不同渗氮温度和时间对PN＋TiN薄膜组织和性能的影响。结果表明,温度为500℃左右和时间为2h以上条件下对W18Cr4V进行渗氮处理后再沉积TiN薄膜,可以得到最佳的薄膜表面显微硬度（1800～2000HV0.05）和膜／基结合力（50N）,涂层耐磨性也得到明显提高。